Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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P2010NXN2MHC by NXP Semiconductors is a 32-bit microprocessor with integrated cache, featuring a 64-bit external data bus width and max clock frequency of 100 MHz. Ideal for low power applications, it has a terminal pitch of 1 mm and operates at a nominal voltage of 1.05 V.
Median Price
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The use of plastic/epoxy material for the package body ensures durability and protection for the microprocessor.
Having integrated cache improves the overall performance and speed of the microprocessor by reducing access time to frequently used data.
Surface mount capability makes it easier to integrate the microprocessor onto circuit boards, saving space and simplifying assembly processes.
Operating at a maximum supply voltage of 1.1 V helps in reducing power consumption and heat generation, promoting energy efficiency.
Having a wide address bus width of 16 allows for efficient communication between the microprocessor and memory, enhancing data transfer speeds.
The square package shape provides uniformity in design, making it easier to mount and align the microprocessor on circuit boards.
With a bit size of 32, the microprocessor can handle larger chunks of data simultaneously, improving computing performance and efficiency.
Having a high number of terminals allows for more connectivity options and interfaces, enabling versatile usage in various applications.
The grid array package style offers a compact and organized layout for the terminals, enhancing connectivity and ease of integration in complex systems.
Operating at a minimum supply voltage of 1 V ensures compatibility with low power applications and extends the lifespan of the microprocessor.
The use of tin silver as the terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.
Having terminals positioned at the bottom simplifies the assembly process and allows for more efficient heat dissipation, improving overall reliability.
With a maximum seated height of 2.46 mm, the microprocessor can be easily accommodated in compact devices without compromising on performance or functionality.
The width of 31 mm provides a balance between compactness and connectivity, allowing for easy integration into various electronic systems.
The presence of boundary scan capability enables efficient testing and troubleshooting of the microprocessor during manufacturing, improving quality control.
With a wide external data bus width of 64, the microprocessor can handle large data transfers with high speed and accuracy, enhancing overall performance.
Operating at a maximum clock frequency of 100 MHz allows for fast and efficient processing of instructions, enhancing the overall speed and responsiveness of the microprocessor.
The maximum time allowed at peak reflow temperature of 260°C for 40 seconds ensures proper soldering and placement of the microprocessor on circuit boards.
With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature manufacturing processes without compromising on performance or reliability.
The length of 31 mm provides a compact form factor for the microprocessor, making it suitable for integration in small electronic devices or systems.
Being a RISC-based microprocessor allows for simplified and efficient instruction execution, leading to enhanced performance and reduced power consumption.
The CMOS technology used in the microprocessor offers low power consumption, high noise immunity, and faster switching speeds, making it suitable for a wide range of applications.
Having ball-shaped terminals simplifies the mounting process and improves overall connectivity, ensuring stable and reliable operation of the microprocessor.
Operating at a nominal supply voltage of 1.05 V provides a balance between performance and energy efficiency, making the microprocessor suitable for various applications.
With a terminal pitch of 1 mm, the microprocessor allows for high-density mounting and efficient routing of signals, ensuring a compact and reliable circuit design.
Supporting floating-point calculations allows for high precision and accuracy in mathematical operations, making the microprocessor suitable for scientific and computational tasks.
Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.
Operating at a speed of 1200 rpm allows for efficient processing of instructions and data, enhancing the overall performance and responsiveness of the microprocessor.
The availability of a low power mode enables the microprocessor to operate in energy-efficient settings, prolonging battery life and reducing overall power consumption.
Microprocessors P2010NXN2MHC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P2010NXN2MHC Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LM107H
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Code: TO-99; Package Shape: ROUND;
2N7002
Silicon Standard
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): .225 W; Maximum Drain-Source On Resistance: 7.5 ohm; Transistor Element Material: SILICON;
2N7002,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Time At Peak Reflow Temperature (s): 30; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
PIC18F4550-I/P
Microchip Technology
PIC18F4550-I/P by Microchip Technology is an 8-bit microcontroller with a max clock frequency of 48 MHz. It features 13-Ch 10-Bit ADC channels and USB connectivity, making it ideal for industrial applications requiring low power consumption and high-speed data processing. With 2048 RAM bytes and 256 Data EEPROM size, this CMOS technology-based microcontroller offers versatile performance in various embedded systems.
BAV99+
Multicomp Pro
BAV99+ by Multicomp Pro is a series connected diode with 0.2A output current and 75V peak reverse voltage. Its 0.006us reverse recovery time makes it ideal for high-speed applications. This small outline rectifier diode is designed for surface mount installation in electronic circuits.
DS18B20U+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: SQUARE; Housing: PLASTIC; Minimum Supply Voltage: 3 V;
1N4148
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
4554
Jw Miller Magnetics
Other Semiconductors;
BAV99
Daco Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
2N2222A
Micropac Industries
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
SZNUP2105LT1G
Onsemi
SZNUP2105LT1G by Onsemi is a Transient Suppression Device with 2 elements in a common anode configuration. It has a max non-repetitive peak reverse power dissipation of 350W and breakdown voltage of 29.1V. Ideal for applications requiring bidirectional polarity protection, such as automotive electronics and industrial equipment due to its AEC-Q101 compliance and high clamping voltage of 44V.
