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74TVC16222ADGVRG4

Texas Instruments

74TVC16222ADGVRG4 by Texas Instruments

74TVC16222ADGVRG4 by Texas Instruments is a NMOS technology logic IC with 48 terminals in a small outline package. It operates b/w -40 to 85°C, with supply voltage ranging from 0.6V to 5V. Ideal for industrial applications requiring high temperature tolerance and low power consumption.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,640 parts In-Stock

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7,640

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Digiode

USA . 697 parts In-Stock

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697

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Distributors (Availability)

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AZTECH Wire

Italy . 346 parts In-Stock

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$7.113

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346

$7.113

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Parana Technologies

USA . 2,200 parts In-Stock

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$9.903

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$10.471

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2,200

$9.903

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$10.471

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One Stop Electronics

USA . 1,520 parts In-Stock

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$11.000

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1,520

$11.000

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ChromeModa Solutions

Germany . 6,296 parts In-Stock

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$11.127

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$9.124

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6,296

$11.127

$9.124

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IDEA Electronic Components Group

UK . 540 parts In-Stock

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$11.127

100+ parts

$10.571

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$10.014

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540

$11.127

$10.571

$10.014

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Northwest PG Solutions

USA . 1,157 parts In-Stock

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$4.037

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1,157

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$4.037

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Corphita

USA . 956 parts In-Stock

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Native Components

USA . 173 parts In-Stock

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$3.995

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173

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$3.995

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DigiPath Technology Company

USA . 35 parts In-Stock

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$10.032

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35

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$10.032

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Overview

Enhance your electronic projects with the 74TVC16222ADGVRG4 by Texas Instruments. With a reputation for top-quality products, Texas Instruments delivers reliability and innovation in the field of Other Function Logic ICs. This versatile component is ideal for a wide range of applications, offering customers exceptional value and performance. Upgrade your designs with the trusted brand that sets the standard in the industry.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the integrated circuit, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy installation onto circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 2.1

Stable supply voltage of 2.1V ensures reliable operation and performance of the logic IC.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this logic IC can withstand high temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The wide operating temperature range of -40 to 85°C ensures functionality in various temperature conditions.

Technology: NMOS

NMOS technology offers lower power consumption and faster operation, making it energy efficient and suitable for high-speed applications.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm allows for compact design and space-saving integration into electronic devices.

Maximum Supply Voltage (Vsup): 5 V

Support for a maximum supply voltage of 5V ensures compatibility with a wide range of power sources and applications.

Technical Specifications

Other Function Logic ICs 74TVC16222ADGVRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

GTL/TVC

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

9.7 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.1

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

.6 V

Nominal Supply Voltage / Vsup (V):

2.1

Surface Mount:

YES

Technology:

NMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

74TVC16222ADGVRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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