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SN54LS124W-00

Texas Instruments

SN54LS124W-00 by Texas Instruments

SN54LS124W-00 by Texas Instruments is a TTL logic IC with 2 functions, operating b/w -55 to 125°C. It has a supply voltage range of 4.5V to 5.5V and comes in a ceramic flatpack package. Ideal for military-grade applications requiring reliable logic functions in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,043 parts In-Stock

1+ parts

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8,043

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Digiode

USA . 2,884 parts In-Stock

1+ parts

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2,884

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 97 parts In-Stock

1+ parts

$14.142

100+ parts

$1,313.308

1k+ parts

$12.728

10k+ parts

-

97

$14.142

$1,313.308

$12.728

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DigiPath Technology Company

USA . 532 parts In-Stock

1+ parts

$15.572

100+ parts

$14.326

1k+ parts

-

10k+ parts

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532

$15.572

$14.326

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ChromeModa Solutions

Germany . 713 parts In-Stock

1+ parts

$15.890

100+ parts

$13.030

1k+ parts

-

10k+ parts

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713

$15.890

$13.030

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IDEA Electronic Components Group

UK . 520 parts In-Stock

1+ parts

$15.890

100+ parts

$15.096

1k+ parts

$14.301

10k+ parts

-

520

$15.890

$15.096

$14.301

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AZTECH Wire

Italy . 392 parts In-Stock

1+ parts

$18.889

100+ parts

-

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392

$18.889

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One Stop Electronics

USA . 935 parts In-Stock

1+ parts

$28.000

100+ parts

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935

$28.000

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Corphita

USA . 4,300 parts In-Stock

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4,300

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Overview

Discover the unparalleled quality and reliability of the Texas Instruments SN54LS124W-00. As a leading manufacturer in the industry, Texas Instruments ensures top-notch performance and durability in all their products. This versatile logic IC is perfect for a wide range of applications, offering customers exceptional value and benefits. Trust Texas Instruments to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Choose the SN54LS124W-00 for unmatched quality and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability for the product, making it ideal for long-term use in various environments.

Surface Mount: YES

The surface mount feature allows for easy installation and integration into electronic circuits, saving time and effort during assembly.

No. of Functions: 2

Having multiple functions in one IC enables higher efficiency and performance, making it a versatile solution for complex logic operations.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Temperature Grade: MILITARY

The military-grade temperature rating ensures reliable operation in harsh conditions, making it suitable for aerospace, defense, and industrial applications.

Technology: TTL

The TTL technology offers fast switching speeds and low power consumption, making it a reliable choice for high-speed digital applications.

Technical Specifications

Other Function Logic ICs SN54LS124W-00 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

Family:

LS

JESD-30 Code:

R-GDFP-F16

Logic IC Type:

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

SN54LS124W-00 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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