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SN74LVC1G57DBVRG4

Texas Instruments

SN74LVC1G57DBVRG4 by Texas Instruments

SN74LVC1G57DBVRG4 by Texas Instruments is a CMOS logic IC with 6.3 ns propagation delay at 1.8V, suitable for automotive applications. It features Schmitt Trigger, operates b/w -40 to 125 °C, and has a load capacitance of 50 pF. This small outline package with dual terminals is surface mountable and supports a supply voltage range of 1.65V to 5.5V.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,974 parts In-Stock

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Digiode

USA . 2,853 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Advanced Electronics

New Zealand . 500 parts In-Stock

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$9.282

100+ parts

$8.818

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$8.818

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500

$9.282

$8.818

$8.818

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Parana Technologies

USA . 845 parts In-Stock

1+ parts

$13.390

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$13.908

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845

$13.390

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$13.908

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DigiPath Technology Company

USA . 1,762 parts In-Stock

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$14.744

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$13.565

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ChromeModa Solutions

Germany . 4,502 parts In-Stock

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$15.045

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$12.337

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$15.045

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IDEA Electronic Components Group

UK . 925 parts In-Stock

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$15.045

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$14.293

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$13.540

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925

$15.045

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$13.540

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AZTECH Wire

Italy . 727 parts In-Stock

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$17.171

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One Stop Electronics

USA . 1,645 parts In-Stock

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$29.000

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Corohmni

South Africa . 172 parts In-Stock

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$32.486

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Ampacity Inc.

Singapore . 1,556 parts In-Stock

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$41.000

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Semicontronic

India . 911 parts In-Stock

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$46.000

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$44.850

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$44.620

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Corphita

USA . 4,955 parts In-Stock

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Continental Prestige Electronics

USA . 2,327 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Enhance your electronic projects with the SN74LVC1G57DBVRG4 by Texas Instruments, a top-quality Other Function Logic IC perfect for various applications. With Texas Instruments' reputation for innovation and reliability, you can trust in the performance of this product. Experience fast propagation delay, low power consumption, and versatile mounting options, making it ideal for automotive-grade projects. Get more value with its compact design, wide supply voltage range, and Schmitt trigger technology, providing you with efficient and reliable results every time. Upgrade your projects today with the SN74LVC1G57DBVRG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, making it suitable for various applications.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay ensures quick response time, enhancing the performance of the IC.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Operates efficiently at a low supply voltage, reducing power consumption.

Load Capacitance (CL): 50 pF

Optimized for a specific load capacitance, ensuring reliable operation.

Power Supplies (V): 3.3

Compatible with common power supply voltages, increasing versatility.

No. of Terminals: 6

Simplifies the interface with other components, making it easier to integrate into a circuit.

Maximum I (ol): 24 Amp

Capable of handling high output currents, suitable for demanding applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Operates reliably in extreme cold conditions, ensuring performance in various environments.

Technical Specifications

Other Function Logic ICs SN74LVC1G57DBVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.45 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.6 mm

Trade Compliance

SN74LVC1G57DBVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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