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SN74LVC1G98DCKRG4

Texas Instruments

SN74LVC1G98DCKRG4 by Texas Instruments

SN74LVC1G98DCKRG4 by Texas Instruments is a CMOS logic IC with 6.3 ns propagation delay, 50 pF load capacitance, and 24 Amp max I (ol). It operates at a supply voltage of 1.8V and is suitable for industrial applications requiring a compact design with Schmitt Trigger functionality.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Chip Stock

USA . 15,030 parts In-Stock

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Vyrian

USA . 8,992 parts In-Stock

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Digiode

USA . 4,162 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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One Stop Electronics

USA . 1,120 parts In-Stock

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$8.000

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$8.000

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AZTECH Wire

Italy . 844 parts In-Stock

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$10.379

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Parana Technologies

USA . 672 parts In-Stock

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$13.239

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$13.743

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DigiPath Technology Company

USA . 751 parts In-Stock

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$14.578

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$13.411

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

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$14.875

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$14.131

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$13.388

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ChromeModa Solutions

Germany . 1,870 parts In-Stock

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$14.875

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$12.198

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Corohmni

South Africa . 199 parts In-Stock

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Ampacity Inc.

Singapore . 901 parts In-Stock

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Continental Prestige Electronics

USA . 5,309 parts In-Stock

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Corphita

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Argo Parts USA

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Aranea Global

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Overview

Discover the innovative SN74LVC1G98DCKRG4 by Texas Instruments, a high-quality Other Function Logic IC designed to deliver exceptional performance in a wide range of applications. With Texas Instruments' reputation for excellence in manufacturing, this product offers unmatched reliability and efficiency. Whether you're looking to enhance your electronics projects or streamline industrial processes, this compact and versatile IC provides unparalleled value, benefits, and advantages for all your circuit design needs. Experience the difference with Texas Instruments and elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides excellent durability and protection for the internal components of the IC.

Propagation Delay At Nominal Supply: 6.3 ns

Fast propagation delay ensures quick signal processing and response time.

Surface Mount: YES

Easily mountable on circuit boards, saving space and facilitating automated assembly.

Nominal Supply Voltage / Vsup (V): 1.8

Suitable for low power applications and reduces energy consumption.

Load Capacitance (CL): 50 pF

Matches well with the typical load capacitance of many electronic systems for optimal performance.

Output Characteristics: 3-STATE

Allows the output to be in a high-impedance state, providing versatility in signal control.

Temperature Grade: INDUSTRIAL

Capable of operating in harsh industrial environments with a wide temperature range.

Technology: CMOS

Utilizes Complementary Metal-Oxide-Semiconductor technology for low power consumption and high noise immunity.

Technical Specifications

Other Function Logic ICs SN74LVC1G98DCKRG4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LVC/LCX/Z

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

6.3 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74LVC1G98DCKRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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