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MC7448THX1267ND

NXP Semiconductors

MC7448THX1267ND by NXP Semiconductors

The NXP Semiconductors MC7448THX1267ND microprocessor features a 32-bit architecture with 64-bit external data bus width and integrated cache. Operating at a max clock frequency of 200 MHz, it is suitable for industrial applications requiring high-speed processing in low power mode. With a terminal pitch of 1.27 mm and ceramic-metal-sealed co-fired package body material, this processor offers reliable performance in compact designs.

Median Price

$2,310.000

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MC7448THX1267ND by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 18,240 parts In-Stock

1+ parts

-

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1k+ parts

$2,310.000

10k+ parts

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18,240

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-

$2,310.000

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DigiKey

USA . 3,000 parts In-Stock

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3,000

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Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$1,329.810

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600

$1,329.810

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Vyrian

USA . 5,510 parts In-Stock

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5,510

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Anansix

USA . 2,001 parts In-Stock

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2,001

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Chip Stock

USA . 173 parts In-Stock

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173

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Digiode

USA . 162 parts In-Stock

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162

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Distributors (Availability)

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AZTECH Wire

Italy . 406 parts In-Stock

1+ parts

$14.666

100+ parts

-

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406

$14.666

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Semicontronic

India . 1,028 parts In-Stock

1+ parts

$22.000

100+ parts

$21.450

1k+ parts

$21.340

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1,028

$22.000

$21.450

$21.340

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Ampacity Inc.

Singapore . 576 parts In-Stock

1+ parts

$22.000

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576

$22.000

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One Stop Electronics

USA . 1,879 parts In-Stock

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$32.000

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1,879

$32.000

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Aztec Data Supply Inc.

USA . 2,704 parts In-Stock

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$46.130

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2,704

$46.130

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Modulus Dynamics

Lithuania . 3,164 parts In-Stock

1+ parts

$49.048

100+ parts

$49.048

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$49.048

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3,164

$49.048

$49.048

$49.048

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Corohmni

South Africa . 212 parts In-Stock

1+ parts

$84.166

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212

$84.166

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Continental Prestige Electronics

USA . 5,667 parts In-Stock

1+ parts

$1,329.810

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10k+ parts

$1,303.214

5,667

$1,329.810

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-

$1,303.214

Argo Parts USA

USA . 1,765 parts In-Stock

1+ parts

$1,329.810

100+ parts

$1,316.512

1k+ parts

$1,303.214

10k+ parts

$1,289.916

1,765

$1,329.810

$1,316.512

$1,303.214

$1,289.916

Netroflash

USA . 50 parts In-Stock

1+ parts

$1,329.810

100+ parts

$1,303.214

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50

$1,329.810

$1,303.214

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Lixinc

USA . 14,926 parts In-Stock

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14,926

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Futuretech Components

Singapore . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Corphita

USA . 1,767 parts In-Stock

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1,767

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UNI Independent Distributors

Spain . 853 parts In-Stock

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853

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Microchip USA

USA . 357 parts In-Stock

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357

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Overview

Unleash the power of cutting-edge technology with the MC7448THX1267ND by NXP Semiconductors. Crafted with precision and expertise, this microprocessor offers unparalleled performance and reliability for a wide range of applications. From seamless data processing to enhanced system efficiency, this innovative product guarantees top-tier results that will elevate your projects to new heights. Experience the ultimate value and benefits that only NXP Semiconductors can deliver, setting you apart from the competition in the fast-paced world of technology. Elevate your creations with the MC7448THX1267ND and unleash endless possibilities today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides durability and protection, ensuring a longer lifespan for the microprocessor.

Integrated Cache: YES

Integrated cache enhances the performance of the microprocessor by allowing for faster access to frequently used data and instructions.

Maximum Supply Voltage: 1.1 V

Operating at a maximum supply voltage of 1.1V helps in reducing power consumption and heat generation, making the microprocessor energy-efficient.

Address Bus Width: 36

With a wide address bus width of 36, the microprocessor can handle large amounts of memory addresses efficiently, resulting in improved overall performance.

Bit Size: 32

A 32-bit architecture allows the microprocessor to process data in larger chunks, enhancing its processing speed and efficiency.

Maximum Clock Frequency: 200 MHz

Operating at a maximum clock frequency of 200MHz enables the microprocessor to perform tasks quickly and efficiently, making it suitable for a range of applications.

Temperature Grade: INDUSTRIAL

Designed for industrial use, this microprocessor can withstand a wide range of temperatures, making it suitable for rugged environments and demanding applications.

Technical Specifications

Microprocessors MC7448THX1267ND attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

36

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

200 MHz

External Data Bus Width:

64

Format:

FLOATING POINT

Integrated Cache:

YES

JESD-30 Code:

S-CBGA-B360

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

360

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

BGA

Package Equivalence Code:

BGA360,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.3,1.8/2.5

Qualification:

Not Qualified

Maximum Seated Height:

2.8 mm

Speed:

1267 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.1 V

Minimum Supply Voltage:

1 V

Nominal Supply Voltage:

1.05 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MC7448THX1267ND Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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