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AM3352BZCZA100

Texas Instruments

AM3352BZCZA100 by Texas Instruments

AM3352BZCZA100 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words and 64 DMA channels. It operates at a max clock frequency of 26 MHz, suitable for industrial applications requiring low power mode and fixed point format processing. The package style is grid array, low profile, fine pitch with a terminal pitch of 0.8 mm.

Median Price

$17.696

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 126 parts In-Stock

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$10.733

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Texas Instruments

USA . 130,926 parts In-Stock

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$13.954

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$12.189

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$8.406

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Arrow

USA . 60 parts In-Stock

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$17.653

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$13.760

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$11.653

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$11.264

60

$17.653

$13.760

$11.653

$11.264

Verical

USA . 5 parts In-Stock

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$17.740

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$17.740

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Mouser Electronics

USA . 538 parts In-Stock

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$18.920

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$14.010

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$12.200

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538

$18.920

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DigiKey

USA . 86 parts In-Stock

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$18.920

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$14.085

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$12.210

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Distributors (In-Stock)

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Digiode

USA . 1,602 parts In-Stock

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$10.196

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Maritex

Poland . 155 parts In-Stock

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$15.166

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$9.466

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$7.684

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155

$15.166

$9.466

$7.684

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Nova Conductors

Japan . 500 parts In-Stock

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$18.978

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Chip Stock

USA . 38,500 parts In-Stock

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Vyrian

USA . 22,273 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,357 parts In-Stock

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VNN

France . 4,018 parts In-Stock

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Rotakorn

Sweden . 3,402 parts In-Stock

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Sensible Micro Corp

USA . 2,518 parts In-Stock

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Diverse Electronics

Canada . 100 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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NexGen Digital

USA . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 22,233 parts In-Stock

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$9.120

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$9.120

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Semicontronic

India . 21,943 parts In-Stock

1+ parts

$9.120

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$8.892

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$8.846

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$9.120

$8.892

$8.846

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Corphita

USA . 84 parts In-Stock

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$9.660

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$9.660

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Continental Prestige Electronics

USA . 1,470 parts In-Stock

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$17.396

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$17.048

1,470

$17.396

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$17.048

Modulus Dynamics

Lithuania . 870 parts In-Stock

1+ parts

$21.065

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$20.855

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$20.223

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$21.065

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$20.223

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Parana Technologies

USA . 1,180 parts In-Stock

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$22.860

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$23.521

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$22.860

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$23.521

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DigiPath Technology Company

USA . 531 parts In-Stock

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$25.171

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531

$25.171

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IDEA Electronic Components Group

UK . 1,473 parts In-Stock

1+ parts

$25.685

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$24.401

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$23.116

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1,473

$25.685

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ChromeModa Solutions

Germany . 1,150 parts In-Stock

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$25.685

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$21.062

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Corohmni

South Africa . 519 parts In-Stock

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Microchip USA

USA . 1,362 parts In-Stock

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$53.410

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$52.480

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$52.010

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$51.550

1,362

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$52.480

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$51.550

Advanced Electronics

New Zealand . 42 parts In-Stock

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$71.202

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$67.642

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Perfect Parts

USA . 24,446 parts In-Stock

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S.R.D Solutions

India . 17,000 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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Argo Parts USA

USA . 3,791 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,297 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,656 parts In-Stock

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Kepictronics

USA . 2,520 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$18.598

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$18.029

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$17.649

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$18.598

$18.029

$17.649

Alle Elektronik GmbH

Germany . 1,358 parts In-Stock

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Lixinc

USA . 1,174 parts In-Stock

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Authorized Procurement Solutions

USA . 474 parts In-Stock

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474

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Robosynatics

Brazil . 10 parts In-Stock

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$1.230

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$1.230

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$1.230

10

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$1.230

$1.230

$1.230

Lucentia Tech

USA . 10 parts In-Stock

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$1.230

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$1.230

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$1.230

10

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$1.230

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$1.230

Overview

Elevate your electronic designs with the Texas Instruments AM3352BZCZA100 Microprocessor. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that surpasses industry standards. The AM3352BZCZA100 is ideal for a wide range of applications in various industries, providing exceptional performance and efficiency. With features like integrated cache and low power mode, this microprocessor offers unmatched value and benefits to customers looking for reliable and high-performing solutions. Upgrade your projects today with the AM3352BZCZA100 from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microprocessor, ensuring long-term reliability.

Integrated Cache: YES

Having integrated cache helps improve the speed and efficiency of data processing, making this microprocessor suitable for performance-intensive tasks.

Maximum Supply Voltage: 1.378 V

The high maximum supply voltage allows for efficient power delivery, ensuring stable performance under varying load conditions.

