Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MC7448TVU1267ND by NXP Semiconductors is a microprocessor with integrated cache and a max clock frequency of 200 MHz. It has a low power mode and is suitable for applications requiring high processing speed, such as embedded systems and industrial automation.
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Corphita
The ceramic material enhances the durability and stability of the microprocessor, making it a reliable choice for long-term usage.
The integrated cache improves the overall performance of the microprocessor by providing faster access to frequently used data, making it an efficient option for multitasking applications.
The surface mount feature allows for easy installation and compatibility with a wide range of electronic devices, making this microprocessor versatile and adaptable.
With a higher maximum supply voltage, this microprocessor can handle demanding tasks and provide a consistent and reliable power source, making it an ideal choice for high-performance computing.
The square package shape optimizes space utilization, making this microprocessor suitable for compact devices where size is a critical factor.
With a large number of terminals, this microprocessor enables seamless connectivity and integration with peripheral devices, expanding the range of compatible applications.
The grid array package style ensures better thermal dissipation, enhancing the microprocessor's ability to handle high-frequency operations, making it an excellent choice for demanding computing tasks.
The low minimum supply voltage allows for energy efficiency and reduced power consumption, making this microprocessor suitable for battery-powered devices and environmentally conscious applications.
The bottom terminal position facilitates efficient heat dissipation by providing a direct connection with the heat sink, ensuring optimal operating temperatures, and making this microprocessor ideal for cooling-sensitive applications.
With a low maximum seated height, this microprocessor is suitable for slim and compact designs where space is restricted, offering versatility in various form factors.
The compact width of this microprocessor enables easy integration into space-constrained systems, making it a reliable choice for small-scale applications.
The inclusion of boundary scan capability simplifies testing and debugging procedures, improving efficiency during development and making this microprocessor a reliable choice for designers.
With a high maximum clock frequency, this microprocessor can handle demanding computational tasks, ensuring swift execution and making it suitable for applications requiring high-speed processing.
With a longer maximum time at peak reflow temperature, this microprocessor allows for more precise soldering and PCB assembly processes, ensuring reliable connections and making it a preferred choice for manufacturing efficiency.
The high peak reflow temperature ensures robust solder joints, minimizing the risk of failures due to thermal stress, guaranteeing the reliability and longevity of this microprocessor.
The compact length of this microprocessor enhances its compatibility with various system designs and form factors, making it a versatile and space-efficient choice.
Being a RISC-based microprocessor, it offers efficient execution of instructions and streamlined data processing, making it ideal for applications requiring high performance and reduced power consumption.
The CMOS technology employed in this microprocessor offers a balance between power consumption and processing capabilities, ensuring energy efficiency while delivering reliable performance for a wide range of applications.
The ball terminal form facilitates reliable electrical connections during installation, ensuring stable performance and making this microprocessor suitable for applications with varying operational conditions.
The nominal supply voltage provides a stable and consistent power source, contributing to the overall efficiency and reliability of this microprocessor in a variety of electrical environments.
With a standard terminal pitch, this microprocessor allows for easy integration and compatibility with various PCB layouts, simplifying the design and assembly processes and making it a convenient choice for designers.
The floating-point format enables accurate and efficient processing of decimal numbers, ensuring precise calculations in applications such as scientific computing or graphics-intensive tasks.
With a high speed of 1267 rpm, this microprocessor provides fast data processing and quick response times, making it a suitable choice for time-critical applications or real-time systems.
The low power mode feature enables energy-saving operation and extended battery life, making this microprocessor an excellent choice for battery-powered devices or applications where energy efficiency is crucial.
Microprocessors MC7448TVU1267ND attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
MC7448TVU1267ND Peripheral ICs trade compliance attributes, and parameters.
ECCN
3A991.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148
Frontier Electronics
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
LM7805CT
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Maximum Input Voltage Absolute: 35 V; Maximum Voltage Tolerance: 5 %; Operating Temperature (TJ-Min): 0 Cel; Technology: BIPOLAR;
LM317T
Inchange Semiconductor
Other Regulators; No. of Terminals: 3; Surface Mount: NO; Technology: BIPOLAR; Minimum Output Voltage-1: 1.2 V; No. of Outputs: 1;
LM358MX
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
06035C104KAT2A
KYOCERA AVX
06035C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
LL4148
Excel (Suzhou) Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DRV5053VAQLPG
Texas Instruments
Texas Instruments DRV5053VAQLPG is a magnetic field sensor with 2.5-38V supply voltage range, -40 to 125°C operating temperature, and 0-2V output. Ideal for applications requiring Hall effect sensors like automotive, industrial automation, and robotics due to its compact size (1.52" x 4mm) and high output current capability of 2.3A.
FDC5614P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.6 W; Transistor Application: SWITCHING; Maximum Drain Current (ID): 3 A;
Sangdest Microelectronics (Nanjing)
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
Sinyork
RECTIFIER DIODE; Surface Mount: YES; Config: SINGLE; No. of Phases: 1; No. of Elements: 1; Maximum Repetitive Peak Reverse Voltage: 100 V;
Shenzhen Yixinsemi Electronics
B340A-13-F
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMBJ18CA
Uniohm
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M85049/85-08W02
TE Connectivity
CONNECTOR ACCESSORY; Minimum Operating Temperature: -65 Cel; Wire Gauge (AWG): 0; Maximum Wire Size: 0 AWG; Maximum Operating Temperature: 175 Cel; Material: ALUMINUM ALLOY;
MMBT2222ALT1G
MMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, max power dissipation of 0.3W, and hFE of 75. Ideal for switching applications, it operates b/w -55 to 150 °C with a max collector-emitter voltage of 40V. This surface-mount device has a transition frequency of 300MHz and turn-on time of 35ns.
