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NL7SZ98DBVT1G

Onsemi

NL7SZ98DBVT1G by Onsemi

NL7SZ98DBVT1G by Onsemi is a CMOS logic IC with 6 terminals, Vsup range of 1.65V to 5.5V, and operating temp from -55°C to 125°C. Its small outline package makes it suitable for military-grade applications requiring compact design and high reliability in harsh environments.

Median Price

$0.034

Lifecycle Status

EOL

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 174,000 parts In-Stock

1+ parts

-

100+ parts

$0.034

1k+ parts

$0.028

10k+ parts

$0.025

174,000

-

$0.034

$0.028

$0.025

Verical

USA . 174,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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174,000

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Distributors (In-Stock)

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Digiode

USA . 2,210 parts In-Stock

1+ parts

$0.027

100+ parts

-

1k+ parts

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10k+ parts

-

2,210

$0.027

-

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Flip Electronics

USA . 18,000 parts In-Stock

1+ parts

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18,000

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Vyrian

USA . 4,278 parts In-Stock

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4,278

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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-

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-

Distributors (Availability)

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Ampacity Inc.

Singapore . 173,986 parts In-Stock

1+ parts

$0.024

100+ parts

-

1k+ parts

-

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173,986

$0.024

-

-

-

Corphita

USA . 2,263 parts In-Stock

1+ parts

$0.025

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-

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2,263

$0.025

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Corohmni

South Africa . 265 parts In-Stock

1+ parts

$0.028

100+ parts

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265

$0.028

-

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Vigor

Singapore . 766 parts In-Stock

1+ parts

$0.210

100+ parts

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766

$0.210

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AZTECH Wire

Italy . 80 parts In-Stock

1+ parts

$20.880

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80

$20.880

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Aztec Data Supply Inc.

USA . 567 parts In-Stock

1+ parts

$30.128

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567

$30.128

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SupplyDigital Components

Austria . 4,024 parts In-Stock

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4,024

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Kulean Microsystems

USA . 3,295 parts In-Stock

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3,295

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Continental Prestige Electronics

USA . 2,051 parts In-Stock

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2,051

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Problanco Electronics

Mexico . 1,261 parts In-Stock

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1,261

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TANS Electronics

Latvia . 1,085 parts In-Stock

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1,085

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Argo Parts USA

USA . 1,074 parts In-Stock

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1,074

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Advanced Electronics

New Zealand . 900 parts In-Stock

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900

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Microchip USA

USA . 351 parts In-Stock

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351

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UHIMA Technologies

Türkiye . 242 parts In-Stock

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242

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Overview

Discover the innovative NL7SZ98DBVT1G by Onsemi, a high-quality Other Function Logic IC that offers reliability and performance like no other. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With a compact design, wide operating temperature range, and advanced CMOS technology, this IC delivers exceptional value to customers looking for superior quality and functionality. Upgrade your projects with the NL7SZ98DBVT1G and experience the benefits of top-notch performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product durable and cost-effective.

Surface Mount: YES

Being surface mountable makes this product easy to install and saves space on the PCB.

Package Shape: RECTANGULAR

The rectangular shape of the package provides ease of handling and placement during assembly.

Nominal Supply Voltage / Vsup (V): 3.3

With a nominal supply voltage of 3.3V, this IC is suitable for a wide range of applications.

No. of Terminals: 6

The 6 terminals offer flexibility in connection options for different circuit requirements.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE

The small outline and thin profile package style helps in compact PCB design.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this IC is suitable for high-temperature environments.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55°C makes this product versatile in various settings.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and solderability for reliable connections.

Terminal Position: DUAL

The dual terminal position allows for better stability and reliability in the circuit.

Maximum Seated Height: 1.1 mm

The low seated height of 1.1mm helps in reducing overall profile and space requirements.

Width: 1.5 mm

The compact width of 1.5mm enables tighter component placement on the PCB.

Minimum Supply Voltage (Vsup): 1.65 V

With a minimum supply voltage of 1.65V, this IC can operate efficiently even at low voltages.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30s ensures proper soldering and assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for reliable solder joints during assembly.

Length: 3 mm

The length of 3mm contributes to the overall compactness and space-saving design of the product.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliability and performance in harsh operating conditions.

Technology: CMOS

The CMOS technology used in this IC offers low power consumption and high noise immunity.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during assembly.

Packing Method: TR

The tape and reel packing method offers convenience and protection during transport and storage.

Terminal Pitch: 0.95 mm

The terminal pitch of 0.95mm allows for precise and secure connections on the PCB.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5V, this IC can handle higher voltage requirements in various applications.

Technical Specifications

Other Function Logic ICs NL7SZ98DBVT1G attributes and parameters. Explore more Other Function Logic ICs devices from Onsemi

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSOP6,.11,37

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.5 mm

Trade Compliance

NL7SZ98DBVT1G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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