On Chip Data RAM Width: 8

With a wide data RAM width, this microprocessor can handle larger amounts of data at once, enhancing its processing capabilities.

Address Bus Width: 28

The wide address bus width enables efficient communication between the microprocessor and memory, facilitating speedy data access and retrieval.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit layouts, optimizing space utilization in electronic devices.

Bit Size: 32

The 32-bit architecture enables this microprocessor to process data in larger chunks, contributing to faster execution of instructions.

Power Supplies (V): 0.95/1.1

The availability of multiple power supply options allows for flexibility in voltage regulation, adapting to different power requirements as needed.

No. of Terminals: 324

Having a high number of terminals enables ample connectivity options, supporting various input and output configurations for versatile use.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The grid array style with low profile and fine pitch design enhances thermal dissipation and signal integrity, contributing to overall system performance.

Minimum Supply Voltage: 1.272 V

The low minimum supply voltage ensures efficient power consumption, reducing energy wastage and operating costs.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature range allows for reliable performance in demanding environmental conditions, enhancing the microprocessor's durability.

Minimum Operating Temperature: -40 °C

The wide temperature range enables this microprocessor to function optimally in both hot and cold environments, increasing its usability in diverse settings.

Terminal Finish: TIN SILVER COPPER

The use of quality terminal finish materials like tin, silver, and copper ensures good conductivity and resistance to corrosion, maintaining signal integrity over time.

Terminal Position: BOTTOM

The bottom terminal position simplifies installation and connection processes, allowing for easier integration into electronic systems.

Maximum Seated Height: 1.4 mm

The low maximum seated height contributes to a compact overall design, enabling this microprocessor to fit into space-constrained devices.

RAM Words: 131072

With a large number of RAM words, this microprocessor can efficiently store and access data during processing, enhancing overall system performance.

Width: 15 mm

The compact width of this microprocessor allows for easy placement on circuit boards, optimizing layout efficiency in electronic devices.

Boundary Scan: YES

The presence of boundary scan capability aids in testing and diagnosing the integrity of connections, ensuring reliable performance and ease of maintenance.

External Data Bus Width: 16

The wide external data bus width facilitates high-speed data transfer between the microprocessor and external devices, enhancing system responsiveness.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency allows for rapid processing of instructions and data, making this microprocessor suitable for tasks requiring quick response times.

Maximum Time At Peak Reflow Temperature (s): 30

The short time duration at peak reflow temperature ensures proper soldering and assembly of the microprocessor, maintaining structural integrity during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance enables reliable soldering and assembly processes, ensuring the microprocessor's longevity and performance.

Length: 15 mm

The compact length of this microprocessor contributes to a space-saving design, allowing for efficient utilization of board space in electronic devices.

Temperature Grade: INDUSTRIAL

Designed for industrial-grade applications, this microprocessor offers robust performance and reliability in harsh environmental conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

Being a RISC-based microprocessor, it features a streamlined instruction set for efficient processing, making it ideal for high-performance computing tasks.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, enhancing the efficiency and performance of this microprocessor.

Terminal Form: BALL

The ball terminal form provides secure connections and efficient heat dissipation, contributing to the overall reliability and longevity of the microprocessor.

Maximum Supply Current: 400 mA

The moderate maximum supply current requirement ensures efficient power usage and thermal management, contributing to the microprocessor's reliability and longevity.

Nominal Supply Voltage: 1.325 V

The specified nominal supply voltage ensures stable and consistent power delivery, supporting reliable performance in various operating conditions.

No. of DMA Channels: 64

The high number of DMA channels enables efficient data transfer and processing, enhancing the microprocessor's ability to handle multiple tasks simultaneously.

Terminal Pitch: 0.8 mm

The fine terminal pitch allows for compact design and efficient signal routing, optimizing space utilization and signal transmission in electronic devices.

Format: FIXED POINT

The fixed-point format simplifies arithmetic calculations and data processing, making this microprocessor suitable for applications requiring precision and accuracy.

Moisture Sensitivity Level (MSL): 3

With a moderate moisture sensitivity level, this microprocessor can withstand typical humidity levels during storage and operation, ensuring long-term reliability.

Speed: 1000 rpm

The specified speed rating ensures efficient data processing and execution, making this microprocessor suitable for high-speed computing applications.

Low Power Mode: YES

The availability of a low power mode option enables energy-efficient operation, prolonging battery life and reducing overall power consumption in electronic devices.

Technical Specifications

Microprocessors AM3352BZCZA100 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

1000 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.378 V

Minimum Supply Voltage:

1.272 V

Nominal Supply Voltage:

1.325 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3352BZCZA100 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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