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SN74ALVTH16260DL

Texas Instruments

SN74ALVTH16260DL by Texas Instruments

SN74ALVTH16260DL by Texas Instruments is a BICMOS technology logic IC with 56 terminals in a small outline package. It operates b/w -40 to 85°C, suitable for industrial applications. With power supplies of 2.5/3.3V, it is ideal for surface mount designs requiring high-speed signal transmission.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,892 parts In-Stock

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3,892

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Vyrian

USA . 1,235 parts In-Stock

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1,235

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 612 parts In-Stock

1+ parts

$7.365

100+ parts

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612

$7.365

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One Stop Electronics

USA . 1,497 parts In-Stock

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$12.000

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1,497

$12.000

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Parana Technologies

USA . 19 parts In-Stock

1+ parts

$19.625

100+ parts

$1,822.515

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$17.663

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19

$19.625

$1,822.515

$17.663

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$21.610

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2,301

$21.610

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ChromeModa Solutions

Germany . 3,425 parts In-Stock

1+ parts

$22.051

100+ parts

$18.082

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3,425

$22.051

$18.082

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IDEA Electronic Components Group

UK . 1,965 parts In-Stock

1+ parts

$22.051

100+ parts

$20.948

1k+ parts

$19.846

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1,965

$22.051

$20.948

$19.846

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Corphita

USA . 3,677 parts In-Stock

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3,677

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Overview

Elevate your design with the SN74ALVTH16260DL by Texas Instruments, a top-quality Other Function Logic IC that offers exceptional performance and reliability. Manufactured by industry leader Texas Instruments, this IC is perfect for a wide range of applications. With its advanced technology and durable construction, it provides value and benefits that customers can trust. Upgrade your projects with the SN74ALVTH16260DL and experience the advantages it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can protect the internal components of the IC from external elements, ensuring reliability and longevity.

Surface Mount: YES

Surface mount technology allows for easy assembly onto circuit boards, making the integration of this IC into electronic devices more efficient.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and facilitates easy placement and mounting on circuit boards.

Power Supplies (V): 2.5/3.3

Support for multiple power supply voltages allows flexibility in design and compatibility with various systems.

No. of Terminals: 56

Having 56 terminals provides ample connectivity options for interfacing with other components and systems.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline with shrink pitch design saves space on the PCB and enhances overall circuit board density.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures stable performance even under demanding industrial conditions.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in extreme environments without compromising performance.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in connectivity.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures that the IC can withstand harsh operating conditions commonly found in industrial settings.

Technology: BICMOS

BICMOS technology combines the advantages of both bipolar and CMOS technologies, offering high performance and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form is well-suited for surface mount applications, providing strong mechanical connections and ease of soldering.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise placement and soldering, crucial for high-density circuit board designs.

Technical Specifications

Other Function Logic ICs SN74ALVTH16260DL attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDSO-G56

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP56,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

SN74ALVTH16260DL Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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