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MPC8270CVRMIBA

NXP Semiconductors

MPC8270CVRMIBA by NXP Semiconductors

The NXP Semiconductors MPC8270CVRMIBA is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 266 MHz. It features an external data bus width of 64 bits and is suitable for applications requiring high-speed processing in devices such as networking equipment and industrial control systems.

Median Price

$179.334

Lifecycle Status

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In-Stock Inventory

1k+

MPC8270CVRMIBA by NXP Semiconductors
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Verical

USA . 40 parts In-Stock

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$179.334

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40

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$179.334

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Digiode

USA . 2,199 parts In-Stock

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$141.882

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2,199

$141.882

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Nova Conductors

Japan . 800 parts In-Stock

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$152.090

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Vyrian

USA . 7,541 parts In-Stock

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Anansix

USA . 1,949 parts In-Stock

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Chip Stock

USA . 425 parts In-Stock

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425

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QIE Inc.

USA . 69 parts In-Stock

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69

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Global Solutions Electronics Company

USA . 40 parts In-Stock

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TME

Poland . 40 parts In-Stock

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$145.130

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 261 parts In-Stock

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$9.587

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$9.587

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Aztec Data Supply Inc.

USA . 253 parts In-Stock

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$30.600

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Ampacity Inc.

Singapore . 22 parts In-Stock

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$103.700

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Continental Prestige Electronics

USA . 6,623 parts In-Stock

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$127.133

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$124.591

6,623

$127.133

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$124.591

Corphita

USA . 1,397 parts In-Stock

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$134.415

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$134.415

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Advanced Electronics

New Zealand . 48 parts In-Stock

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$137.547

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$137.547

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$137.547

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48

$137.547

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Aranea Global

USA . 500 parts In-Stock

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$149.048

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$143.086

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$149.048

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Vigor

Singapore . 236 parts In-Stock

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$160.540

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Corohmni

South Africa . 1,198 parts In-Stock

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$160.930

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Microchip USA

USA . 1,385 parts In-Stock

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$217.770

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Perfect Parts

USA . 9,925 parts In-Stock

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Lixinc

USA . 8,982 parts In-Stock

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UNI Independent Distributors

Spain . 8,203 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Robosynatics

Brazil . 1,373 parts In-Stock

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Lucentia Tech

USA . 1,373 parts In-Stock

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$157.711

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$154.493

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$154.493

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$154.493

Argo Parts USA

USA . 1,286 parts In-Stock

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iodParts Technologies Inc.

India . 300 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1 parts In-Stock

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Overview

Experience unparalleled performance and efficiency with the MPC8270CVRMIBA by NXP Semiconductors. As a trusted leader in microprocessor technology, NXP delivers cutting-edge solutions for a wide range of applications. From embedded systems to networking equipment, this microprocessor offers exceptional value, reliability, and versatility. Unlock new possibilities and elevate your projects with the MPC8270CVRMIBA. Choose NXP Semiconductors for superior quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material makes the microprocessor lightweight and durable, ideal for portable devices.

Integrated Cache: YES

Having integrated cache improves the performance of the microprocessor by reducing memory access times.

Surface Mount: YES

The surface mount capability allows for easier and more efficient integration of the microprocessor onto circuit boards.

Maximum Supply Voltage: 1.6 V

The maximum supply voltage of 1.6V ensures stable and reliable operation of the microprocessor within safe voltage limits.

Address Bus Width: 32

A wider address bus width of 32 bits allows for efficient memory addressing and data transfer capabilities.

Package Shape: SQUARE

The square package shape optimizes space utilization and allows for easier placement on circuit boards.

Bit Size: 32

A bit size of 32 provides sufficient processing power for a wide range of applications.

Power Supplies (V): 1.5, 3.3

Support for multiple power supplies at 1.5V and 3.3V ensures compatibility with various system requirements.

No. of Terminals: 516

Having a high number of terminals allows for a greater number of connections, enabling more complex system designs.

Package Style (Meter): GRID ARRAY

The grid array package style provides a secure and reliable connection between the microprocessor and the circuit board.

Minimum Supply Voltage: 1.45 V

The minimum supply voltage of 1.45V ensures that the microprocessor can operate at lower power consumption levels efficiently.

Terminal Finish: TIN SILVER

The tin silver terminal finish provides good conductivity and corrosion resistance for reliable performance.

Terminal Position: BOTTOM

Having terminals positioned at the bottom allows for easier assembly and cooling of the microprocessor.

Maximum Seated Height: 2.55 mm

A maximum seated height of 2.55mm allows for slim and compact device designs.

Width: 27 mm

The 27mm width ensures compatibility with standard mounting setups and allows for efficient placement on circuit boards.

Boundary Scan: YES

Boundary scan capability enables easier testing and debugging of the microprocessor during manufacturing and operation.

External Data Bus Width: 64

A wider external data bus width of 64 bits enables faster data transfer rates and better overall performance.

Maximum Clock Frequency: 266 MHz

A high maximum clock frequency of 266MHz allows for fast processing speeds and smooth operation of the microprocessor.

Maximum Time At Peak Reflow Temperature (s): 30

The microprocessor can withstand peak reflow temperatures for up to 30 seconds, ensuring durability during manufacturing processes.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245°C ensures proper soldering and heating during assembly procedures.

Length: 27 mm

The 27mm length provides a compact form factor for the microprocessor, suitable for space-constrained applications.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor is designed for RISC architecture, providing efficient and streamlined processing capabilities for a variety of tasks.

Technology: CMOS

The CMOS technology used in the microprocessor offers low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: BALL

Having ball terminal form allows for reliable connections and easy integration onto circuit boards.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5V is ideal for stable and efficient operation of the microprocessor.

Terminal Pitch: 1 mm

A terminal pitch of 1mm provides precise and compact connection points for the microprocessor.

Format: FLOATING POINT

The floating-point format enhances the microprocessor's ability to perform complex mathematical calculations with high precision.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the microprocessor can withstand moderate exposure to moisture during handling and storage.

Speed: 66.67 rpm

The speed of 66.67 rpm refers to the rotational speed of the microprocessor, which may be relevant for specific applications requiring rotational control.

Technical Specifications

Microprocessors MPC8270CVRMIBA attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

266 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B516

JESD-609 Code:

e2

Length:

27 mm

Low Power Mode:

NO

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

516

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.5,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.55 mm

Speed:

66.67 rpm

Sub-Category:

Other uPs/uCs/Peripheral ICs

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.45 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

27 mm

Peripheral IC Type:

Trade Compliance

MPC8270CVRMIBA Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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