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GTL2000DGG,112

NXP Semiconductors

GTL2000DGG,112 by NXP Semiconductors

GTL2000DGG,112 by NXP Semiconductors is a versatile logic IC designed for industrial applications. It operates at 2.5V and 3.3V with a temperature range of -40 °C to 85 °C, featuring a compact 48-terminal gull-wing package. Ideal for surface mount technology, it ensures reliable performance in demanding environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,440 parts In-Stock

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7,440

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Digiode

USA . 4,913 parts In-Stock

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4,913

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Anansix

USA . 1,730 parts In-Stock

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1,730

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One Stop Electronics

USA . 785 parts In-Stock

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$8.000

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785

$8.000

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AZTECH Wire

Italy . 225 parts In-Stock

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$18.250

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225

$18.250

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Microchip USA

USA . 346 parts In-Stock

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$25.735

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346

$25.735

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Native Components

USA . 768 parts In-Stock

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$27.398

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768

$27.398

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Northwest PG Solutions

USA . 899 parts In-Stock

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$30.138

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$27.124

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899

$30.138

$27.124

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Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$39.536

100+ parts

$35.978

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$32.420

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550

$39.536

$35.978

$32.420

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Corphita

USA . 4,125 parts In-Stock

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4,125

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UNI Independent Distributors

Spain . 884 parts In-Stock

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884

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iodParts Technologies Inc.

India . 350 parts In-Stock

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350

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Overview

Unlock unparalleled performance with the GTL2000DGG,112 from NXP Semiconductors, a leader in innovative technology. This compact logic IC offers exceptional reliability and versatility, perfect for demanding applications in industrial settings. Its robust design ensures optimal functionality across a range of temperatures, making it ideal for mission-critical systems. Experience efficiency and peace of mind with a product that elevates your designs to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for efficient use of space on circuit boards, enabling compact and high-density designs.

Package Shape: RECTANGULAR

The rectangular shape enhances layout flexibility and optimizes PCB real estate, allowing for better designs and arrangements.

Power Supplies (V): 2.5, 3.3

Support for both 2.5V and 3.3V power supplies accommodates a wide range of electronic devices and applications.

No. of Terminals: 48

With 48 terminals, the product supports complex functions and higher connectivity options, suitable for advanced circuitry.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile minimize space usage on PCBs, making it an ideal choice for compact designs where every millimeter counts.

Maximum Operating Temperature: 85 °C

Operational capability up to 85 °C makes this IC suitable for industrial applications and environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C ensures reliable performance in extreme cold environments, widening application possibilities.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and integration into different circuit layouts.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time of 30 seconds helps in maintaining component integrity during assembly processes.

Peak Reflow Temperature (°C): 260

A high peak reflow temperature tolerance enables the IC to endure rigorous soldering processes without damage.

Temperature Grade: INDUSTRIAL

Being rated for industrial use ensures high reliability and performance under challenging environmental conditions.

Technology: MOS

MOS technology provides low power consumption and high-speed operation, essential for modern electronic devices.

Terminal Form: GULL WING

Gull wing terminals enable easier handling and soldering, increasing production efficiency and reliability.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm supports denser layouts, perfect for multi-functional applications in compact devices.

Technical Specifications

Other Function Logic ICs GTL2000DGG,112 attributes and parameters. Explore more Other Function Logic ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-G48

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5,3.3

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

GTL2000DGG,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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