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SN74LS442FN3

Texas Instruments

SN74LS442FN3 by Texas Instruments

SN74LS442FN3 by Texas Instruments is a TTL logic IC with 20 terminals in a square chip carrier package. Operating at 5V, it has a temperature range of 0-70°C and is suitable for commercial applications requiring other function logic circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,576 parts In-Stock

1+ parts

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5,576

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Digiode

USA . 4,838 parts In-Stock

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4,838

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 385 parts In-Stock

1+ parts

$11.422

100+ parts

-

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385

$11.422

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Parana Technologies

USA . 1,703 parts In-Stock

1+ parts

$21.825

100+ parts

-

1k+ parts

$22.305

10k+ parts

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1,703

$21.825

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$22.305

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DigiPath Technology Company

USA . 2,207 parts In-Stock

1+ parts

$24.032

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2,207

$24.032

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ChromeModa Solutions

Germany . 4,769 parts In-Stock

1+ parts

$24.522

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$20.108

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4,769

$24.522

$20.108

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IDEA Electronic Components Group

UK . 1,899 parts In-Stock

1+ parts

$24.522

100+ parts

$23.296

1k+ parts

$22.070

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1,899

$24.522

$23.296

$22.070

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One Stop Electronics

USA . 1,318 parts In-Stock

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$30.000

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1,318

$30.000

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Corphita

USA . 4,191 parts In-Stock

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4,191

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Overview

Discover the unparalleled quality and reliability of the SN74LS442FN3 by Texas Instruments, a leading manufacturer in the industry. This versatile Other Function Logic IC offers endless possibilities for your electronic projects with its advanced technology and innovative design. Whether you're working on industrial automation, consumer electronics, or telecommunications, this product provides exceptional value, efficiency, and performance that will exceed your expectations. Upgrade your creations today with the SN74LS442FN3 and experience the difference that Texas Instruments can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY provides good insulation and protection for the internal components of the IC, ensuring reliable performance.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing costs.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the PCB, making it suitable for compact electronic designs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this IC compatible with standard power sources, increasing its versatility.

No. of Terminals: 20

With 20 terminals, this IC can interface with multiple external components or circuits, offering enhanced functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable operation even in demanding environmental conditions.

Technology: TTL

Using TTL technology ensures fast switching speeds and low power consumption, making this IC suitable for a wide range of applications.

Technical Specifications

Other Function Logic ICs SN74LS442FN3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-J20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

SN74LS442FN3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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