Surge Components
Transys Electronics
MCF5474VR266
NXP Semiconductors
NXP Semiconductors' MCF5474VR266 microprocessor features 32-bit address bus width, 8-word on-chip data RAM, and integrated cache. Ideal for commercial applications requiring a max clock frequency of 66.67 MHz and low power mode support.
MC9328MX1CVM15R2
Freescale Semiconductor
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
MCF5235CVM150
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LBGA; Package Shape: SQUARE;
MPC8308CVMAGD
The Freescale Semiconductor MPC8308CVMAGD microprocessor features integrated cache, operates at a max clock frequency of 66.67 MHz, and has a low power mode for energy efficiency. Ideal for industrial applications requiring high-speed processing in a compact form factor with a temperature range from -40 to 105 °C.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
MPC860TCZQ50D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
P1010NXN5HFB
The NXP Semiconductors P1010NXN5HFB microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates b/w -40 to 105°C with a max supply voltage of 1.05V. With a grid array package style and fine pitch, this CMOS technology-based processor offers high performance in compact designs.
RTPXA270C5C520
Intel
The Intel RTPXA270C5C520 microprocessor features a 32-bit architecture with integrated cache and operates at a max clock frequency of 3.6864 MHz. It is designed for low power mode applications, with a nominal voltage of 1.45 V and boundary scan capability for efficient testing.
MPC8270CVVUPEA
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 480; Package Code: LBGA; Package Shape: SQUARE;
MIMXRT106LCVL5B
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
P1010NXE5FFA
MICROPROCESSOR, RISC; No. of Terminals: 425; Maximum Time At Peak Reflow Temperature (s): 40; Package Body Material: PLASTIC/EPOXY; Peak Reflow Temperature (C): 260; Qualification: Not Qualified;
DM388AAAR11F
Texas Instruments DM388AAAR11F microprocessor features 32-bit architecture, 609 terminals, and 655360 RAM words. With a clock frequency of 30 MHz, it is suitable for applications requiring high-speed processing such as embedded systems and IoT devices. The processor's low power mode and integrated cache make it ideal for energy-efficient designs in various industries.
FH8065301567313SR1X9
The Intel FH8065301567313SR1X9 microprocessor features 64-bit architecture, 1170 terminals in a grid array package, and operates at speeds up to 1330 rpm. Ideal for industrial applications requiring high processing power and temperature resilience.
MCF54455CVR200
The NXP Semiconductors MCF54455CVR200 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for industrial applications requiring high-speed processing in a compact grid array package.
R7S721021VLFP#AA1
Renesas Electronics
Renesas Electronics R7S721021VLFP#AA1 microprocessor features 8-bit data RAM, 26-bit address bus width, and 32-bit external data bus. Ideal for low power applications with a max clock frequency of 13.33 MHz. Suitable for various embedded systems requiring high-speed processing in a compact form factor.
ATSAMA5D35A-CU
Microchip Technology
ATSAMA5D35A-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 48 MHz clock frequency, and 39 DMA channels. Ideal for industrial applications, it features a low power mode, boundary scan capability, and a RISC architecture for efficient processing.
STM32MP131AAF3
STMicroelectronics
STM32MP131AAF3 by STMicroelectronics is a 32-bit microprocessor with integrated cache and 48 MHz clock frequency. It features 172032 RAM words, 56 DMA channels, and operates b/w -40 to 125 °C. Ideal for low power applications in IoT devices due to its compact size and high-speed processing capabilities.
XAM3359ZCZ
XAM3359ZCZ by Texas Instruments is a RISC microprocessor with CMOS technology. It has a peak reflow temperature of 260°C and can withstand up to 30s at this temperature. Ideal for applications requiring high processing power in compact devices.
MPC8321ECVRADDCA
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B516;
HD6417705F100BV
The Renesas Electronics HD6417705F100BV is a 32-bit RISC microprocessor with 208 terminals and operates at speeds up to 100 rpm. It has power supplies of 1.5V and 3.3V, suitable for commercial-grade applications in various industries requiring high-speed processing capabilities. The microprocessor is housed in a square-shaped flatpack package with gull wing terminals, making it ideal for surface-mount assembly processes.
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MC7448THX1267ND
The NXP Semiconductors MC7448THX1267ND microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 200 MHz, it is suitable for industrial applications requiring high-speed processing in low power mode. With a terminal pitch of 1.27 mm and ceramic-metal-sealed co-fired package body material, this processor offers reliable performance in compact designs.
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MC7455ARX1000LG
Motorola
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Bit Size: 32;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY;
MC7455ARX933LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Speed: 933 rpm;
MC7455ARX867LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Power Supplies (V): 1.3,1.5/2.5,1.8/2.5;
MC7455ARX733LG
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 483; Package Code: BGA; Package Shape: SQUARE; Low Power Mode: YES;
MC7448TVU1267ND
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
MC7448HX1400ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MC7448VU800ND
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: NO LEAD; No. of Terminals: 360; Package Code: LGA; Package Shape: SQUARE;
MC7448THX1400ND
MC7448VU1400ND
MC7448TVU1000ND
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