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MC14490FG

Onsemi

MC14490FG by Onsemi

MC14490FG by Onsemi is a 6-function logic IC with 4 bits, operating at 5V. It has a propagation delay of 740ns and can withstand temperatures from -55 to 125°C. Ideal for military-grade applications requiring small outline packages and true output polarity.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 4,806 parts In-Stock

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Digiode

USA . 1,452 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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Semtec, LLC

USA . 46 parts In-Stock

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AZTECH Wire

Italy . 656 parts In-Stock

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$10.321

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656

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Aztec Data Supply Inc.

USA . 3,320 parts In-Stock

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$24.600

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Ampacity Inc.

Singapore . 789 parts In-Stock

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$50.000

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Component Stockers USA

USA . 578 parts In-Stock

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$99.990

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TANS Electronics

Latvia . 6,586 parts In-Stock

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Continental Prestige Electronics

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SupplyDigital Components

Austria . 5,610 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 2,814 parts In-Stock

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Argo Parts USA

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Perfect Parts

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Microchip USA

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Corphita

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Corohmni

South Africa . 150 parts In-Stock

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Aranea Global

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UHIMA Technologies

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Overview

Discover the innovative MC14490FG by Onsemi, a cutting-edge Other Function Logic IC designed to deliver exceptional performance and reliability. With Onsemi's reputation for top-notch quality and precision engineering, this versatile product is ideal for a wide range of applications. Offering seamless integration, superior functionality, and efficient operation, the MC14490FG is the perfect choice for customers seeking high-quality solutions that provide unmatched value and benefits. Experience the difference with Onsemi's MC14490FG - where quality meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable, this IC can be easily integrated onto PCBs, saving space and simplifying assembly processes.

No. of Functions: 6

With 6 functions in one package, this IC offers increased functionality and versatility for complex electronic designs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient usage of board space and easy placement within circuit layouts.

No. of Bits: 4

With 4 bits, this IC is capable of processing and storing digital information, suitable for moderate complexity applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal voltage of 5V, this IC is compatible with standard power supply systems, ensuring reliable performance.

Power Supplies (V): 5/15

Supporting multiple power supply options of 5V and 15V, this IC can be used in a diverse range of electronic systems.

No. of Terminals: 16

With 16 terminals, this IC allows for ample connectivity options, enabling seamless integration into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it ideal for compact electronic devices.

Propagation Delay (tpd): 740 ns

With a low propagation delay of 740 ns, this IC can process signals quickly, enhancing overall system efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in demanding thermal environments.

Minimum Operating Temperature: -55 °C

Operating down to -55°C, this IC is suitable for use in extreme temperature conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options, accommodating different PCB layouts.

Maximum Seated Height: 2.05 mm

With a low maximum seated height of 2.05 mm, this IC is suitable for slim-profile electronic devices.

Width: 5.275 mm

The narrow width of 5.275 mm allows for efficient space utilization on the PCB, ideal for compact designs.

Output Polarity: TRUE

The true output polarity ensures accurate signal processing, preventing errors in data transmission.

Minimum Supply Voltage (Vsup): 3 V

Operating at a minimum supply voltage of 3V, this IC offers flexibility in power requirements for various applications.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this IC is easy to solder and install.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures reliable soldering and thermal stability during assembly processes.

Length: 10.2 mm

The compact length of 10.2 mm allows for efficient use of board space, ideal for densely populated PCBs.

Temperature Grade: MILITARY

Designed to meet military-grade specifications, this IC offers high reliability and performance in harsh environments.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption and high noise immunity, ideal for battery-powered devices.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, ensuring secure connections on the PCB.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27 mm, this IC allows for easy connections and routing of signals on the PCB.

Count Direction: RIGHT

The right count direction simplifies signal processing and data interpretation in electronic systems.

Minimum fmax: 4.5 MHz

Operating at a minimum frequency of 4.5 MHz, this IC offers fast data processing capabilities suitable for various applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this IC can withstand moderate moisture exposure, ensuring reliability in humid environments.

Maximum Supply Voltage (Vsup): 18 V

Operating at a maximum supply voltage of 18V, this IC is compatible with a wide range of power sources, offering versatility in design options.

Technical Specifications

Other Function Logic ICs MC14490FG attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Count Direction:

RIGHT

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

3

No. of Bits:

4

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay (tpd):

740 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.275 mm

Minimum fmax:

4.5 MHz

Trade Compliance

MC14490FG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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