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SN74AUP1G99DCUR

Texas Instruments

SN74AUP1G99DCUR by Texas Instruments

SN74AUP1G99DCUR by Texas Instruments is a CMOS logic IC with 36.1ns propagation delay, 30pF load capacitance, and 3-STATE output characteristics. It operates at a nominal voltage of 1.1V and is suitable for industrial applications requiring Schmitt Trigger functionality in a small outline package with dual terminals.

Median Price

$0.260

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 118,795 parts In-Stock

1+ parts

$0.304

100+ parts

$0.207

1k+ parts

$0.106

10k+ parts

-

118,795

$0.304

$0.207

$0.106

-

Mouser Electronics

USA . 620 parts In-Stock

1+ parts

$0.410

100+ parts

$0.222

1k+ parts

-

10k+ parts

$0.171

620

$0.410

$0.222

-

$0.171

Rochester

USA . 37,975 parts In-Stock

1+ parts

-

100+ parts

$0.207

1k+ parts

$0.172

10k+ parts

$0.153

37,975

-

$0.207

$0.172

$0.153

DigiKey

USA . 37,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.260

37,975

-

-

-

$0.260

Verical

USA . 23,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.192

23,975

-

-

-

$0.192

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,169 parts In-Stock

1+ parts

$0.140

100+ parts

-

1k+ parts

-

10k+ parts

-

2,169

$0.140

-

-

-

Vyrian

USA . 897 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

897

$0.147

-

-

-

DigiKey Marketplace

USA . 43,975 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.150

10k+ parts

-

43,975

-

-

$0.150

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,150 parts In-Stock

1+ parts

$0.132

100+ parts

-

1k+ parts

-

10k+ parts

-

2,150

$0.132

-

-

-

Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

$26.364

100+ parts

-

1k+ parts

$26.958

10k+ parts

-

2,168

$26.364

-

$26.958

-

DigiPath Technology Company

USA . 852 parts In-Stock

1+ parts

$29.030

100+ parts

$26.707

1k+ parts

-

10k+ parts

-

852

$29.030

$26.707

-

-

ChromeModa Solutions

Germany . 3,332 parts In-Stock

1+ parts

$29.622

100+ parts

$24.290

1k+ parts

-

10k+ parts

-

3,332

$29.622

$24.290

-

-

IDEA Electronic Components Group

UK . 2,044 parts In-Stock

1+ parts

$29.622

100+ parts

$28.141

1k+ parts

$26.660

10k+ parts

-

2,044

$29.622

$28.141

$26.660

-

EMSNET (Excess)

USA . 3,014 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,014

-

-

-

-

Overview

Experience unparalleled performance and reliability with the Texas Instruments SN74AUP1G99DCUR. As a leader in semiconductor manufacturing, Texas Instruments guarantees top-notch quality and innovation. This versatile Other Function Logic IC is perfect for a wide range of applications, offering customers exceptional value and benefits. With a compact design and advanced features like Schmitt Trigger technology, this product delivers on both efficiency and effectiveness. Upgrade your projects with the SN74AUP1G99DCUR and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection to the internal components of the IC, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 36.1 ns

Low propagation delay ensures fast operation and response times, making this IC suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and cost during production.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient, making it easy to integrate into compact electronic devices.

Nominal Supply Voltage / Vsup (V): 1.1

The low nominal supply voltage of 1.1V helps in reducing power consumption and heat generation, making the IC more energy-efficient.

Load Capacitance (CL): 30 pF

The low load capacitance of 30 pF ensures minimal signal distortion and interference, improving the overall performance of the IC.

Power Supplies (V): 1.2/3.3

Compatible with multiple power supply voltages (1.2V and 3.3V), offering flexibility in system design and integration.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile circuit designs and configurations.

Maximum I (ol): 4 Amp

High maximum output current of 4A allows the IC to drive high-power loads without external amplification, simplifying the circuit design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output allows the IC to control bus lines effectively, enabling bidirectional communication and data transfer.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures operational reliability in cold environments or during temperature fluctuations.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable connections during PCB assembly.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and connections, accommodating different design requirements.

Maximum Seated Height: 0.9 mm

The low maximum seated height of 0.9mm allows for compact and low-profile PCB designs, saving space in electronic devices.

Width: 2 mm

The narrow width of 2mm enables space-efficient PCB layout and integration, ideal for applications with size constraints.

Output Polarity: TRUE

True output polarity ensures consistent signal interpretation and compatibility in logic circuits, reducing the risk of errors or malfunctions.

Minimum Supply Voltage (Vsup): 0.8 V

The low minimum supply voltage of 0.8V allows operation in power-constrained environments, extending the IC's applicability.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable soldering and assembly process, maintaining the integrity of the IC during manufacturing.

Length: 2.3 mm

The compact length of 2.3mm contributes to the overall small form factor of the IC, facilitating space-saving integration in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments with extended temperature ranges.

Schmitt Trigger: YES

Built-in Schmitt trigger functionality improves noise immunity and signal stability, enhancing the IC's robustness in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and wide operating voltage range, making the IC energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form supports secure and reliable soldering connections, reducing the risk of solder joint failures during PCB assembly.

Packing Method: TR

The TR packing method ensures convenient handling, storage, and transport of the IC, simplifying inventory management and production processes.

Terminal Pitch: 0.5 mm

The tight terminal pitch of 0.5mm allows for high-density mounting, enabling compact PCB designs with a large number of components.

Maximum Supply Voltage (Vsup): 3.6 V

The high maximum supply voltage of 3.6V provides flexibility and compatibility with various power sources, accommodating different system requirements.

Technical Specifications

Other Function Logic ICs SN74AUP1G99DCUR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Length:

2.3 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

.9 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Trade Compliance

SN74AUP1G99DCUR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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