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SN74ALS6311ADWR

Texas Instruments

SN74ALS6311ADWR by Texas Instruments

SN74ALS6311ADWR by Texas Instruments is a TTL technology logic IC with 20 terminals, operating at 5V. It has a temperature range of 0-70°C and comes in a small outline package suitable for surface mount applications. Ideal for commercial use in various electronic systems requiring reliable logic functions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,013 parts In-Stock

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6,013

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NexGen Digital

USA . 549 parts In-Stock

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549

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Digiode

USA . 123 parts In-Stock

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123

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$10.351

100+ parts

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623

$10.351

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Parana Technologies

USA . 8 parts In-Stock

1+ parts

$27.877

100+ parts

$2,588.763

1k+ parts

$25.089

10k+ parts

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8

$27.877

$2,588.763

$25.089

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DigiPath Technology Company

USA . 1,198 parts In-Stock

1+ parts

$30.696

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1,198

$30.696

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ChromeModa Solutions

Germany . 4,159 parts In-Stock

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$31.322

100+ parts

$25.684

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4,159

$31.322

$25.684

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IDEA Electronic Components Group

UK . 543 parts In-Stock

1+ parts

$31.322

100+ parts

$29.756

1k+ parts

$28.190

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543

$31.322

$29.756

$28.190

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One Stop Electronics

USA . 1,533 parts In-Stock

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$50.000

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1,533

$50.000

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Corphita

USA . 4,121 parts In-Stock

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4,121

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Overview

Discover the innovative SN74ALS6311ADWR by Texas Instruments, a top-quality Other Function Logic IC designed to elevate your electronic projects with precision and reliability. With Texas Instruments' renowned reputation for excellence in manufacturing, this small outline package offers exceptional performance in a wide range of applications. From industrial automation to consumer electronics, this TTL technology IC provides a dependable solution for your circuit design needs. Trust in Texas Instruments to deliver the value, benefits, and advantages you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy integration onto PCBs, saving space and making assembly more efficient.

Nominal Supply Voltage / Vsup (V): 5

Having a 5V nominal supply voltage ensures compatibility with a wide range of systems and devices.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures functionality even in colder environments.

Technology: TTL

TTL technology offers fast switching speeds and low power consumption, making it ideal for high-performance applications.

Technical Specifications

Other Function Logic ICs SN74ALS6311ADWR attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

ALS

JESD-30 Code:

R-PDSO-G20

Logic IC Type:

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Arithmetic Circuits

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SN74ALS6311ADWR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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