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LX2160XC72232B

NXP Semiconductors

LX2160XC72232B by NXP Semiconductors

The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.

Median Price

$734.455

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 49 parts In-Stock

1+ parts

$638.730

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49

$638.730

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Chip1Stop

Japan . 49 parts In-Stock

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$649.000

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49

$649.000

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Rochester

USA . 4 parts In-Stock

1+ parts

$652.850

100+ parts

$613.680

1k+ parts

$574.510

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4

$652.850

$613.680

$574.510

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DigiKey

USA . 4 parts In-Stock

1+ parts

$816.060

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4

$816.060

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Verical

USA . 4 parts In-Stock

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$816.063

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$767.100

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$718.138

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4

$816.063

$767.100

$718.138

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Mouser Electronics

USA . 23 parts In-Stock

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$926.420

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$926.420

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Distributors (In-Stock)

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Digiode

USA . 1,127 parts In-Stock

1+ parts

$606.794

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$606.794

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DigiKey Marketplace

USA . 19 parts In-Stock

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$876.000

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$876.000

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Vyrian

USA . 8,244 parts In-Stock

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Anansix

USA . 1,811 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Cyclops Electronics Ltd

UK . 7 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 329 parts In-Stock

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$9.942

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$9.942

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Ampacity Inc.

Singapore . 36 parts In-Stock

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$476.240

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36

$476.240

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Microchip USA

USA . 1,427 parts In-Stock

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$569.210

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$548.510

1k+ parts

$538.160

10k+ parts

$527.810

1,427

$569.210

$548.510

$538.160

$527.810

Corphita

USA . 3,246 parts In-Stock

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$574.857

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$574.857

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Lixinc

USA . 6,242 parts In-Stock

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Continental Prestige Electronics

USA . 6,069 parts In-Stock

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6,069

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UNI Independent Distributors

Spain . 4,124 parts In-Stock

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Argo Parts USA

USA . 1,975 parts In-Stock

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Formix International (Excess)

India . 160 parts In-Stock

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160

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Aranea Global

USA . 100 parts In-Stock

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100

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Unleash the power of innovation with the LX2160XC72232B by NXP Semiconductors. This cutting-edge microprocessor offers unparalleled performance and reliability, backed by the trusted name of NXP Semiconductors. Ideal for a wide range of applications, this microprocessor delivers superior value and benefits to customers looking to elevate their technology solutions. Experience seamless integration, high-speed processing, and low power consumption with the LX2160XC72232B - the ultimate choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microprocessor, making it suitable for various applications.

Integrated Cache: YES

Integrated cache enhances the processing speed and efficiency of the microprocessor, improving overall performance.

Maximum Supply Voltage: 0.88 V

Operating within a lower maximum supply voltage helps in energy efficiency and extends the lifespan of the microprocessor.

Address Bus Width: 36

A wide address bus width allows for efficient data transfer and communication within the system.

Package Shape: SQUARE

Square package shape facilitates easier and more compact integration of the microprocessor into various electronic devices.

Bit Size: 64

64-bit processing capability enables handling of complex tasks and large amounts of data efficiently.

No. of Terminals: 1517

A high number of terminals allow for versatile connectivity options, enabling integration with a wide range of peripherals.

Maximum Operating Temperature: 105 °C

High maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for usage in cold environments without compromising performance.

Terminal Finish: TIN SILVER COPPER

Terminal finish provides good conductivity and corrosion resistance, ensuring stable connections.

External Data Bus Width: 128

A wide external data bus width allows for high-speed data transfer between the microprocessor and external devices.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this microprocessor can withstand demanding operating conditions.

Technical Specifications

Microprocessors LX2160XC72232B attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

36

Bit Size:

64

Boundary Scan:

YES

External Data Bus Width:

128

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1517

JESD-609 Code:

e1

Length:

40 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

12

No. of Serial I/Os:

17

No. of Terminals:

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA1517.39X39,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.51 mm

Speed:

2200 rpm

Maximum Supply Current:

.05 mA

Maximum Supply Voltage:

.88 V

Minimum Supply Voltage:

.82 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

40 mm

Peripheral IC Type:

Trade Compliance

LX2160XC72232B Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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