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GTL2000DGG,118

NXP Semiconductors

GTL2000DGG,118 by NXP Semiconductors

GTL2000DGG,118 by NXP Semiconductors is a MOS technology logic IC with 48 terminals in a small outline, thin profile package. It operates at temperatures ranging from -40 to 85 °C and has power supplies of 2.5V and 3.3V. This IC is commonly used in industrial applications requiring high temperature tolerance and compact design.

Median Price

$0.634

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 900 parts In-Stock

1+ parts

$0.634

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900

$0.634

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Vyrian

USA . 5,806 parts In-Stock

1+ parts

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5,806

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Digiode

USA . 3,798 parts In-Stock

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3,798

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Anansix

USA . 905 parts In-Stock

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905

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,546 parts In-Stock

1+ parts

$0.634

100+ parts

-

1k+ parts

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10k+ parts

$0.621

3,546

$0.634

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-

$0.621

Argo Parts USA

USA . 2,237 parts In-Stock

1+ parts

$0.634

100+ parts

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10k+ parts

$0.615

2,237

$0.634

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$0.615

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.634

100+ parts

$0.621

1k+ parts

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2,000

$0.634

$0.621

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.647

100+ parts

$0.647

1k+ parts

$0.647

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350

$0.647

$0.647

$0.647

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Microchip USA

USA . 474 parts In-Stock

1+ parts

$12.105

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474

$12.105

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AZTECH Wire

Italy . 623 parts In-Stock

1+ parts

$19.072

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623

$19.072

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Ampacity Inc.

Singapore . 1,114 parts In-Stock

1+ parts

$23.000

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1,114

$23.000

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Semicontronic

India . 425 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

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425

$27.000

$26.325

$26.190

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Corohmni

South Africa . 663 parts In-Stock

1+ parts

$29.443

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663

$29.443

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Aztec Data Supply Inc.

USA . 1,015 parts In-Stock

1+ parts

$31.480

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1,015

$31.480

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One Stop Electronics

USA . 1,355 parts In-Stock

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$63.000

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1,355

$63.000

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Corphita

USA . 4,655 parts In-Stock

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4,655

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UNI Independent Distributors

Spain . 2,977 parts In-Stock

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2,977

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Overview

Discover the GTL2000DGG,118 by NXP Semiconductors, a high-quality logic IC that offers unmatched value and benefits. Designed with precision and reliability in mind, this state-of-the-art device is perfect for a wide range of applications. With its advanced technology and innovative features, it ensures seamless performance and exceptional functionality. Whether you need to enhance your electronic systems or optimize your industrial processes, the GTL2000DGG,118 is the perfect solution. Trust NXP Semiconductors, a renowned manufacturer known for delivering top-notch products that exceed customer expectations. Embrace the advantages of the GTL2000DGG,118 and unlock endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and helps to protect the delicate internal components of the product, making it a reliable choice.

Surface Mount: YES

The surface mount capability of this product simplifies its installation and ensures compatibility with modern circuit board designs, making it convenient and easy to use.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization, making it suitable for compact electronic devices where size matters.

Power Supplies (V): 2.5,3.3

This product is versatile as it can operate with power supplies of either 2.5V or 3.3V, making it compatible with a wide range of applications and power sources.

No. of Terminals: 48

With 48 terminals, this product offers ample connectivity options, allowing for complex circuit designs and ensuring compatibility with various external devices.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch of the package style enable space-saving integration into smaller electronic devices, making it a versatile choice for compact designs.

Maximum Operating Temperature: 85 °C

This product can operate reliably at temperatures up to 85°C, ensuring its performance and stability even in demanding industrial environments.

Minimum Operating Temperature: -40 °C

The product's ability to function reliably at temperatures as low as -40°C makes it suitable for use in extreme cold environments, providing versatility and durability.

Terminal Position: DUAL

The dual terminal position allows for flexible and convenient connections, accommodating different circuit board layouts and enhancing the ease of installation.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum time of 30 seconds at peak reflow temperature, this product can withstand the high-temperature soldering process without compromising its functionality, ensuring a seamless production workflow.

Peak Reflow Temperature °C: 260

The product's ability to withstand peak reflow temperatures of up to 260°C ensures its reliability and longevity during the soldering process, making it a durable choice.

Temperature Grade: INDUSTRIAL

Designed and rated for industrial temperature conditions, this product can perform consistently and reliably in harsh environments, making it suitable for industrial-grade applications.

Technology: MOS

This product utilizes Metal-Oxide-Semiconductor (MOS) technology, known for its low power consumption, high switching speeds, and noise immunity, making it an efficient and reliable choice for various digital logic applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection between the product and external devices, minimizing the risk of disconnection and ensuring consistent performance.

Packing Method: TR, 13 INCH

The product is packed using Tape and Reel (TR) packaging method, with a 13-inch reel size, ensuring safe transportation and easy handling during the assembly process.

Terminal Pitch: 0.5 mm

The product's terminal pitch of 0.5mm allows for precise and compact circuit integration, making it suitable for applications with tight space constraints.

Technical Specifications

Other Function Logic ICs GTL2000DGG,118 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G48

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR, 13 INCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

GTL2000DGG,118 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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