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CD54HC297F3A

Texas Instruments

CD54HC297F3A by Texas Instruments

CD54HC297F3A by Texas Instruments is a CMOS logic IC with 16 terminals and a propagation delay of 43ns at 4.5V supply voltage. It operates in temperatures ranging from -55 to 125°C, making it suitable for military-grade applications requiring high-speed signal processing in compact spaces. With a max power supply current of 0.16mA and through-hole terminal form, this IC is ideal for use in critical electronic systems that demand reliability and efficiency.

Median Price

$22.438

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Freelance Electronics

USA . 1 parts In-Stock

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Vyrian

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Digiode

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Corel Iberica Componentes, S.L.

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Northwest PG Solutions

USA . 2,204 parts In-Stock

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AZTECH Wire

Italy . 358 parts In-Stock

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Parana Technologies

USA . 1,314 parts In-Stock

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One Stop Electronics

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DigiPath Technology Company

USA . 340 parts In-Stock

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$29.794

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ChromeModa Solutions

Germany . 6,427 parts In-Stock

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IDEA Electronic Components Group

UK . 904 parts In-Stock

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Corphita

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Glotronic Ltd.

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Supply Digital

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Microchip USA

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Native Components

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Overview

Elevate your electronic projects with the CD54HC297F3A from Texas Instruments. Crafted with precision and quality, this logic IC is designed to deliver superior performance with a propagation delay of just 43 ns. Perfect for a range of applications in the Other Function Logic ICs category, this product offers reliability and efficiency to meet your project needs. Trust in Texas Instruments' reputation for excellence and choose the CD54HC297F3A for unparalleled value, benefits, and advantages that will take your creations to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection for the IC, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 43 ns

Fast propagation delay allows for quick processing of signals, making this IC suitable for high-speed applications.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance and power consumption.

Maximum Operating Temperature: 125 °C

Can operate reliably in high temperature environments, ideal for industrial and military applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable.

Technical Specifications

Other Function Logic ICs CD54HC297F3A attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

HC

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

43 ns

Propagation Delay (tpd):

43 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54HC297F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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