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SSTUB32866EC/S,518

NXP Semiconductors

SSTUB32866EC/S,518 by NXP Semiconductors

SSTUB32866EC/S,518 from NXP Semiconductors is a surface-mount logic IC with a 1.8V supply voltage and operates b/w 0 °C to 85 °C. It features a fine-pitch grid array with 96 terminals for compact designs. Ideal for high-density applications in consumer electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,223 parts In-Stock

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4,223

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Vyrian

USA . 4,181 parts In-Stock

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4,181

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Anansix

USA . 2,598 parts In-Stock

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2,598

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Distributors (Availability)

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One Stop Electronics

USA . 478 parts In-Stock

1+ parts

$65.000

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478

$65.000

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UNI Independent Distributors

Spain . 6,157 parts In-Stock

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Corphita

USA . 1,198 parts In-Stock

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Overview

Unlock unparalleled performance with the SSTUB32866EC/S,518 from NXP Semiconductors—your ideal choice for advanced logic applications. Renowned for their commitment to quality and innovation, NXP delivers unmatched reliability in state-of-the-art designs. This compact, surface-mount solution ensures efficient power management and seamless integration, making it perfect for next-gen electronics, automotive, and industrial applications. Elevate your projects with superior functionality and peace of mind!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and protection from environmental factors, enhancing the reliability of the IC.

Surface Mount: YES

Surface mount technology allows for compact design and efficient use of board space, making it ideal for modern electronic applications.

Package Shape: RECTANGULAR

A rectangular package shape facilitates easy integration into various circuit designs and layouts.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low supply voltage of 1.8V ensures energy efficiency, making it suitable for battery-powered applications.

Power Supplies (V): 1.8

Compatibility with a 1.8V power supply promotes lower power consumption while maintaining performance, ideal for energy-sensitive designs.

No. of Terminals: 96

With 96 terminals, this IC offers sufficient connectivity for complex functions and applications, allowing for versatile usage.

Package Style (Meter): GRID ARRAY, FINE PITCH

The fine pitch grid array package style provides a compact layout and efficient thermal performance, enhancing overall system efficiency.

Maximum Operating Temperature: 85 °C

A maximum operating temperature of 85 °C ensures reliable performance in moderate to high-temperature environments.

Minimum Operating Temperature: 0 °C

Starting operations from 0 °C allows for application in a wide range of environments, enhancing usability.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates efficient heat dissipation and enables the IC to be mounted easily on PCBs.

Terminal Form: BALL

Ball terminal form enables reliable connections with minimal inductance, enhancing signal integrity.

Terminal Pitch: 0.8 mm

A terminal pitch of 0.8 mm allows for high-density designs and efficient layout in space-constrained applications.

Technical Specifications

Other Function Logic ICs SSTUB32866EC/S,518 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PBGA-B96

Logic IC Type:

No. of Terminals:

96

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA96,6X16,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.8

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

SSTUB32866EC/S,518 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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