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74LVC1G57GM,132

NXP Semiconductors

74LVC1G57GM,132 by NXP Semiconductors

NXP Semiconductors' 74LVC1G57GM,132 is a CMOS logic IC with 7.9ns propagation delay at 1.8V supply voltage. It has Schmitt Trigger feature, operates in automotive temperature grade range (-40 to 125 °C), and suitable for applications requiring fast response time in small form factor designs.

Median Price

$0.158

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 206,774 parts In-Stock

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-

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$0.164

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$0.136

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$0.121

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$0.164

$0.136

$0.121

Verical

USA . 194,996 parts In-Stock

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$0.152

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$0.152

Distributors (In-Stock)

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Digiode

USA . 4,134 parts In-Stock

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$0.059

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Nova Conductors

Japan . 10 parts In-Stock

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$0.066

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Chip Stock

USA . 84,000 parts In-Stock

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VNN

France . 34,498 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Anansix

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Semicontronic

India . 206,489 parts In-Stock

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$0.053

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$0.052

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$0.051

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Ampacity Inc.

Singapore . 108,166 parts In-Stock

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Corphita

USA . 1,764 parts In-Stock

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Continental Prestige Electronics

USA . 5,228 parts In-Stock

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$0.066

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$0.064

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Argo Parts USA

USA . 2,432 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$0.066

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$0.063

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$0.061

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$0.061

AZTECH Wire

Italy . 10,624 parts In-Stock

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$0.070

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Microchip USA

USA . 7,776 parts In-Stock

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Corohmni

South Africa . 945 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,649 parts In-Stock

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$24.790

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Supply Digital

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UNI Independent Distributors

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Overview

Discover the exceptional quality of the 74LVC1G57GM,132 by NXP Semiconductors, a leader in semiconductor innovation. This versatile Other Function Logic IC offers lightning-fast propagation delay and low power consumption, making it ideal for a wide range of applications. With a compact package design and automotive-grade temperature rating, this product provides unmatched reliability and performance. Upgrade your electronics with the 74LVC1G57GM,132 and experience the superior value and benefits that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material that is ideal for various applications.

Propagation Delay At Nominal Supply: 7.9 ns

Fast propagation delay ensures quick processing of signals.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 1.8

Low power consumption and compatibility with various systems.

Load Capacitance (CL): 50 pF

Designed to work efficiently with a specific load capacitance.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications.

Technical Specifications

Other Function Logic ICs 74LVC1G57GM,132 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

7.9 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

74LVC1G57GM,132 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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