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SNJ55327J

Texas Instruments

SNJ55327J by Texas Instruments

SNJ55327J by Texas Instruments is a MILITARY-grade TTL IC with 16 terminals in an IN-LINE package. It operates b/w -55°C to 125°C, making it suitable for harsh environments. This RECTANGULAR CERAMIC IC is ideal for applications requiring reliable logic functions in military and industrial settings.

Median Price

$11.362

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Freelance Electronics

USA . 6 parts In-Stock

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$11.362

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$13.634

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$11.248

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Vyrian

USA . 5,504 parts In-Stock

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Digiode

USA . 2,218 parts In-Stock

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Resion

USA . 158 parts In-Stock

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Electronic Expediters

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Manoshevitz Elec. Sales

Israel . 83 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 10 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 581 parts In-Stock

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$13.122

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Parana Technologies

USA . 494 parts In-Stock

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$24.441

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$25.108

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DigiPath Technology Company

USA . 918 parts In-Stock

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$26.913

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$24.760

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ChromeModa Solutions

Germany . 5,315 parts In-Stock

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IDEA Electronic Components Group

UK . 1,182 parts In-Stock

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$27.462

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$26.089

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$24.716

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One Stop Electronics

USA . 1,423 parts In-Stock

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Corphita

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Overview

Elevate your electronic projects with the SNJ55327J by Texas Instruments, a high-quality Other Function Logic IC designed for military-grade applications. With a robust package body material of ceramic and a wide temperature range, this IC is built to withstand extreme conditions. Texas Instruments' reputation for excellence ensures top-notch performance and reliability. Whether you're working on aerospace, defense, or industrial projects, the SNJ55327J offers unmatched value and efficiency. Upgrade your designs today with this exceptional component!

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal conductivity, ensuring efficient heat dissipation and overall better performance.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures high reliability and quality of the product, suitable for demanding applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into various circuit designs and layouts, making it versatile.

No. of Terminals: 16

With 16 terminals, this product offers flexibility in connecting to other components and peripherals.

Package Style (Meter): IN-LINE

The in-line package style saves space and provides a neat and organized layout in the circuit design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product is suitable for operation in a wide range of environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for reliable operation even in extremely cold environments.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved reliability in case of connection failures.

Temperature Grade: MILITARY

Military-grade temperature grade ensures high performance and durability even in harsh conditions.

Technology: TTL

TTL technology provides fast response times, low power consumption, and compatibility with a wide range of digital systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals simplify soldering and ensure a secure connection to the PCB, enhancing overall reliability.

Terminal Pitch: 2.54 mm

With a standard terminal pitch of 2.54 mm, this product is easy to integrate into various prototyping and production processes.

Technical Specifications

Other Function Logic ICs SNJ55327J attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55327J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-053-1621, 5962010531621, 5962-01-125-7376, 5962011257376

NIIN

010531621, 011257376

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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