Semiconductor Technology
NE555DR
Texas Instruments
NE555DR by Texas Instruments is an Analog Waveform Generation IC with 8 terminals, operating voltage of 5V, and power supplies ranging from 5-15V. It is a versatile component for pulse generation applications due to its small outline package and commercial temperature grade suitability.
Micro Commercial Components
FDLL4148
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
MPC8347EVRAGDB
NXP Semiconductors
NXP Semiconductors' MPC8347EVRAGDB microprocessor features 32-bit address and external data bus width, with a max clock frequency of 66 MHz. It is suitable for applications requiring integrated cache, low power mode, and boundary scan capabilities. The package style is grid array with 620 terminals, making it ideal for high-performance computing systems.
MCIMX6S1AVM08AC
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
MCIMX6S4AVM08AB
MCIMX6S4AVM08AB by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at up to 24 MHz. Ideal for automotive applications, it features integrated cache, low power mode, and boundary scan capabilities.
NHPXA270C5C312
Marvell Technology
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
AM3352BZCED60
AM3352BZCED60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 64 DMA channels, and 26 MHz clock frequency. Ideal for industrial applications requiring low power mode, it features a max operating temperature of 90°C and boundary scan capability.
MCF5270CVM150R2
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;
AM6411AKCGHAALV
AM6411AKCGHAALV by Texas Instruments is a 64-bit microprocessor with integrated cache and 16-bit on-chip data RAM. It operates at a max clock frequency of 25 MHz, suitable for industrial applications requiring low power consumption. This CMOS technology device features boundary scan and fine pitch grid array package style, making it ideal for high-performance computing systems.
KMPC885VR133
KMPC885VR133 by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and low power mode. It operates at a speed of 133 rpm, with a max supply voltage of 1.9 V. This processor is commonly used in applications requiring high performance and low power consumption.
MCF5275LCVM166
NXP Semiconductors' MCF5275LCVM166 microprocessor features 32-bit architecture, 83 MHz clock frequency, and integrated cache. Ideal for industrial applications requiring low power mode, with a temperature range of -40 to 85 °C. This microprocessor is designed for high-speed data processing in compact devices.
MCF5271CVM100
The NXP Semiconductors MCF5271CVM100 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 75 MHz. Ideal for industrial applications, it has a low power mode and supports boundary scan testing for efficient debugging.
MCF54450VM240J
MCF54450VM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It features a package style of grid array, low profile, and operates at speeds up to 240 rpm. Ideal for applications requiring low power mode and commercial temperature grade.
Z0840006PSC
Zilog
MICROPROCESSOR; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 40; Package Code: DIP; Package Shape: RECTANGULAR;
MCF54452VP266
MICROPROCESSOR; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
SMOMAPL138BGWTA3R
Texas Instruments SMOMAPL138BGWTA3R is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 30 MHz, suitable for industrial applications requiring low power mode and floating-point format processing. With a terminal pitch of 0.8 mm and 361 terminals, it offers high performance in a compact package style.
MPC8247CVRTIEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE;
MPC880ZP66
NXP Semiconductors' MPC880ZP66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for applications requiring a RISC-based microprocessor with a max supply voltage of 1.9V, such as embedded systems and industrial automation.
MPC5200CVR400BR2
NXP Semiconductors' MPC5200CVR400BR2 microprocessor features 32-bit address and external data bus width, with a clock frequency of 35 MHz. Ideal for industrial applications, it operates at temperatures ranging from -40 to 85 °C, offering low power mode and integrated cache for efficient performance.
MC68HC000EI8R2
MC68HC000EI8R2 by Freescale: 32-bit microprocessor, 5V supply, CMOS technology. Ideal for commercial applications requiring high-speed processing in a compact square chip carrier package.
XAM3517AZCN
XAM3517AZCN by Texas Instruments is a Microprocessor with 32-bit External Data Bus, 15-bit Address Bus, and integrated cache. It operates at a max clock frequency of 59 MHz and supports low power mode. Ideal for applications requiring high-speed processing in compact devices.
ADSP-BF609BBCZ-5
Analog Devices
ADSP-BF609BBCZ-5 by Analog Devices is a 32-bit microprocessor with integrated cache, operating at max 60 MHz clock frequency. Ideal for industrial applications, it features low power mode and boundary scan capability. Package style is grid array with 349 terminals in a square shape measuring 19mm x 19mm.
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P2010NXN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.1 V;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
P2010NXN2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
P2010NXE2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
P2010NSE2MFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);
P2010NSN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P2010NXE2HFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1 V;
P2010NSN2NHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
P2010NSN2HFC
P2010NSE2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Length: 31 mm;
P2010NXE2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
P2010NSN2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
P2010NXE2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Speed: 1000 rpm;
P2010NSN2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;
P2010NSE2MHC
P2010NSN2KHC,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.46 mm;
P2010NXN2KHC
Supply Digital Components
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