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SNJ55325W

Texas Instruments

SNJ55325W by Texas Instruments

SNJ55325W by Texas Instruments is a MILITARY-grade BIPOLAR logic IC with 16 terminals, operating b/w -55 to 125 °C. It has power supplies of 5V and 24V, suitable for applications requiring high-temperature resistance and reliability in harsh environments. This RECTANGULAR FLATPACK package is ideal for aerospace and defense electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,279 parts In-Stock

1+ parts

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6,279

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Digiode

USA . 2,572 parts In-Stock

1+ parts

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2,572

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$5.373

100+ parts

-

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212

$5.373

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One Stop Electronics

USA . 1,562 parts In-Stock

1+ parts

$10.000

100+ parts

-

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1,562

$10.000

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Parana Technologies

USA . 1,075 parts In-Stock

1+ parts

$11.271

100+ parts

-

1k+ parts

$11.703

10k+ parts

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1,075

$11.271

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$11.703

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DigiPath Technology Company

USA . 1,853 parts In-Stock

1+ parts

$12.411

100+ parts

$11.418

1k+ parts

-

10k+ parts

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1,853

$12.411

$11.418

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ChromeModa Solutions

Germany . 6,252 parts In-Stock

1+ parts

$12.664

100+ parts

$10.384

1k+ parts

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10k+ parts

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6,252

$12.664

$10.384

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IDEA Electronic Components Group

UK . 1,664 parts In-Stock

1+ parts

$12.664

100+ parts

$12.031

1k+ parts

$11.398

10k+ parts

-

1,664

$12.664

$12.031

$11.398

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Corphita

USA . 1,342 parts In-Stock

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1,342

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Overview

Elevate your electronic projects with the SNJ55325W by Texas Instruments, a premium quality Other Function Logic IC designed to exceed your expectations. With a history of innovation and reliability, Texas Instruments delivers cutting-edge solutions for a wide range of applications. Whether you're a seasoned engineer or a hobbyist looking to explore new possibilities, this product offers unparalleled value, performance, and versatility. Experience the difference with Texas Instruments and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package provides excellent thermal performance and durability, making it suitable for high temperature and harsh environments.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB assembly, saving space and reducing manufacturing costs.

Screening Level: 38535Q/M;38534H;883B

Compliance with screening standards ensures high reliability and quality of the product, suitable for critical applications.

Power Supplies (V): 5,24

Supports a wide range of power supply voltages, providing flexibility in different application scenarios.

No. of Terminals: 16

Having a sufficient number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): FLATPACK

Flatpack package style provides a low profile and compact design, making it ideal for space-constrained applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures reliable performance in extreme heat conditions.

Minimum Operating Temperature: -55 °C

Wide range of operating temperatures allows for operation in cold environments, expanding the product's usability.

Terminal Position: DUAL

Dual terminal position offers redundancy and flexibility in circuit design and connection, enhancing reliability.

Temperature Grade: MILITARY

Military-grade temperature rating ensures ruggedness and reliability in demanding military and aerospace applications.

Technology: BIPOLAR

Bipolar technology provides high speed and precision, making it suitable for applications requiring fast and accurate signal processing.

Terminal Form: FLAT

Flat terminal form allows for easy soldering and connection, simplifying the assembly process.

Terminal Pitch: 1.27 mm

Fine terminal pitch enables high-density packaging and interconnection on the PCB, maximizing space efficiency.

Technical Specifications

Other Function Logic ICs SNJ55325W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-XDFP-F16

Logic IC Type:

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,24

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

SNJ55325W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-180-8298, 5962011808298

NIIN

011808298

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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