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SAM9X60D5MT-I/4FB

Microchip Technology

SAM9X60D5MT-I/4FB by Microchip Technology

SAM9X60D5MT-I/4FB by Microchip Technology is a MICROPROCESSOR with 16 DMA channels, 50 MHz clock frequency, and 1.8V supply voltage. Ideal for industrial applications, it features a CMOS technology, 233 terminals in a GRID ARRAY package style, and operates b/w -40 to 85 °C temperatures.

Median Price

$11.277

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$11.277

100+ parts

-

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1,000

$11.277

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Vyrian

USA . 8,658 parts In-Stock

1+ parts

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8,658

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 442 parts In-Stock

1+ parts

$8.000

100+ parts

-

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442

$8.000

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Semicontronic

India . 4,744 parts In-Stock

1+ parts

$8.990

100+ parts

$8.765

1k+ parts

$8.720

10k+ parts

-

4,744

$8.990

$8.765

$8.720

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Continental Prestige Electronics

USA . 1,283 parts In-Stock

1+ parts

$11.277

100+ parts

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$11.051

1,283

$11.277

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$11.051

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$11.277

100+ parts

$11.051

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-

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1,000

$11.277

$11.051

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AZTECH Wire

Italy . 455 parts In-Stock

1+ parts

$20.800

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455

$20.800

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Aztec Data Supply Inc.

USA . 6,426 parts In-Stock

1+ parts

$35.830

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6,426

$35.830

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Advanced Electronics

New Zealand . 61 parts In-Stock

1+ parts

$36.388

100+ parts

$34.568

1k+ parts

$34.568

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61

$36.388

$34.568

$34.568

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Corohmni

South Africa . 175 parts In-Stock

1+ parts

$68.903

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175

$68.903

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Argo Parts USA

USA . 742 parts In-Stock

1+ parts

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742

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RGB Technical Solutions

Ukraine . 706 parts In-Stock

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706

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

1+ parts

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100+ parts

$0.355

1k+ parts

$0.355

10k+ parts

$0.355

350

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$0.355

$0.355

$0.355

Overview

Elevate your projects with the SAM9X60D5MT-I/4FB by Microchip Technology, a top-tier microprocessor that delivers unparalleled performance and reliability. Manufactured by industry leader Microchip Technology, this microprocessor boasts advanced features like integrated cache and low power mode, making it ideal for a wide range of applications. From industrial automation to consumer electronics, this product offers exceptional value and benefits, providing customers with a cutting-edge solution to meet their needs. Choose the SAM9X60D5MT-I/4FB and experience the difference in quality and innovation today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product easy to handle and resistant to external impacts.

Integrated Cache: YES

Integrated cache helps improve processing speed by storing frequently accessed data closer to the processor, reducing access time.

Maximum Supply Voltage: 1.9 V

Higher supply voltage allows for better performance and processing capabilities.

On Chip Data RAM Width: 8

8-bit data RAM width enables efficient data storage and retrieval operations.

Address Bus Width: 6

6-bit address bus width allows for efficient memory addressing and access.

Package Shape: RECTANGULAR

Rectangular package shape helps in easy integration and fitting into electronic devices.

No. of Terminals: 233

Higher number of terminals provide more connectivity options and interfaces for peripherals.

Terminal Finish: TIN SILVER COPPER

TIN SILVER COPPER terminal finish ensures good conductivity and prevents oxidation, ensuring long-term reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature range ensures reliable operation under harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

RISC architecture allows for faster processing and improved performance in computing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making the product energy-efficient.

Technical Specifications

Microprocessors SAM9X60D5MT-I/4FB attributes and parameters. Explore more Microprocessors devices from Microchip Technology

Specs

Additional Features:

512-Mbit DDR2--SDRAM AVAILABLE

Address Bus Width:

6

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

R-PBGA-B233

JESD-609 Code:

e1

Length:

14 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

16

No. of Terminals:

233

On Chip Data RAM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA233,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Words:

69632

Maximum Seated Height:

1.2 mm

Speed:

600 rpm

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

SAM9X60D5MT-I/4FB Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Microchip Technology

Microchip Technology Incorporated is a leading provider of integrated circuit (IC) solutions for the global market. Founded in 1989, the company designs, manufactures, tests and markets state-of-the-art microcontrollers and analog devices for use in a wide array of electronics applications, such as the automotive industry, consumer electronics and industrial automation. Through its world-class production processes and technologies, Microchip Technology has become an innovator of semiconductor solutions that enable customers to maximize their performance while streamlining costs.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President and CEO

Ganesh Moorthy

Executive Chair

Steve Sanghi

CFO, Senior VP

J. Eric Bjornholt

Manufacturer fab locations 9

Fab name Location Fab Initiation Wafer Capacity

Fab 5 - Colorado

Fabrication

Fab Initiation

1995

USA

Colorado Springs

Wafer Capacity

70,000

1995

70,000

Santa Clara

Fabrication

Fab Initiation

1990

USA

Santa Clara

Wafer Capacity

1,290

1990

1,290

Lawrence

Fabrication

Fab Initiation

1989

USA

Lawrence

Wafer Capacity

5,000

1989

5,000

Fab 4 - Gresham

Fabrication

Fab Initiation

1988

USA

Gresham

Wafer Capacity

50,000

1988

50,000

Fab 2 - Tempe

Fabrication

Fab Initiation

1994

USA

Tempe

Wafer Capacity

30,000

1994

30,000

Beverly

Fabrication

Fab Initiation

1985

USA

Beverly

Wafer Capacity

2,000

1985

2,000

Lowell

Fabrication

Fab Initiation

1986

USA

Lowell

Wafer Capacity

15,000

1986

15,000

Garden Grove

Fabrication

Fab Initiation

1985

USA

Garden Grove

Wafer Capacity

12,000

1985

12,000

New Fab - Gresham

Fabrication

Fab Initiation

2024

USA

Gresham

Wafer Capacity

2024

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