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SN74LS444N3

Texas Instruments

SN74LS444N3 by Texas Instruments

SN74LS444N3 by Texas Instruments is a TTL logic IC with 20 terminals, operating at 5V. It has a rectangular package shape made of plastic/epoxy material. This IC is commonly used in commercial applications requiring dual terminal positions and operates within a temperature range of 0 to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,634 parts In-Stock

1+ parts

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6,634

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Digiode

USA . 3,215 parts In-Stock

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3,215

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 548 parts In-Stock

1+ parts

$10.054

100+ parts

-

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548

$10.054

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Parana Technologies

USA . 1,573 parts In-Stock

1+ parts

$26.196

100+ parts

-

1k+ parts

$26.784

10k+ parts

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1,573

$26.196

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$26.784

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DigiPath Technology Company

USA . 1,053 parts In-Stock

1+ parts

$28.845

100+ parts

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1,053

$28.845

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One Stop Electronics

USA . 1,263 parts In-Stock

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$29.000

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1,263

$29.000

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ChromeModa Solutions

Germany . 3,769 parts In-Stock

1+ parts

$29.434

100+ parts

$24.136

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3,769

$29.434

$24.136

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IDEA Electronic Components Group

UK . 751 parts In-Stock

1+ parts

$29.434

100+ parts

$27.962

1k+ parts

$26.491

10k+ parts

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751

$29.434

$27.962

$26.491

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Corphita

USA . 4,057 parts In-Stock

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4,057

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Overview

Enhance your electronic projects with the SN74LS444N3 by Texas Instruments, a top-quality Other Function Logic IC that guarantees superior performance and reliability. Manufactured by industry leader Texas Instruments, this product offers unparalleled precision and efficiency for a wide range of applications. With its durable plastic/epoxy package, rectangular shape, and 20 terminals, this IC is designed to meet your needs without compromising on quality. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the SN74LS444N3 and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage makes this IC compatible with standard voltage requirements in many electronic devices, making it a versatile choice for various applications.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C allows this IC to function reliably in a wide range of environmental conditions, ensuring consistent performance.

Technology: TTL

The TTL technology used in this IC offers fast switching speeds and low power consumption, making it suitable for applications where speed and efficiency are crucial.

Technical Specifications

Other Function Logic ICs SN74LS444N3 attributes and parameters. Explore more Other Function Logic ICs devices from Texas Instruments

Specs

JESD-30 Code:

R-PDIP-T20

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Sub-Category:

Other Logic ICs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74LS444N3 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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