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SSTUM32866EC/G,518

NXP Semiconductors

SSTUM32866EC/G,518 by NXP Semiconductors

SSTUM32866EC/G,518 from NXP Semiconductors is a surface-mount logic IC with a 1.8V supply voltage and 96 terminals in a fine pitch grid array. It operates b/w 0 °C to 70 °C, making it ideal for commercial applications. Its plastic/epoxy package ensures durability in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,997 parts In-Stock

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1,997

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Anansix

USA . 985 parts In-Stock

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985

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Digiode

USA . 659 parts In-Stock

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659

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Distributors (Availability)

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One Stop Electronics

USA . 888 parts In-Stock

1+ parts

$34.000

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888

$34.000

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Corphita

USA . 857 parts In-Stock

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857

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UNI Independent Distributors

Spain . 84 parts In-Stock

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84

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Overview

Unlock unparalleled performance with the SSTUM32866EC/G,518 from NXP Semiconductors, a leader in innovative technology. This high-quality logic IC is designed for reliability and efficiency, making it ideal for a wide range of applications—from consumer electronics to industrial systems. With its compact packaging and robust features, enjoy peace of mind knowing you’re investing in a product that enhances functionality while optimizing power consumption. Elevate your designs today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and reliability while being lightweight, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mountable enhances installation efficiency and reduces space requirements on the PCB.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient layout on PCBs, optimizing space and enabling better thermal management.

Nominal Supply Voltage / Vsup (V): 1.8

The low nominal supply voltage of 1.8V is ideal for battery-powered devices, providing energy efficiency and extended battery life.

Power Supplies (V): 1.8

Same as nominal supply voltage, ensuring compatibility with modern low-voltage electronic designs which helps in minimizing power consumption.

No. of Terminals: 96

A high number of terminals facilitates complex connections and high functionality, accommodating advanced circuitry.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array allows for increased pin density and improved electrical performance, making it suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is designed to perform reliably under standard operating conditions.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C ensures functionality in typical environmental conditions, making it versatile for various applications.

Terminal Position: BOTTOM

Bottom terminal positioning is advantageous for space-saving and enhances compatibility with a variety of board layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grading implies the product is suitable for general consumer electronics, ensuring reliability in everyday use.

Terminal Form: BALL

Ball terminal form improves soldering reliability and enhances electrical performance, ensuring a robust connection to the PCB.

Terminal Pitch: 0.8 mm

The 0.8 mm terminal pitch allows for denser packing of components, making it ideal for compact electronic designs without compromising performance.

Technical Specifications

Other Function Logic ICs SSTUM32866EC/G,518 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B96

Logic IC Type:

No. of Terminals:

96

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

SSTUM32866EC/G,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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