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SNJ54LS627W

Texas Instruments

SNJ54LS627W by Texas Instruments

SNJ54LS627W by Texas Instruments is a TTL technology logic IC with 2 functions, operating b/w -55°C to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a ceramic, metal-sealed co-fired flatpack package. Ideal for military-grade applications requiring reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,345 parts In-Stock

1+ parts

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4,345

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Digiode

USA . 2,304 parts In-Stock

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2,304

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 857 parts In-Stock

1+ parts

$12.981

100+ parts

-

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857

$12.981

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One Stop Electronics

USA . 1,454 parts In-Stock

1+ parts

$18.000

100+ parts

-

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1,454

$18.000

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Parana Technologies

USA . 806 parts In-Stock

1+ parts

$23.314

100+ parts

-

1k+ parts

$23.954

10k+ parts

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806

$23.314

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$23.954

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DigiPath Technology Company

USA . 327 parts In-Stock

1+ parts

$25.671

100+ parts

-

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327

$25.671

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ChromeModa Solutions

Germany . 374 parts In-Stock

1+ parts

$26.195

100+ parts

$21.480

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10k+ parts

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374

$26.195

$21.480

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IDEA Electronic Components Group

UK . 176 parts In-Stock

1+ parts

$26.195

100+ parts

$24.885

1k+ parts

$23.576

10k+ parts

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176

$26.195

$24.885

$23.576

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Corphita

USA . 4,645 parts In-Stock

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4,645

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Overview

Upgrade your electronic projects with the high-quality SNJ54LS627W from Texas Instruments. With a reputation for excellence in manufacturing, Texas Instruments delivers top-notch performance and reliability. This versatile logic IC is perfect for a wide range of applications, offering customers exceptional value and benefits. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs, whether you're a hobbyist or a professional. Elevate your projects with the SNJ54LS627W today!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Surface Mount: YES

Allows for easy installation onto circuit boards, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in a single IC can help simplify circuit designs and reduce component count.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage makes it compatible with many existing systems and power sources.

No. of Terminals: 14

Having a higher number of terminals provides more connectivity options and flexibility in circuit design.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand harsh environmental conditions without sacrificing performance.

Minimum Operating Temperature: -55 °C

The wide temperature range ensures reliable operation even in extreme cold environments.

Technology: TTL

Using TTL technology means this IC operates at higher speeds and consumes less power compared to other logic families.

Technical Specifications

Other Function Logic ICs SNJ54LS627W attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-CDFP-F14

Logic IC Type:

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

SNJ54LS627W Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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