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SN74AUP1G97YEPR

Texas Instruments

SN74AUP1G97YEPR by Texas Instruments

SN74AUP1G97YEPR by Texas Instruments features a propagation delay of 26.7ns, operates at a nominal voltage of 1.2V, and has a max I (ol) of 1.7Amp. This CMOS technology IC with Schmitt Trigger is ideal for industrial applications requiring 3-STATE output characteristics in a compact GRID ARRAY package style with very thin profile and fine pitch terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,657 parts In-Stock

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Digiode

USA . 2,083 parts In-Stock

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2,083

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Distributors (Availability)

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AZTECH Wire

Italy . 719 parts In-Stock

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$11.483

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719

$11.483

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Parana Technologies

USA . 1,427 parts In-Stock

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$12.857

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$13.335

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1,427

$12.857

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DigiPath Technology Company

USA . 2,156 parts In-Stock

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$14.157

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$13.025

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2,156

$14.157

$13.025

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ChromeModa Solutions

Germany . 1,961 parts In-Stock

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$14.446

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$11.846

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1,961

$14.446

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IDEA Electronic Components Group

UK . 900 parts In-Stock

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$14.446

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$13.724

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$13.001

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900

$14.446

$13.724

$13.001

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One Stop Electronics

USA . 1,019 parts In-Stock

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$28.000

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Corphita

USA . 2,728 parts In-Stock

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Microchip USA

USA . 124 parts In-Stock

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Overview

Discover the SN74AUP1G97YEPR by Texas Instruments, a top-tier manufacturer known for its superior quality and cutting-edge technology in the field of Other Function Logic ICs. This innovative product offers a fast propagation delay, low power consumption, and versatile applications, making it an ideal choice for a wide range of electronic projects. With a compact design and reliable performance, this logic IC provides exceptional value and efficiency to customers looking to enhance their designs with precision and speed. Experience the difference with Texas Instruments and take your projects to the next level with the SN74AUP1G97YEPR.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 26.7 ns

Low propagation delay ensures fast and efficient operation of the logic IC.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs.

Package Shape: RECTANGULAR

Rectangular package shape provides compatibility with standard PCB layouts.

Nominal Supply Voltage / Vsup (V): 1.2

Operates at a commonly used supply voltage for easy integration with other components.

Load Capacitance (CL): 30 pF

Suitable for driving typical loads while maintaining signal integrity.

Power Supplies (V): 1.2/3.3

Supports dual power supplies for versatility in different circuit configurations.

No. of Terminals: 6

A moderate number of terminals for connecting to other components in a circuit.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact package style saves space on the PCB and allows for high-density designs.

Maximum I (ol): 1.7 Amp

High output current capability for driving demanding loads.

Maximum Operating Temperature: 85 °C

Wide operating temperature range suitable for industrial use.

Output Characteristics: 3-STATE

3-state output allows for multiple logic levels and increased flexibility in circuit design.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions.

Terminal Position: BOTTOM

Bottom terminal position for easy mounting and connection on the PCB.

Maximum Seated Height: 0.5 mm

Low seated height contributes to a compact and slim design.

Width: 0.9 mm

Narrow width for space-saving integration on the PCB.

Minimum Supply Voltage (Vsup): 0.8 V

Low minimum supply voltage for compatibility with various power sources.

Length: 1.4 mm

Compact length for efficient use of PCB real estate.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments.

Schmitt Trigger: YES

Includes Schmitt trigger input for noise immunity and signal conditioning.

Technology: CMOS

CMOS technology allows for low power consumption and high noise immunity.

Terminal Form: BALL

Ball terminal form for reliable connections and easy soldering.

Packing Method: TR

TR (Tape and Reel) packing method for easy handling and automation in assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting on the PCB.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage to support a wide range of applications.

Technical Specifications

Other Function Logic ICs SN74AUP1G97YEPR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-XBGA-B6

Length:

1.4 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA6,2X3,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.5 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

SN74AUP1G97YEPR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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