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AM3358BZCZ60

Texas Instruments

AM3358BZCZ60 by Texas Instruments

AM3358BZCZ60 by Texas Instruments is a 32-bit microprocessor with integrated cache and 131072 RAM words. It operates at a max clock frequency of 26 MHz, suitable for low power applications like IoT devices due to its low supply voltage range of 0.95-1.1 V and boundary scan feature.

Median Price

$15.724

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,958 parts In-Stock

1+ parts

$12.819

100+ parts

$11.197

1k+ parts

$7.722

10k+ parts

-

1,958

$12.819

$11.197

$7.722

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Mouser Electronics

USA . 57 parts In-Stock

1+ parts

$18.630

100+ parts

$11.280

1k+ parts

$11.180

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57

$18.630

$11.280

$11.180

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,731 parts In-Stock

1+ parts

$12.178

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3,731

$12.178

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Nova Conductors

Japan . 1,000 parts In-Stock

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$15.100

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$15.100

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Vyrian

USA . 6,559 parts In-Stock

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6,559

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Chip Stock

USA . 5,306 parts In-Stock

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VNN

France . 2,784 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 674 parts In-Stock

1+ parts

$10.900

100+ parts

$10.628

1k+ parts

$10.573

10k+ parts

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674

$10.900

$10.628

$10.573

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Corphita

USA . 4,584 parts In-Stock

1+ parts

$11.537

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4,584

$11.537

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Continental Prestige Electronics

USA . 474 parts In-Stock

1+ parts

$13.846

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-

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$13.569

474

$13.846

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$13.569

Ampacity Inc.

Singapore . 750 parts In-Stock

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$23.720

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750

$23.720

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Parana Technologies

USA . 218 parts In-Stock

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$41.067

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218

$41.067

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Corohmni

South Africa . 938 parts In-Stock

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$44.634

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938

$44.634

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DigiPath Technology Company

USA . 1,410 parts In-Stock

1+ parts

$45.220

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$41.603

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1,410

$45.220

$41.603

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ChromeModa Solutions

Germany . 3,685 parts In-Stock

1+ parts

$46.143

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$37.837

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3,685

$46.143

$37.837

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IDEA Electronic Components Group

UK . 474 parts In-Stock

1+ parts

$46.143

100+ parts

$43.836

1k+ parts

$41.529

10k+ parts

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474

$46.143

$43.836

$41.529

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$78.055

100+ parts

$74.153

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$74.153

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2,000

$78.055

$74.153

$74.153

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Lixinc

USA . 9,428 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 2,036 parts In-Stock

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2,036

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Perfect Parts

USA . 113 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the AM3358BZCZ60 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality with their microprocessors, setting the standard for performance and reliability. With a wide range of applications in various industries, this product offers unmatched value, benefits, and advantages to customers looking for seamless integration, efficient processing, and superior functionality. Elevate your projects to new heights with the AM3358BZCZ60 and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and can withstand various environmental conditions, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor, leading to better overall performance.

Maximum Supply Voltage: 1.144 V

The higher maximum supply voltage allows for more flexibility in power management and helps in optimizing performance based on power consumption.

Address Bus Width: 28

A wider address bus width enables the microprocessor to access a larger memory space, enhancing its capability to handle complex data processing tasks.

Maximum Operating Temperature: 90 °C

With a high maximum operating temperature, the microprocessor can perform reliably under intense computing tasks without overheating.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a microprocessor with Reduced Instruction Set Computing (RISC) architecture, it is optimized for efficient processing of instructions, leading to faster performance.

Technology: CMOS

Complementary Metal-Oxide-Semiconductor (CMOS) technology offers low power consumption and high noise immunity, making the microprocessor energy-efficient and reliable in noisy environments.

Technical Specifications

Microprocessors AM3358BZCZ60 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

90 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

600 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.144 V

Minimum Supply Voltage:

1.056 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3358BZCZ60 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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