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NLX1G99AMX1TCG

Onsemi

NLX1G99AMX1TCG by Onsemi

NLX1G99AMX1TCG by Onsemi is a CMOS logic IC with 25.7ns propagation delay, 50pF load capacitance, and 8A max I (ol). Ideal for military applications due to its Schmitt Trigger feature and operating temperature range of -55 to 125°C.

Median Price

$0.153

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 22,130 parts In-Stock

1+ parts

-

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$0.159

1k+ parts

$0.132

10k+ parts

$0.117

22,130

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$0.159

$0.132

$0.117

Verical

USA . 22,130 parts In-Stock

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$0.147

22,130

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$0.147

Distributors (In-Stock)

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.116

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300

$0.116

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Digiode

USA . 439 parts In-Stock

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$0.124

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439

$0.124

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J2 Sourcing AB

Sweden . 15,000 parts In-Stock

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Vyrian

USA . 2,414 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,005 parts In-Stock

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$0.111

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$0.111

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Netroflash

USA . 1,000 parts In-Stock

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$0.116

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$0.114

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$0.116

$0.114

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Corphita

USA . 1,403 parts In-Stock

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$0.117

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$0.117

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Vigor

Singapore . 619 parts In-Stock

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$0.120

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619

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Corohmni

South Africa . 445 parts In-Stock

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$0.130

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AZTECH Wire

Italy . 61 parts In-Stock

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$10.520

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Continental Prestige Electronics

USA . 22,130 parts In-Stock

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$0.113

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Problanco Electronics

Mexico . 8,108 parts In-Stock

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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SupplyDigital Components

Austria . 7,847 parts In-Stock

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Kulean Microsystems

USA . 4,496 parts In-Stock

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TANS Electronics

Latvia . 2,798 parts In-Stock

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UHIMA Technologies

Türkiye . 809 parts In-Stock

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809

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Microchip USA

USA . 427 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the NLX1G99AMX1TCG by Onsemi. Crafted with precision and expertise, this product from the industry-leading manufacturer Onsemi falls under the category of Other Function Logic ICs. Boasting a wide range of applications, this product promises reliability and efficiency in every use. With a nominal supply voltage of 2.5V and a maximum seated height of just 0.55mm, this product offers unparalleled performance and compact design. Elevate your projects with the NLX1G99AMX1TCG and experience seamless integration and top-notch results like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body offers durability and protection for the internal components of the IC.

Propagation Delay At Nominal Supply: 25.7 ns

The low propagation delay ensures fast signal processing, making this IC suitable for applications requiring quick response times.

Surface Mount: YES

Being surface mount compatible makes installation of this IC easier and more convenient, especially in compact electronic devices.

Power Supplies (V): 1.8/5

The dual power supply options of 1.8V and 5V provide flexibility in voltage requirements for different applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance for reliable connections.

Temperature Grade: MILITARY

The military-grade temperature tolerance ensures reliable performance in a wide range of operating conditions, making this IC suitable for demanding environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this IC energy efficient and reliable in noisy environments.

Technical Specifications

Other Function Logic ICs NLX1G99AMX1TCG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

1G

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

1.95 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

25.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX1G99AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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