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SN74LS442NP1

Texas Instruments

SN74LS442NP1 by Texas Instruments

SN74LS442NP1 by Texas Instruments is a TTL technology IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. This IC is commonly used in commercial applications requiring other function logic circuits due to its dual terminal position and temperature range of 0-70°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,907 parts In-Stock

1+ parts

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1,907

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Digiode

USA . 102 parts In-Stock

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102

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 471 parts In-Stock

1+ parts

$6.000

100+ parts

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471

$6.000

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AZTECH Wire

Italy . 316 parts In-Stock

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$9.974

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316

$9.974

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Parana Technologies

USA . 198 parts In-Stock

1+ parts

$17.791

100+ parts

-

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$17.969

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198

$17.791

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$17.969

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ChromeModa Solutions

Germany . 5,845 parts In-Stock

1+ parts

$19.990

100+ parts

$16.392

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5,845

$19.990

$16.392

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IDEA Electronic Components Group

UK . 2,020 parts In-Stock

1+ parts

$19.990

100+ parts

$18.990

1k+ parts

$17.991

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2,020

$19.990

$18.990

$17.991

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Corphita

USA . 1,879 parts In-Stock

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1,879

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DigiPath Technology Company

USA . 1,102 parts In-Stock

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$18.023

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1,102

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$18.023

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Overview

Unlock the potential of your electronic projects with the SN74LS442NP1 by Texas Instruments. Known for their high-quality products, Texas Instruments offers reliable solutions for a variety of applications in the Other Function Logic ICs category. This versatile IC boasts a nominal supply voltage of 5V, making it suitable for a wide range of projects. With 20 terminals and a durable plastic/epoxy package body material, this IC is built to last. Trust Texas Instruments to deliver innovative technology that meets your needs. Elevate your designs with the SN74LS442NP1 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the IC, ensuring reliability and longevity.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs and ensures space efficiency.

Nominal Supply Voltage / Vsup (V): 5

Stable 5V supply voltage ensures consistent and reliable performance of the IC in various applications.

Power Supplies (V): 5

Matching power supplies at 5V ensures compatibility and efficiency in power delivery.

No. of Terminals: 20

Sufficient number of terminals for connecting the IC to external components and circuits, allowing for versatile usage.

Package Style (Meter): IN-LINE

In-line package style simplifies PCB layout and assembly process, making it user-friendly for circuit designers.

Maximum Operating Temperature: 70 °C

Wide operating temperature range up to 70°C enables reliable operation in varying environmental conditions.

Minimum Operating Temperature: 0 °C

Low operating temperature down to 0°C ensures functionality even in cold environments.

Terminal Position: DUAL

Dual terminal position facilitates easy and secure connection of the IC in the circuit, enhancing overall stability.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures compatibility with standard operating conditions in commercial applications.

Technology: TTL

TTL technology offers fast and reliable performance, suitable for various logic functions in electronic circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for secure and stable mounting on PCBs, reducing the risk of loose connections or solder joints.

Terminal Pitch: 2.54 mm

Standard terminal pitch of 2.54mm enables easy integration and compatibility with standard PCB layouts and components.

Technical Specifications

Other Function Logic ICs SN74LS442NP1 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS442NP1 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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