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SN74AUP1G97DCKTE4

Texas Instruments

SN74AUP1G97DCKTE4 by Texas Instruments

SN74AUP1G97DCKTE4 by Texas Instruments is a CMOS logic IC with 26.7ns propagation delay, 30pF load capacitance, and 1.2V nominal voltage. It is ideal for industrial applications requiring a compact design, Schmitt trigger functionality, and 3-state output characteristics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,581 parts In-Stock

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Vyrian

USA . 3,620 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 418 parts In-Stock

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$8.294

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Parana Technologies

USA . 163 parts In-Stock

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$17.848

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$18.027

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DigiPath Technology Company

USA . 2,165 parts In-Stock

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$19.653

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IDEA Electronic Components Group

UK . 684 parts In-Stock

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$20.054

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$19.051

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$18.049

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ChromeModa Solutions

Germany . 127 parts In-Stock

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$20.054

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$16.444

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One Stop Electronics

USA . 540 parts In-Stock

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$21.000

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Corphita

USA . 1,611 parts In-Stock

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Overview

Elevate your electronics projects with the SN74AUP1G97DCKTE4 by Texas Instruments, a top-of-the-line Other Function Logic IC that promises superior quality and performance. With a wide range of applications and a renowned manufacturer like Texas Instruments behind it, this product offers unbeatable value to customers. Experience the benefits of fast propagation delay, low power consumption, and reliable output characteristics. Trust in Texas Instruments to deliver cutting-edge technology that will take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and protection for the internal components of the IC.

Propagation Delay At Nominal Supply: 26.7 ns

With a fast propagation delay, this IC can process signals quickly, making it suitable for time-sensitive applications.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage / Vsup (V): 1.2

Operating at a low nominal supply voltage of 1.2V, this IC is energy-efficient and can help reduce power consumption in electronic devices.

Load Capacitance (CL): 30 pF

The low load capacitance of 30 pF ensures efficient signal transmission and reception within the IC.

Power Supplies (V): 1.2/3.3

Supporting multiple power supply options of 1.2V and 3.3V, this IC offers flexibility in different circuit configurations.

No. of Terminals: 6

The 6 terminals allow for easy connections and integration of the IC into electronic circuits.

Maximum I (ol): 1.7 Amp

With a high maximum output current of 1.7 Amps, this IC can drive various loads without overheating or performance degradation.

Maximum Operating Temperature: 85 °C

Operating at a maximum temperature of 85°C, this IC is suitable for industrial applications where high temperatures may be encountered.

Output Characteristics: 3-STATE

The 3-STATE output characteristics allow the IC to drive the output either HIGH, LOW, or a high-impedance state, adding flexibility to the circuit design.

Minimum Operating Temperature: -40 °C

Operating at a minimum temperature of -40°C, this IC can withstand cold environments and is suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish on the terminals ensures reliable and low-resistance connections for optimal performance.

Terminal Position: DUAL

Having dual terminal positions allows for easy soldering and connection to the circuit board, enhancing the overall reliability of the IC.

Maximum Seated Height: 1.1 mm

The low maximum seated height of 1.1mm makes this IC suitable for compact electronic devices and applications where space is limited.

Width: 1.25 mm

The narrow width of 1.25mm allows for higher component density on the circuit board and facilitates efficient PCB layout.

Minimum Supply Voltage (Vsup): 0.8 V

With a low minimum supply voltage of 0.8V, this IC can operate reliably even in scenarios where the supply voltage may fluctuate.

Maximum Time At Peak Reflow Temperature (s): 30

The IC can withstand peak reflow temperatures for up to 30 seconds, making it suitable for automated assembly processes involving soldering.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures the IC's reliability during the soldering process, preventing damage to the components.

Length: 2 mm

The compact length of 2mm allows for space-efficient placement on the circuit board, contributing to a more streamlined and compact device design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this IC can withstand harsh environmental conditions and temperature fluctuations commonly encountered in industrial settings.

Schmitt Trigger: YES

Incorporating a Schmitt trigger feature improves noise immunity and signal integrity, making this IC suitable for applications requiring stable and reliable signal processing.

Technology: CMOS

Utilizing CMOS technology, this IC offers low power consumption, high noise immunity, and fast switching speeds, making it an efficient choice for various electronic applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of assembly during soldering, ensuring secure connections for reliable performance.

Packing Method: TR

The TR packing method (tape and reel) facilitates automated pick-and-place processes during assembly, improving manufacturing efficiency and reducing costs.

Terminal Pitch: 0.65 mm

With a terminal pitch of 0.65mm, this IC enables high-density mounting on the circuit board, optimizing space utilization and enhancing overall system performance.

Maximum Supply Voltage (Vsup): 3.6 V

Supporting a maximum supply voltage of 3.6V, this IC can operate reliably in systems where higher voltage levels are required without compromising performance.

Technical Specifications

Other Function Logic ICs SN74AUP1G97DCKTE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP6,.08

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

26.7 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.1 mm

Sub-Category:

Logic IC:Other

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.2

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.25 mm

Trade Compliance

SN74AUP1G97DCKTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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