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NBSG86AMNHTBG

Onsemi

NBSG86AMNHTBG by Onsemi

NBSG86AMNHTBG by Onsemi is a high-speed logic IC with a propagation delay of 0.22 ns, suitable for industrial applications. It operates at a nominal voltage of 2.5V and has a max power supply current of 39mA. This surface-mount chip carrier package features ECL technology and can withstand temperatures from -40 to 85 °C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,258 parts In-Stock

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Digiode

USA . 2,029 parts In-Stock

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AZTECH Wire

Italy . 271 parts In-Stock

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$21.910

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Ampacity Inc.

Singapore . 1,035 parts In-Stock

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$34.000

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Component Stockers USA

USA . 474 parts In-Stock

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$99.990

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Kulean Microsystems

USA . 6,928 parts In-Stock

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TANS Electronics

Latvia . 2,736 parts In-Stock

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Corphita

USA . 1,495 parts In-Stock

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Problanco Electronics

Mexico . 908 parts In-Stock

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SupplyDigital Components

Austria . 841 parts In-Stock

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UHIMA Technologies

Türkiye . 326 parts In-Stock

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Corohmni

South Africa . 223 parts In-Stock

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Microchip USA

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Overview

Enhance your electronic projects with the NBSG86AMNHTBG by Onsemi, a top-of-the-line Other Function Logic IC designed for optimal performance and precision. With a lightning-fast propagation delay of only 0.22 ns and a wide operating temperature range of -40 to 85 °C, this chip is perfect for industrial applications that demand high-speed data processing. The chip carrier package shape and nickel gold palladium terminal finish ensure durability and reliability, while the low power supply current of 39 mA makes it an energy-efficient choice. Elevate your designs with the unmatched quality and cutting-edge technology of Onsemi's NBSG86AMNHTBG.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 0.22 ns

With a very fast propagation delay, this product is ideal for high-speed applications and can provide quick response times.

Surface Mount: YES

Being surface mount compatible makes this product easy to integrate onto circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 2.5

The 2.5V supply voltage is common and widely available, ensuring compatibility with a variety of systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand tough industrial environments without overheating.

Minimum Operating Temperature: -40 °C

The product can operate in extremely low temperatures, making it suitable for a wide range of environments and applications.

Technical Specifications

Other Function Logic ICs NBSG86AMNHTBG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Additional Features:

NECL MODE: VCC = 0V WITH VEE = -2.375V TO -3.465V

Family:

86

JESD-30 Code:

S-XQCC-N16

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-2.5/+-3.3

Maximum Power Supply Current (ICC):

39 mA

Propagation Delay At Nominal Supply:

.22 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

2.375 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NBSG86AMNHTBG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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