Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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P2010NXN2MHC by NXP Semiconductors is a 32-bit microprocessor with integrated cache, featuring a 64-bit external data bus width and max clock frequency of 100 MHz. Ideal for low power applications, it has a terminal pitch of 1 mm and operates at a nominal voltage of 1.05 V.
Median Price
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The use of plastic/epoxy material for the package body ensures durability and protection for the microprocessor.
Having integrated cache improves the overall performance and speed of the microprocessor by reducing access time to frequently used data.
Surface mount capability makes it easier to integrate the microprocessor onto circuit boards, saving space and simplifying assembly processes.
Operating at a maximum supply voltage of 1.1 V helps in reducing power consumption and heat generation, promoting energy efficiency.
Having a wide address bus width of 16 allows for efficient communication between the microprocessor and memory, enhancing data transfer speeds.
The square package shape provides uniformity in design, making it easier to mount and align the microprocessor on circuit boards.
With a bit size of 32, the microprocessor can handle larger chunks of data simultaneously, improving computing performance and efficiency.
Having a high number of terminals allows for more connectivity options and interfaces, enabling versatile usage in various applications.
The grid array package style offers a compact and organized layout for the terminals, enhancing connectivity and ease of integration in complex systems.
Operating at a minimum supply voltage of 1 V ensures compatibility with low power applications and extends the lifespan of the microprocessor.
The use of tin silver as the terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections for optimal performance.
Having terminals positioned at the bottom simplifies the assembly process and allows for more efficient heat dissipation, improving overall reliability.
With a maximum seated height of 2.46 mm, the microprocessor can be easily accommodated in compact devices without compromising on performance or functionality.
The width of 31 mm provides a balance between compactness and connectivity, allowing for easy integration into various electronic systems.
The presence of boundary scan capability enables efficient testing and troubleshooting of the microprocessor during manufacturing, improving quality control.
With a wide external data bus width of 64, the microprocessor can handle large data transfers with high speed and accuracy, enhancing overall performance.
Operating at a maximum clock frequency of 100 MHz allows for fast and efficient processing of instructions, enhancing the overall speed and responsiveness of the microprocessor.
The maximum time allowed at peak reflow temperature of 260°C for 40 seconds ensures proper soldering and placement of the microprocessor on circuit boards.
With a peak reflow temperature of 260°C, the microprocessor can withstand high-temperature manufacturing processes without compromising on performance or reliability.
The length of 31 mm provides a compact form factor for the microprocessor, making it suitable for integration in small electronic devices or systems.
Being a RISC-based microprocessor allows for simplified and efficient instruction execution, leading to enhanced performance and reduced power consumption.
The CMOS technology used in the microprocessor offers low power consumption, high noise immunity, and faster switching speeds, making it suitable for a wide range of applications.
Having ball-shaped terminals simplifies the mounting process and improves overall connectivity, ensuring stable and reliable operation of the microprocessor.
Operating at a nominal supply voltage of 1.05 V provides a balance between performance and energy efficiency, making the microprocessor suitable for various applications.
With a terminal pitch of 1 mm, the microprocessor allows for high-density mounting and efficient routing of signals, ensuring a compact and reliable circuit design.
Supporting floating-point calculations allows for high precision and accuracy in mathematical operations, making the microprocessor suitable for scientific and computational tasks.
Having a moisture sensitivity level of 3 indicates that the microprocessor can withstand moderate exposure to moisture during handling and storage, ensuring long-term reliability.
Operating at a speed of 1200 rpm allows for efficient processing of instructions and data, enhancing the overall performance and responsiveness of the microprocessor.
The availability of a low power mode enables the microprocessor to operate in energy-efficient settings, prolonging battery life and reducing overall power consumption.
Microprocessors P2010NXN2MHC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Bit Size:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P2010NXN2MHC Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.2
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
1N4148
Rugao Dachang Electronic
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Rochester Electronics
BSS138LT1G
Onsemi
BSS138LT1G by Onsemi is a N-CHANNEL FET with 50V DS Breakdown Voltage, 0.2A Drain Current, and 3.5 ohm On Resistance. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and built-in DIODE. Operates b/w -55 to 150 °C with small outline package style for surface mount assembly.
Diotec Semiconductor Ag
MBR1560CT
General Instrument
MBR1560CT by General Instrument is a common cathode rectifier diode with a max forward voltage of 0.75V and max output current of 15A. It is used for efficiency applications, has a package shape of rectangular, and can operate in temperatures ranging from -65 to 150 °C.
BAV99
Weitron Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; Maximum Output Current: .215 A; JESD-609 Code: e0; Maximum Forward Voltage (VF): .715 V;
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
ERJ3EKF1002V
Panasonic
Panasonic's ERJ3EKF1002V is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in automotive electronics due to AEC-Q200 compliance.
