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SN74LS444N1

Texas Instruments

SN74LS444N1 by Texas Instruments

SN74LS444N1 by Texas Instruments is a TTL technology logic IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. This IC is commonly used in commercial applications requiring dual terminal positions and operates within a temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,812 parts In-Stock

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5,812

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Digiode

USA . 3,652 parts In-Stock

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3,652

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 356 parts In-Stock

1+ parts

$13.858

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356

$13.858

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Parana Technologies

USA . 1,354 parts In-Stock

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$29.350

100+ parts

-

1k+ parts

$58.345

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1,354

$29.350

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$58.345

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DigiPath Technology Company

USA . 599 parts In-Stock

1+ parts

$32.318

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599

$32.318

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ChromeModa Solutions

Germany . 3,374 parts In-Stock

1+ parts

$32.978

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$27.042

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3,374

$32.978

$27.042

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IDEA Electronic Components Group

UK . 1,356 parts In-Stock

1+ parts

$32.978

100+ parts

$31.329

1k+ parts

$29.680

10k+ parts

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1,356

$32.978

$31.329

$29.680

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One Stop Electronics

USA . 1,447 parts In-Stock

1+ parts

$35.000

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1,447

$35.000

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Corphita

USA . 4,148 parts In-Stock

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4,148

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Overview

Upgrade your electronic projects with the SN74LS444N1 by Texas Instruments, a high-quality Other Function Logic IC that promises reliability and efficiency. Manufactured by industry leader Texas Instruments, this IC offers unmatched performance and versatility for a wide range of applications. With a nominal supply voltage of 5V and commercial-grade temperature tolerance, this IC is perfect for your next project. Say goodbye to compatibility issues and hello to seamless integration with the SN74LS444N1. Elevate your designs with this innovative solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making this product suitable for various environments.

Nominal Supply Voltage / Vsup (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

No. of Terminals: 20

Having 20 terminals allows for versatility and flexibility in connecting to other components, enabling complex logic operations to be performed effectively.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this product can function reliably in a wide range of temperature conditions.

Technology: TTL

The use of TTL technology ensures fast and reliable digital logic operations, making this product ideal for applications requiring high-speed processing.

Terminal Pitch: 2.54 mm

The terminal pitch of 2.54 mm allows for easy integration and connection to standard breadboards or PCBs, simplifying the prototyping and development process.

Technical Specifications

Other Function Logic ICs SN74LS444N1 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS444N1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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