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SN74AUP1G57DBVRG4

Texas Instruments

SN74AUP1G57DBVRG4 by Texas Instruments

SN74AUP1G57DBVRG4 by Texas Instruments is a CMOS logic IC with 26.5ns propagation delay, 1.7A max I (ol), and 85°C max operating temp. It is used in industrial applications requiring Schmitt Trigger functionality and operates at supply voltages of 1.2V/3.3V for various digital signal processing tasks.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,372 parts In-Stock

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Digiode

USA . 1,671 parts In-Stock

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1,671

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 130 parts In-Stock

1+ parts

$7.367

100+ parts

$684.094

1k+ parts

$6.630

10k+ parts

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130

$7.367

$684.094

$6.630

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DigiPath Technology Company

USA . 35 parts In-Stock

1+ parts

$8.111

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35

$8.111

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ChromeModa Solutions

Germany . 3,057 parts In-Stock

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$8.277

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$6.787

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3,057

$8.277

$6.787

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IDEA Electronic Components Group

UK . 239 parts In-Stock

1+ parts

$8.277

100+ parts

$7.863

1k+ parts

$7.449

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239

$8.277

$7.863

$7.449

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AZTECH Wire

Italy . 462 parts In-Stock

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$17.244

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462

$17.244

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One Stop Electronics

USA . 272 parts In-Stock

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$48.000

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$48.000

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Corphita

USA . 1,148 parts In-Stock

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Overview

Discover the cutting-edge SN74AUP1G57DBVRG4 by Texas Instruments, a high-quality Other Function Logic IC that offers unparalleled performance and reliability. With a wide range of applications, this product is perfect for various electronic devices. Texas Instruments is known for its superior manufacturing standards, ensuring top-notch quality and durability. Experience the value and benefits of this product with its fast propagation delay, low power consumption, and 3-state output characteristics. Upgrade your technology with the SN74AUP1G57DBVRG4 and enjoy seamless integration and optimal performance in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and allows for a reliable performance of the product.

Propagation Delay At Nominal Supply: 26.5 ns

The low propagation delay ensures quick data transmission, making this product suitable for high-speed applications.

Surface Mount: YES

The surface mount feature makes installation easy and saves space on the circuit board.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a standard supply voltage, ensuring compatibility with various systems.

Load Capacitance (CL): 30 pF

The low load capacitance helps in reducing signal distortion and improving overall signal integrity.

Power Supplies (V): 1.2/3.3

Supports multiple power supply voltages, offering flexibility in system integration.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance state, providing versatility in circuit design.

Schmitt Trigger: YES

Incorporation of Schmitt trigger ensures noise immunity and reliable switching behavior.

Maximum Supply Voltage (Vsup): 3.6 V

With a high maximum supply voltage, the product can handle varying input voltages and operating conditions.

Technical Specifications

Other Function Logic ICs SN74AUP1G57DBVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74AUP1G57DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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