Itt Semiconductor
ATMEGA328P-AU
Atmel
MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE;
SS14
Pro-an Electronic
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
1N4148WS
Panjit International
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803ADWR
Texas Instruments
ULN2803ADWR by Texas Instruments is a peripheral driver with 8 functions, open-collector output characteristics, and built-in transient protections. It operates b/w -40 to 85°C, has a max supply voltage of 3V, and is ideal for buffer or inverter-based applications requiring sink current flow direction.
SMBJ18CA
Brightking
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
Meritek Electronics
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MCF54418CMJ250
NXP Semiconductors
The NXP Semiconductors MCF54418CMJ250 microprocessor features a 32-bit architecture, integrated cache, and operates at a max clock frequency of 100 MHz. Ideal for industrial applications requiring low power consumption, it supports multiple power supplies (1.2V, 1.8V, 3.3V) and has a temperature range of -40 to 85°C.
ATSAMA5D36A-CNR
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 324; Package Code: LFBGA; Package Shape: SQUARE;
A80960KA25
Intel
The Intel A80960KA25 microprocessor features 32-bit address and data bus width, integrated cache, and operates at a max clock frequency of 32 MHz. Ideal for applications requiring high-speed processing such as embedded systems, industrial automation, and telecommunications equipment.
AM5706BCBDDEA
The Texas Instruments AM5706BCBDDEA microprocessor features a 32-bit external data bus, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at a max clock frequency of 38.4 MHz with low power mode support. The package style is grid array with 538 terminals in a square shape.
MPC5123VY400B
Freescale Semiconductor
The Freescale Semiconductor MPC5123VY400B microprocessor features a 32-bit address and external data bus width, with a max clock frequency of 35 MHz. It is suitable for applications requiring low power mode, such as embedded systems and industrial automation. The package style includes a grid array and heat sink/slug design for efficient thermal management.
MCIMX537CVP8C2
MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.
AM3517AZCNA
AM3517AZCNA by Texas Instruments is a Microprocessor with 16-bit Address Bus, 8-bit On Chip Data RAM Width, and 65536 RAM Words. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing in compact devices.
ATSAMA5D27C-LD2G-CU
Microchip Technology
Microchip's ATSAMA5D27C-LD2G-CU is a Microprocessor with 16-bit Bit Size, 24 MHz Clock Frequency, and 1.8 V Nominal Voltage. Ideal for industrial applications requiring low power consumption and high-speed processing capabilities.
AM3352BZCZ100
AM3352BZCZ100 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications in various industries like IoT and industrial automation. The package style is grid array with 324 terminals, making it ideal for surface mount assembly.
P1021NSE2HFB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Nominal Supply Voltage: 1 V;
MPC8343CVRAGDB
MICROPROCESSOR; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 620; Package Code: BGA; Package Shape: SQUARE;
405
Ibm Microelectronics
Microprocessors;
MCIMX31CVMN4D
MCIMX31CVMN4D by NXP Semiconductors is a MICROPROCESSOR with 1.5V and 3.3V power supplies, suitable for I2C, SPI, UART, and USB bus compatibility. It has 9 I/O lines and can withstand peak reflow temperature of 260°C for up to 40 seconds. Ideal for applications requiring high-performance RISC-based processing in various electronic devices.
STM32MP153DAB1
STMicroelectronics
MICROPROCESSOR, RISC;
SPC5200CBV400B
NXP Semiconductors' SPC5200CBV400B is a 32-bit microprocessor with integrated cache and a max clock frequency of 66 MHz. It is commonly used in industrial applications due to its low power mode and temperature grade.
ATSAMA5D27C-CNR
ATSAMA5D27C-CNR by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 24 MHz clock frequency, and 1.25 V nominal voltage. It is ideal for industrial applications requiring low power consumption and high-speed processing capabilities. The processor features integrated cache, boundary scan support, and 32 DMA channels for efficient data handling.
MCIMX6X2EVN10AB
MICROPROCESSOR, RISC; JESD-609 Code: e1; Terminal Finish: TIN SILVER COPPER; Moisture Sensitivity Level (MSL): 3; Technology: CMOS;
ATSAMA5D34A-CUR
MCF5328CVM240
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MC9328MXLVH15
Motorola
MC9328MXLVH15 by Motorola is a 32-bit microprocessor with integrated cache and 25-bit address bus width. It operates at a max clock frequency of 16 MHz, suitable for low power applications in commercial temperature grade environments. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
P2010NXN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Supply Voltage: 1.1 V;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
P2010NXN2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 40;
P2010NXE2MHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
P2010NSE2MFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Peak Reflow Temperature (C): 260;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: Tin/Silver (Sn/Ag);
P2010NSN2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 100 MHz;
P2010NXE2HFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1 V;
P2010NSN2NHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
P2010NSN2HFC
P2010NSE2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Length: 31 mm;
P2010NXE2KFC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Format: FLOATING POINT;
P2010NSN2HHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
P2010NXE2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Speed: 1000 rpm;
P2010NSN2KHC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 64;
P2010NSE2MHC
P2010NSN2KHC,557
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 689; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 2.46 mm;
P2010NXN2KHC
Supply Digital Components
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