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74AUP1G58L6X

Onsemi

74AUP1G58L6X by Onsemi

74AUP1G58L6X by Onsemi is a CMOS logic IC with 19ns propagation delay at 1.2V, suitable for industrial applications. It operates b/w -40 to 85°C, has a load capacitance of 30pF, and supports supply voltages from 0.8V to 3.6V. This Schmitt Trigger device comes in a small outline package with dual terminals for surface mount assembly.

Median Price

$0.234

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 160,000 parts In-Stock

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$0.248

160,000

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$0.248

Rochester

USA . 158,750 parts In-Stock

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-

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$0.234

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$0.194

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$0.173

158,750

-

$0.234

$0.194

$0.173

Verical

USA . 158,750 parts In-Stock

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$0.216

158,750

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$0.216

DigiKey

USA . 135,736 parts In-Stock

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$0.290

135,736

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$0.290

Mouser Electronics

USA . 2,819 parts In-Stock

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$0.169

2,819

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$0.169

Distributors (In-Stock)

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Vyrian

USA . 3,358 parts In-Stock

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$0.169

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Digiode

USA . 1,558 parts In-Stock

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$0.182

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1,558

$0.182

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Flip Electronics

USA . 160,000 parts In-Stock

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160,000

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ACDS - Activité Composants Distribution Service

France . 160,000 parts In-Stock

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Prism Electronics

USA . 715 parts In-Stock

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Corohmni

South Africa . 65 parts In-Stock

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$0.169

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65

$0.169

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Corphita

USA . 1,515 parts In-Stock

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$0.173

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Native Components

USA . 869 parts In-Stock

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$8.951

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869

$8.951

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Northwest PG Solutions

USA . 2,171 parts In-Stock

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$9.846

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$8.861

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$9.846

$8.861

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Perfect Parts

USA . 373,165 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 160,000 parts In-Stock

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Continental Prestige Electronics

USA . 140,736 parts In-Stock

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$0.196

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Glotronic Ltd.

UK . 128,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 21,438 parts In-Stock

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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TANS Electronics

Latvia . 7,950 parts In-Stock

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Problanco Electronics

Mexico . 6,309 parts In-Stock

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Microchip USA

USA . 6,028 parts In-Stock

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Assy Fe

Spain . 3,710 parts In-Stock

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SupplyDigital Components

Austria . 3,523 parts In-Stock

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Kulean Microsystems

USA . 3,487 parts In-Stock

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UHIMA Technologies

Türkiye . 694 parts In-Stock

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Supply Digital

USA . 616 parts In-Stock

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Metaverse IC Inc.

Canada . 152 parts In-Stock

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Overview

Experience quality and reliability with the 74AUP1G58L6X by Onsemi. As a leading manufacturer in the industry, Onsemi delivers superior performance and durability in their products. This logic IC is perfect for a wide range of applications, offering customers unmatched value and efficiency. Trust in Onsemi to provide you with innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the 74AUP1G58L6X by Onsemi today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Propagation Delay At Nominal Supply: 19 ns

The low propagation delay of 19 ns ensures fast signal processing, making this product suitable for high-speed applications that require quick response times.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, especially for automated assembly processes.

Nominal Supply Voltage / Vsup (V): 1.2

The low nominal supply voltage of 1.2V allows for energy-efficient operation, making this product a good choice for battery-powered devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand a wide range of environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in noisy environments.

Technical Specifications

Other Function Logic ICs 74AUP1G58L6X attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.1 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

19 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74AUP1G58L6X Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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