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AM3354BZCZA60

Texas Instruments

AM3354BZCZA60 by Texas Instruments

AM3354BZCZA60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and max clock frequency of 26 MHz. Ideal for industrial applications requiring low power mode, it features a terminal pitch of 0.8 mm and operates at temperatures ranging from -40 to 105 °C.

Median Price

$17.000

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,640 parts In-Stock

1+ parts

$13.859

100+ parts

$12.106

1k+ parts

$8.349

10k+ parts

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1,640

$13.859

$12.106

$8.349

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Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$20.140

100+ parts

$12.170

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$12.080

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26

$20.140

$12.170

$12.080

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,487 parts In-Stock

1+ parts

$13.166

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2,487

$13.166

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Nova Conductors

Japan . 50 parts In-Stock

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$16.330

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50

$16.330

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Vyrian

USA . 5,822 parts In-Stock

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5,822

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Chip Stock

USA . 3,591 parts In-Stock

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VNN

France . 947 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 777 parts In-Stock

1+ parts

$11.780

100+ parts

$11.486

1k+ parts

$11.427

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777

$11.780

$11.486

$11.427

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Ampacity Inc.

Singapore . 471 parts In-Stock

1+ parts

$11.780

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471

$11.780

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Corphita

USA . 3,312 parts In-Stock

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$12.473

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$12.473

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Continental Prestige Electronics

USA . 6,574 parts In-Stock

1+ parts

$16.330

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$16.003

6,574

$16.330

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$16.003

Corohmni

South Africa . 599 parts In-Stock

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$18.148

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599

$18.148

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Microchip USA

USA . 2,652 parts In-Stock

1+ parts

$40.010

100+ parts

$39.440

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$39.150

10k+ parts

$38.870

2,652

$40.010

$39.440

$39.150

$38.870

Parana Technologies

USA . 1,654 parts In-Stock

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$58.362

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1,654

$58.362

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ChromeModa Solutions

Germany . 5,607 parts In-Stock

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$65.575

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$53.772

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5,607

$65.575

$53.772

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IDEA Electronic Components Group

UK . 788 parts In-Stock

1+ parts

$65.575

100+ parts

$62.296

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$59.018

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788

$65.575

$62.296

$59.018

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$86.779

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$82.440

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$82.440

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200

$86.779

$82.440

$82.440

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Lixinc

USA . 18,210 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,201 parts In-Stock

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Argo Parts USA

USA . 2,745 parts In-Stock

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DigiPath Technology Company

USA . 1,451 parts In-Stock

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$59.122

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Authorized Procurement Solutions

USA . 1,100 parts In-Stock

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Perfect Parts

USA . 847 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$16.003

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$15.513

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$15.187

500

-

$16.003

$15.513

$15.187

Robosynatics

Brazil . 100 parts In-Stock

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Lucentia Tech

USA . 100 parts In-Stock

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$27.355

1k+ parts

$25.331

10k+ parts

$25.331

100

-

$27.355

$25.331

$25.331

Overview

Experience the superior performance and reliability of the AM3354BZCZA60 microprocessor by Texas Instruments. With a focus on quality and innovation, Texas Instruments is a trusted manufacturer in the industry. This powerful microprocessor is perfect for a wide range of applications, offering customers value and benefits like high-speed processing, low power consumption, and seamless integration. Upgrade your projects with the AM3354BZCZA60 and enjoy the advantages it brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache helps in improving the performance by storing frequently accessed data.

Maximum Supply Voltage: 1.144 V

The maximum supply voltage of 1.144V ensures safe operation within specified limits.

Address Bus Width: 28

Having a wider address bus width allows for the efficient handling of memory addresses.

Bit Size: 32

With a bit size of 32, this microprocessor can handle a large range of data efficiently.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature of 105°C makes it suitable for industrial applications where heat resistance is required.

RAM Words: 131072

With a large RAM word count, this microprocessor can store and process a significant amount of data efficiently.

Technology: CMOS

Being based on CMOS technology ensures low power consumption and high-speed performance.

Maximum Supply Current: 400 mA

With a maximum supply current of 400mA, this microprocessor operates efficiently without drawing excessive power.

Low Power Mode: YES

The availability of a low power mode allows for energy-efficient operation, reducing overall power consumption.

Technical Specifications

Microprocessors AM3354BZCZA60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCZA60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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