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NC7SV58FHX

Onsemi

NC7SV58FHX by Onsemi

The Onsemi NC7SV58FHX is a CMOS logic IC with 31ns propagation delay, operating at 1.1V nominal voltage. Ideal for industrial applications, it features Schmitt Trigger technology and can handle load capacitance of 15pF. With a small outline package style and dual terminal position, it is suitable for surface mount assembly.

Median Price

$0.213

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 495,154 parts In-Stock

1+ parts

-

100+ parts

$0.213

1k+ parts

$0.177

10k+ parts

$0.158

495,154

-

$0.213

$0.177

$0.158

DigiKey

USA . 494,969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.280

494,969

-

-

-

$0.280

Verical

USA . 170,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.197

170,000

-

-

-

$0.197

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,382 parts In-Stock

1+ parts

$0.174

100+ parts

-

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1,382

$0.174

-

-

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Vyrian

USA . 1,514 parts In-Stock

1+ parts

$0.183

100+ parts

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1,514

$0.183

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-

Chip Stock

USA . 508,500 parts In-Stock

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508,500

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-

-

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Sensible Micro Corp

USA . 14,586 parts In-Stock

1+ parts

-

100+ parts

$0.137

1k+ parts

$0.126

10k+ parts

-

14,586

-

$0.137

$0.126

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 128 parts In-Stock

1+ parts

$0.137

100+ parts

-

1k+ parts

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128

$0.137

-

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-

Corphita

USA . 2,797 parts In-Stock

1+ parts

$0.165

100+ parts

-

1k+ parts

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10k+ parts

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2,797

$0.165

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 16,425 parts In-Stock

1+ parts

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16,425

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Problanco Electronics

Mexico . 7,140 parts In-Stock

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7,140

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Kepictronics

USA . 5,000 parts In-Stock

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5,000

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Microchip USA

USA . 4,914 parts In-Stock

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4,914

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Kulean Microsystems

USA . 4,122 parts In-Stock

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4,122

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TANS Electronics

Latvia . 2,217 parts In-Stock

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2,217

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SupplyDigital Components

Austria . 2,110 parts In-Stock

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2,110

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Supply Digital

USA . 1,175 parts In-Stock

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1,175

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UHIMA Technologies

Türkiye . 857 parts In-Stock

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857

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Overview

Discover the cutting-edge technology of the Onsemi NC7SV58FHX, a high-quality Other Function Logic IC designed to exceed your expectations. With a compact design and superior performance, this product is perfect for a wide range of applications. From industrial automation to consumer electronics, this versatile IC offers unmatched reliability and efficiency. Trust in Onsemi's reputation for excellence and elevate your projects with the NC7SV58FHX. Experience the value and benefits that this innovative product brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Propagation Delay At Nominal Supply: 31 ns

Low propagation delay ensures fast operation and high performance of the logic IC.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and effort.

Nominal Supply Voltage / Vsup (V): 1.1

Low supply voltage helps in reducing power consumption and heat generation, increasing energy efficiency.

Technology: CMOS

CMOS technology offers high noise immunity, low power consumption, and high speed operation, making it a reliable choice for logic ICs.

Technical Specifications

Other Function Logic ICs NC7SV58FHX attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

AUP/ULP/V

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

2 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

31 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.55 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1 mm

Trade Compliance

NC7SV58FHX Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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