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SN55325J

Texas Instruments

SN55325J by Texas Instruments

The Texas Instruments SN55325J is a MILITARY-grade BIPOLAR IC with 16 terminals in an IN-LINE package. Operating from -55 to 125 °C, it has dual terminal positions and requires 5-24V power supply. Ideal for applications requiring high reliability and temperature resilience.

Median Price

$40.580

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 714 parts In-Stock

1+ parts

$40.580

100+ parts

$39.770

1k+ parts

$38.960

10k+ parts

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714

$40.580

$39.770

$38.960

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Distributors (In-Stock)

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Vyrian

USA . 5,486 parts In-Stock

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5,486

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Bristol Electronics

USA . 595 parts In-Stock

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595

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Digiode

USA . 144 parts In-Stock

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144

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Electronic Expediters

USA . 7 parts In-Stock

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7

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Mil-Aero Solutions, Inc.

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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AZTECH Wire

Italy . 424 parts In-Stock

1+ parts

$10.276

100+ parts

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424

$10.276

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Parana Technologies

USA . 1,374 parts In-Stock

1+ parts

$16.369

100+ parts

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$16.666

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1,374

$16.369

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$16.666

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DigiPath Technology Company

USA . 2,084 parts In-Stock

1+ parts

$18.024

100+ parts

$16.582

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2,084

$18.024

$16.582

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ChromeModa Solutions

Germany . 4,408 parts In-Stock

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$18.392

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$15.081

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4,408

$18.392

$15.081

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IDEA Electronic Components Group

UK . 1,485 parts In-Stock

1+ parts

$18.392

100+ parts

$17.472

1k+ parts

$16.553

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1,485

$18.392

$17.472

$16.553

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Ampacity Inc.

Singapore . 550 parts In-Stock

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$25.000

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550

$25.000

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One Stop Electronics

USA . 824 parts In-Stock

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$55.000

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824

$55.000

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Corphita

USA . 3,116 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 666 parts In-Stock

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666

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Kepictronics

USA . 51 parts In-Stock

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Overview

Enhance your electronic projects with the SN55325J from Texas Instruments, a high-quality Other Function Logic IC designed to deliver superior performance and reliability. With Texas Instruments' reputation for excellence in semiconductor manufacturing, you can trust that this component will meet your needs with precision. Ideal for military-grade applications, this IC operates seamlessly in extreme temperatures, offering unmatched durability and longevity. Upgrade your designs today and experience the value and benefits that only Texas Instruments can provide.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent thermal stability and high reliability, making the product suitable for military or harsh environment applications.

Power Supplies (V): 5,24

Supports dual power supplies of 5V and 24V, giving flexibility in various operating conditions or system requirements.

No. of Terminals: 16

With 16 terminals, this product offers multiple input and output options, enabling complex logic functions to be implemented efficiently.

Package Style: IN-LINE

The in-line package style saves space on the PCB and allows for efficient routing of connections, improving overall system layout.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -55 °C

The product can operate in extremely cold temperatures as low as -55°C, making it suitable for a wide range of environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in case of one terminal failure, ensuring continuous operation.

Temperature Grade: MILITARY

Designed to meet military-grade standards, ensuring ruggedness and reliability in harsh environments or challenging applications.

Technology: BIPOLAR

Bipolar technology offers high speed and low power consumption, making the product suitable for applications requiring fast logic operations.

Terminal Form: THROUGH-HOLE

Through-hole terminals simplify soldering and provide robust mechanical connections, enhancing the product's durability and ease of assembly.

Terminal Pitch: 2.54 mm

The 2.54mm terminal pitch allows for easy interface with standard connectors or breadboards, facilitating quick prototyping and testing.

Technical Specifications

Other Function Logic ICs SN55325J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN55325J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-088-1459, 5962010881459, 5962-00-321-6883, 5962003216883, 5962-01-019-8656, 5962010198656, 5962-01-073-7361, 5962010737361

NIIN

010881459, 003216883, 010198656, 010737361

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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