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SN74AUP1G99DCTTE4

Texas Instruments

SN74AUP1G99DCTTE4 by Texas Instruments

SN74AUP1G99DCTTE4 by Texas Instruments is a CMOS logic IC with 36.1 ns propagation delay, 30 pF load capacitance, and 1.7 Amp max I (ol). It is ideal for industrial applications requiring a small outline package with Schmitt Trigger functionality and 3-STATE output characteristics.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,227 parts In-Stock

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Digiode

USA . 1,624 parts In-Stock

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One Stop Electronics

USA . 1,438 parts In-Stock

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$3.000

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AZTECH Wire

Italy . 848 parts In-Stock

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$8.089

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Parana Technologies

USA . 2,209 parts In-Stock

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ChromeModa Solutions

Germany . 2,490 parts In-Stock

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$22.828

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$18.719

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IDEA Electronic Components Group

UK . 1,507 parts In-Stock

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$22.828

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$21.687

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$20.545

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Corphita

USA . 4,512 parts In-Stock

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DigiPath Technology Company

USA . 1,667 parts In-Stock

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Overview

Unlock the power of advanced technology with the SN74AUP1G99DCTTE4 by Texas Instruments. Known for their commitment to quality and innovation, Texas Instruments delivers top-notch products that excel in various applications. The SN74AUP1G99DCTTE4 falls under the category of Other Function Logic ICs, offering a range of benefits such as low profile packaging, reliable performance, and fast propagation delay. With a nominal supply voltage of 1.1V and 3-state output characteristics, this IC is perfect for industrial-grade applications where precision and efficiency are vital. Experience superior quality and unmatched value with the SN74AUP1G99DCTTE4 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Propagation Delay At Nominal Supply: 36.1 ns

Low propagation delay ensures fast response times, making this product suitable for applications where quick signal processing is required.

Surface Mount: YES

Surface mount capability makes this product easy to integrate onto PCBs, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 1.1

Low nominal supply voltage of 1.1V allows for efficient power consumption, making this product suitable for battery-operated devices.

Load Capacitance (CL): 30 pF

Suitable load capacitance of 30 pF ensures optimal performance and signal integrity.

Power Supplies (V): 1.2/3.3

Support for multiple power supply voltages (1.2V and 3.3V) provides flexibility in different operating environments.

No. of Terminals: 8

A higher number of terminals (8) allows for versatile connectivity options and integration with other components.

Maximum I (ol): 1.7 Amp

High maximum output current of 1.7 Amp allows the product to drive various loads without the risk of damage.

Maximum Operating Temperature: 85 °C

Wide operating temperature range of -40 to 85°C ensures stable performance in different environmental conditions.

Output Characteristics: 3-STATE

3-STATE output characteristics provide additional flexibility in controlling the output signals, allowing for more complex logic operations.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C ensures that the product can function reliably even in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Terminal finish of Nickel Palladium Gold ensures good conductivity and resistance to corrosion, improving the overall reliability of the product.

Terminal Position: DUAL

Dual terminal position provides additional robustness and stability in the connection, reducing the risk of disconnection or signal interference.

Maximum Seated Height: 1.3 mm

Low maximum seated height of 1.3 mm allows for compact and space-saving designs in electronic applications.

Width: 2.8 mm

Narrow width of 2.8 mm enables easy integration of the product into small form factor devices.

Minimum Supply Voltage (Vsup): 0.8 V

Support for low minimum supply voltage of 0.8V ensures compatibility with a wide range of power sources, including low-power applications.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature of 30 seconds allows for reliable soldering and assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and bonding of the product during assembly.

Length: 2.95 mm

Compact length of 2.95 mm allows for efficient use of space on PCBs and in electronic devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade rating ensures that the product can withstand harsh operating conditions and maintain performance under high temperatures.

Schmitt Trigger: YES

Inclusion of a Schmitt Trigger ensures signal conditioning and noise immunity, improving the overall reliability of the product in noisy environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable in various applications.

Terminal Form: GULL WING

Gull Wing terminal form provides secure and reliable connections during soldering, enhancing the durability and longevity of the product.

Packing Method: TR

TR packing method (Tape and Reel) ensures easy handling, storage, and automated assembly of the product in manufacturing processes.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm allows for high-density mounting and space-efficient PCB layouts, ideal for compact electronic designs.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage of 3.6V provides flexibility in power supply options and compatibility with various voltage levels in the system.

Technical Specifications

Other Function Logic ICs SN74AUP1G99DCTTE4 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

AUP/ULP/V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.95 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

1.7 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP8,.16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2/3.3

Propagation Delay At Nominal Supply:

36.1 ns

Qualification:

Not Qualified

Schmitt Trigger:

YES

Maximum Seated Height:

1.3 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

.8 V

Nominal Supply Voltage / Vsup (V):

1.1

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2.8 mm

Trade Compliance

SN74AUP1G99DCTTE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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