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93L38FMQB

Texas Instruments

93L38FMQB by Texas Instruments

93L38FMQB by Texas Instruments is a MIL-STD-883 screened TTL IC with 16 terminals in a flatpack package. It operates b/w -55 to 125 °C, with Vsup ranging from 4.5V to 5.5V. Ideal for military applications requiring high reliability and temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,077 parts In-Stock

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Digiode

USA . 3,695 parts In-Stock

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3,695

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Anansix

USA . 1,904 parts In-Stock

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Resion

USA . 61 parts In-Stock

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Native Components

USA . 473 parts In-Stock

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$0.458

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$0.440

473

$0.458

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$0.440

Northwest PG Solutions

USA . 642 parts In-Stock

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$0.504

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$0.445

642

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$0.445

AZTECH Wire

Italy . 476 parts In-Stock

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$9.558

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476

$9.558

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Parana Technologies

USA . 833 parts In-Stock

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$25.631

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$26.237

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833

$25.631

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$26.237

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DigiPath Technology Company

USA . 1,056 parts In-Stock

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$28.223

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$25.965

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$28.223

$25.965

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ChromeModa Solutions

Germany . 6,442 parts In-Stock

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$28.799

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$23.615

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$28.799

$23.615

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IDEA Electronic Components Group

UK . 2,201 parts In-Stock

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$28.799

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$27.359

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$25.919

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$28.799

$27.359

$25.919

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One Stop Electronics

USA . 364 parts In-Stock

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$41.000

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Corphita

USA . 1,809 parts In-Stock

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Supply Digital

USA . 1,163 parts In-Stock

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Overview

Unleash the power of innovation with the 93L38FMQB by Texas Instruments. Crafted with precision and quality, this logic IC offers unparalleled reliability and performance. From military-grade applications to cutting-edge technology, this product is a game-changer in the field. Experience the value and benefits it brings to your projects, with a wide range of advantages that cater to all your needs. Trust Texas Instruments for excellence and elevate your work to new heights with the 93L38FMQB.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy installation on circuit boards, saving time and labor during assembly.

Screening Level: MIL-STD-883

Meets stringent military standards for quality and performance, suitable for high-reliability applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems.

No. of Terminals: 16

Provides sufficient connectivity options for interfacing with other components in the circuit.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for harsh environments or industrial applications.

Minimum Operating Temperature: -55 °C

Maintains functionality even in extremely cold conditions, ensuring versatility in various operating environments.

Width: 6.604 mm

Compact size allows for space-saving installation in tight layouts or compact electronic devices.

Technology: TTL

Utilizes TTL technology known for its high speed and reliability, ensuring efficient data processing.

Technical Specifications

Other Function Logic ICs 93L38FMQB attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

93L

JESD-30 Code:

R-GDFP-F16

Length:

9.6645 mm

Logic IC Type:

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.032 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.604 mm

Trade Compliance

93L38FMQB Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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