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TPIC6B259DWG4

Texas Instruments

TPIC6B259DWG4 by Texas Instruments

TPIC6B259DWG4 by Texas Instruments is a small outline logic IC with 20 terminals, operating temperature range of -40 to 125°C. It has inverted output polarity and open-drain characteristics, suitable for automotive applications due to its nickel palladium gold terminal finish and peak reflow temperature of 260°C.

Median Price

$1.720

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 550 parts In-Stock

1+ parts

$3.010

100+ parts

$1.820

1k+ parts

$1.650

10k+ parts

$1.600

550

$3.010

$1.820

$1.650

$1.600

Rochester

USA . 52,392 parts In-Stock

1+ parts

-

100+ parts

$1.450

1k+ parts

$1.300

10k+ parts

$1.220

52,392

-

$1.450

$1.300

$1.220

DigiKey

USA . 52,392 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.910

10k+ parts

-

52,392

-

-

$1.910

-

Verical

USA . 52,300 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.625

10k+ parts

$1.525

52,300

-

-

$1.625

$1.525

Avnet

USA . 7,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.061

10k+ parts

$1.009

7,250

-

-

$1.061

$1.009

Chip1Stop

Japan . 125 parts In-Stock

1+ parts

-

100+ parts

$1.815

1k+ parts

-

10k+ parts

-

125

-

$1.815

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,304 parts In-Stock

1+ parts

$1.216

100+ parts

-

1k+ parts

-

10k+ parts

-

1,304

$1.216

-

-

-

Vyrian

USA . 1,236 parts In-Stock

1+ parts

$1.280

100+ parts

-

1k+ parts

-

10k+ parts

-

1,236

$1.280

-

-

-

NexGen Digital

USA . 925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

925

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,287 parts In-Stock

1+ parts

$1.152

100+ parts

-

1k+ parts

-

10k+ parts

-

3,287

$1.152

-

-

-

Parana Technologies

USA . 989 parts In-Stock

1+ parts

$18.352

100+ parts

-

1k+ parts

$18.479

10k+ parts

-

989

$18.352

-

$18.479

-

DigiPath Technology Company

USA . 1,364 parts In-Stock

1+ parts

$20.208

100+ parts

$18.591

1k+ parts

-

10k+ parts

-

1,364

$20.208

$18.591

-

-

ChromeModa Solutions

Germany . 798 parts In-Stock

1+ parts

$20.620

100+ parts

$16.908

1k+ parts

-

10k+ parts

-

798

$20.620

$16.908

-

-

IDEA Electronic Components Group

UK . 54 parts In-Stock

1+ parts

$20.620

100+ parts

$19.589

1k+ parts

$18.558

10k+ parts

-

54

$20.620

$19.589

$18.558

-

Perfect Parts

USA . 2,159 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,159

-

-

-

-

Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,000

-

-

-

-

Overview

Unlock the potential of your electronic projects with the TPIC6B259DWG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers high-quality products that are reliable and efficient. This Other Function Logic IC is perfect for a wide range of applications, offering flexibility and versatility to suit your needs. With features like a small outline package style and inverted output polarity, this IC provides value and benefits that will take your projects to the next level. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides good protection and durability for the internal components of the IC, ensuring reliability in various applications.

Surface Mount: YES

Being surface mountable makes it easier for the IC to be assembled onto PCBs using automated processes, saving time and labor costs.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage of 5V makes it compatible with many existing electronic systems and power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions and high temperature applications.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics provide flexibility in connecting to different types of devices and circuits, enhancing compatibility and versatility.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets industry standards for temperature performance and reliability in vehicles.

Technical Specifications

Other Function Logic ICs TPIC6B259DWG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

6B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

TPIC6B259DWG4 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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