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SN74ALS6311AN

Texas Instruments

SN74ALS6311AN by Texas Instruments

SN74ALS6311AN by Texas Instruments is a TTL technology logic IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material, suitable for commercial-grade applications. With an operating temperature range of 0 to 70°C, it is commonly used in various other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,387 parts In-Stock

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7,387

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Digiode

USA . 2,773 parts In-Stock

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2,773

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R&J Components

USA . 72 parts In-Stock

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72

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Prism Electronics

USA . 35 parts In-Stock

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35

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Distributors (Availability)

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Parana Technologies

USA . 8 parts In-Stock

1+ parts

$9.756

100+ parts

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$10.333

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8

$9.756

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$10.333

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DigiPath Technology Company

USA . 1,692 parts In-Stock

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$10.743

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$9.883

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1,692

$10.743

$9.883

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IDEA Electronic Components Group

UK . 1,501 parts In-Stock

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$10.962

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$10.414

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$9.866

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1,501

$10.962

$10.414

$9.866

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ChromeModa Solutions

Germany . 1,416 parts In-Stock

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$10.962

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$8.989

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1,416

$10.962

$8.989

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AZTECH Wire

Italy . 643 parts In-Stock

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$13.387

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One Stop Electronics

USA . 741 parts In-Stock

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$45.000

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741

$45.000

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Corphita

USA . 2,822 parts In-Stock

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Perfect Parts

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Discover the cutting-edge SN74ALS6311AN by Texas Instruments, a high-quality Other Function Logic IC that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this product is perfect for a wide range of applications. With a nominal supply voltage of 5V and commercial temperature grade, this IC delivers exceptional value and benefits to customers looking for superior functionality and durability. Upgrade your electronic projects with the SN74ALS6311AN and experience top-of-the-line quality from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration and fitting in circuit designs without wasting space.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can withstand high temperature environments, increasing its versatility.

Technology: TTL

Using TTL technology ensures fast response times and reliable performance, making it ideal for applications requiring high-speed logic operations.

Technical Specifications

Other Function Logic ICs SN74ALS6311AN attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDIP-T20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS6311AN Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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