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MPC8280CZUQLDA

NXP Semiconductors

MPC8280CZUQLDA by NXP Semiconductors

NXP Semiconductors' MPC8280CZUQLDA is a 32-bit microprocessor with integrated cache, suitable for industrial applications. It operates at speeds up to 333 rpm and supports low power mode. With a max supply voltage of 1.6 V, it features an external data bus width of 64 bits and boundary scan capability.

Median Price

$276.010

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

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$276.010

100+ parts

$259.450

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$234.610

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6

$276.010

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$234.610

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DigiKey

USA . 11 parts In-Stock

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Nova Conductors

Japan . 87 parts In-Stock

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$240.880

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$240.880

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Digiode

USA . 4,031 parts In-Stock

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$262.210

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$262.210

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Bristol Electronics

USA . 3 parts In-Stock

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$365.300

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Vyrian

USA . 7,882 parts In-Stock

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Anansix

USA . 1,802 parts In-Stock

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Flip Electronics

USA . 6 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 275 parts In-Stock

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$12.760

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275

$12.760

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Aztec Data Supply Inc.

USA . 4,059 parts In-Stock

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$45.690

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4,059

$45.690

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$61.674

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$56.123

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$50.573

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$61.674

$56.123

$50.573

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Ampacity Inc.

Singapore . 9 parts In-Stock

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$234.610

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9

$234.610

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Semicontronic

India . 9 parts In-Stock

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$234.610

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$228.745

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$227.572

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9

$234.610

$228.745

$227.572

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Corohmni

South Africa . 1,023 parts In-Stock

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$240.880

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Continental Prestige Electronics

USA . 4,290 parts In-Stock

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$240.880

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$236.062

4,290

$240.880

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$236.062

Corphita

USA . 3,345 parts In-Stock

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$248.409

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Vigor

Singapore . 750 parts In-Stock

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$451.688

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750

$451.688

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QUARKTWIN TECHNOLOGY LTD

USA . 6,761 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,583 parts In-Stock

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UNI Independent Distributors

Spain . 4,136 parts In-Stock

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Microchip USA

USA . 4,115 parts In-Stock

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Lixinc

USA . 2,298 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$236.062

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$228.836

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$224.018

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$228.836

$224.018

Argo Parts USA

USA . 525 parts In-Stock

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525

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Perfect Parts

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Overview

Unleash the power of cutting-edge technology with the MPC8280CZUQLDA microprocessor by NXP Semiconductors. Designed with precision and expertise, this innovative product offers unparalleled performance and reliability in a wide range of applications. From industrial automation to telecommunications, this microprocessor delivers exceptional value, benefits, and advantages to customers looking for top-of-the-line solutions. Experience seamless operation and superior functionality with the MPC8280CZUQLDA, setting new standards in the world of microprocessors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it easy to handle and less prone to damage during handling and installation.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microprocessor by reducing the time taken to access frequently used instructions and data, leading to faster processing speeds.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and reducing the overall footprint of the device.

Maximum Supply Voltage: 1.6 V

Operates efficiently at a maximum supply voltage of 1.6V, ensuring stable performance and reliability under normal operating conditions.

Address Bus Width: 32

A 32-bit address bus width allows the microprocessor to access a wide range of memory locations, enabling it to handle large amounts of data efficiently.

Package Shape: SQUARE

The square package shape helps in better heat dissipation and easier mounting on the PCB, ensuring optimal thermal performance and space utilization.

Bit Size: 32

With a 32-bit architecture, the microprocessor can process data in chunks of 32 bits at a time, improving efficiency and speed in data processing tasks.

Power Supplies (V): 1.5, 3.3

Supports multiple power supply voltages (1.5V and 3.3V), allowing for versatile applications and compatibility with various power sources.

No. of Terminals: 480

With 480 terminals, the microprocessor offers a high level of connectivity for interfacing with other components, peripherals, and external devices.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array and low profile package style provide a compact design, making it suitable for space-constrained applications while ensuring efficient heat dissipation.

Minimum Supply Voltage: 1.45 V

The minimum supply voltage of 1.45V ensures that the microprocessor can operate efficiently even under low power conditions, enhancing energy efficiency.

Maximum Operating Temperature: 105 °C

With a maximum operating temperature of 105°C, the microprocessor can handle high-performance computing tasks without overheating, ensuring reliable operation.

Minimum Operating Temperature: -40 °C

The wide range of minimum operating temperature (-40°C) ensures the microprocessor can function in extreme cold environments without compromising performance.

Terminal Finish: TIN LEAD

Tin-lead terminal finish provides solderability and reliability during assembly, ensuring robust connections and long-term functionality of the microprocessor.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on the PCB, facilitating smooth installation and maintenance of the microprocessor.

Maximum Seated Height: 1.65 mm

With a maximum seated height of 1.65mm, the microprocessor has a low profile design, reducing the overall height of the device and enabling compact system integration.

Width: 37.5 mm

The width of 37.5mm provides a compact form factor, making the microprocessor suitable for space-constrained applications without compromising performance.

Boundary Scan: YES

Inclusion of boundary scan feature allows for efficient testing and debugging of the microprocessor during development and production, ensuring high quality and reliability.

External Data Bus Width: 64

A 64-bit external data bus width enables high-speed data transfer between the microprocessor and external peripherals, enhancing overall system performance.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand a maximum time of 40 seconds at peak reflow temperature, ensuring reliable soldering and assembly processes during PCB manufacturing.

Peak Reflow Temperature °C: 260

Capable of withstanding a peak reflow temperature of 260°C, ensuring robust solder joints and stable connections during the manufacturing process.

Length: 37.5 mm

The length of 37.5mm contributes to the overall compactness of the microprocessor, making it suitable for small form factor devices and applications.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, the microprocessor meets the stringent requirements for reliability, durability, and performance in harsh operating environments.

Peripheral IC Type: MICROPROCESSOR, RISC

Featuring RISC architecture, the microprocessor offers enhanced performance and energy efficiency for processing complex instructions and tasks efficiently.

Technology: CMOS

Built on CMOS technology, the microprocessor delivers low power consumption, high-speed operation, and reliable performance, making it ideal for a wide range of applications.

Terminal Form: BALL

The ball terminal form ensures secure connections and effective heat dissipation, enhancing the overall reliability and performance of the microprocessor.

Nominal Supply Voltage: 1.5 V

Operates at a nominal supply voltage of 1.5V, ensuring consistent and stable performance under normal operating conditions, with optimal power efficiency.

Terminal Pitch: 1.27 mm

With a terminal pitch of 1.27mm, the microprocessor allows for precise and reliable connections on the PCB, ensuring smooth signal transmission and operation.

Format: FLOATING POINT

Support for floating-point operations enhances the microprocessor's ability to handle complex mathematical calculations and tasks, improving overall processing speed and efficiency.

Moisture Sensitivity Level (MSL): 4

Having an MSL of 4 indicates that the microprocessor can withstand exposure to moderate levels of moisture during storage and handling, ensuring long-term reliability.

Speed: 333 rpm

With a speed of 333 rpm, the microprocessor offers high-speed processing capabilities for handling demanding computational tasks efficiently and effectively.

Low Power Mode: YES

Includes a low power mode feature for energy-efficient operation, allowing the microprocessor to conserve power when not running intensive tasks, extending battery life and reducing energy costs.

Technical Specifications

Microprocessors MPC8280CZUQLDA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B480

JESD-609 Code:

e0

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

4

No. of Terminals:

480

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA480,29X29,50

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.65 mm

Speed:

333 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

MPC8280CZUQLDA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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