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NLX1G57AMX1TCG

Onsemi

NLX1G57AMX1TCG by Onsemi

NLX1G57AMX1TCG by Onsemi features 14.4ns propagation delay, 30pF load capacitance, and 8A max I (ol). Ideal for military applications, this CMOS technology IC operates b/w -55 to 125 °C with a supply voltage range of 1.65V to 5.5V.

Median Price

$0.089

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 2,979 parts In-Stock

1+ parts

$0.896

100+ parts

$0.220

1k+ parts

$0.152

10k+ parts

-

2,979

$0.896

$0.220

$0.152

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Rochester

USA . 255,000 parts In-Stock

1+ parts

-

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$0.092

1k+ parts

$0.077

10k+ parts

$0.068

255,000

-

$0.092

$0.077

$0.068

DigiKey

USA . 255,000 parts In-Stock

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$0.080

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$0.080

Verical

USA . 255,000 parts In-Stock

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$0.086

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$0.086

Distributors (In-Stock)

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Digiode

USA . 1,117 parts In-Stock

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$0.072

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Vyrian

USA . 1,378 parts In-Stock

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$0.076

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$0.076

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Distributors (Availability)

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Corphita

USA . 455 parts In-Stock

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$0.068

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455

$0.068

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Vigor

Singapore . 869 parts In-Stock

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$0.070

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869

$0.070

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Corohmni

South Africa . 193 parts In-Stock

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$0.076

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193

$0.076

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Component Stockers USA

USA . 246,519 parts In-Stock

1+ parts

$0.080

100+ parts

$0.070

1k+ parts

$0.070

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$0.070

246,519

$0.080

$0.070

$0.070

$0.070

Continental Prestige Electronics

USA . 255,000 parts In-Stock

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$0.066

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Perfect Parts

USA . 20,234 parts In-Stock

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Kulean Microsystems

USA . 5,348 parts In-Stock

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SupplyDigital Components

Austria . 3,176 parts In-Stock

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TANS Electronics

Latvia . 3,092 parts In-Stock

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Authorized Procurement Solutions

USA . 2,979 parts In-Stock

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GreenTree Electronics

Israel . 2,979 parts In-Stock

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UHIMA Technologies

Türkiye . 945 parts In-Stock

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Problanco Electronics

Mexico . 816 parts In-Stock

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Microchip USA

USA . 248 parts In-Stock

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Overview

Enhance your electronic projects with the NLX1G57AMX1TCG by Onsemi, a top-quality Other Function Logic IC that boasts fast propagation delay and low power consumption. Manufactured by the trusted brand Onsemi, this small outline, very thin profile IC is perfect for applications requiring precise signal processing and control. With a wide operating temperature range and Schmitt trigger technology, this IC offers reliable performance in military-grade environments. Experience seamless integration and superior functionality with the NLX1G57AMX1TCG from Onsemi, the ultimate solution for your logic circuit needs.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 14.4 ns

Low propagation delay ensures fast processing speed, making this product suitable for applications requiring quick response times.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and reducing overall product size.

Nominal Supply Voltage / Vsup (V): 2.3

Operates at a low nominal supply voltage, making it suitable for energy-efficient applications and reducing power consumption.

Power Supplies (V): 1.8/5

Supports multiple power supply voltages, offering flexibility in design and compatibility with various systems.

Maximum Operating Temperature: 125 °C

Withstands high operating temperatures, ensuring reliable performance in harsh environments and industrial applications.

Minimum Operating Temperature: -55 °C

Operates efficiently even in extreme cold temperatures, making it suitable for a wide range of environmental conditions.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, enhancing the overall efficiency and reliability of the product.

Technical Specifications

Other Function Logic ICs NLX1G57AMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

14.4 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G57AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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