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AM3354BZCZA80

Texas Instruments

AM3354BZCZA80 by Texas Instruments

AM3354BZCZA80 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 64 DMA channels. It operates at a max clock frequency of 26 MHz and has low power mode for industrial applications.

Median Price

$17.135

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 2,090 parts In-Stock

1+ parts

$17.135

100+ parts

$14.967

1k+ parts

$10.322

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-

2,090

$17.135

$14.967

$10.322

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DigiKey

USA . 65 parts In-Stock

1+ parts

$21.700

100+ parts

$16.283

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$14.179

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65

$21.700

$16.283

$14.179

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Chip1Stop

Japan . 126 parts In-Stock

1+ parts

-

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$12.340

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126

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$12.340

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,439 parts In-Stock

1+ parts

$13.433

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3,439

$13.433

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Nova Conductors

Japan . 300 parts In-Stock

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$13.708

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300

$13.708

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Vyrian

USA . 4,910 parts In-Stock

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4,910

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Chip Stock

USA . 3,011 parts In-Stock

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3,011

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VNN

France . 300 parts In-Stock

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300

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 630 parts In-Stock

1+ parts

$10.490

100+ parts

$10.228

1k+ parts

$10.175

10k+ parts

-

630

$10.490

$10.228

$10.175

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Ampacity Inc.

Singapore . 566 parts In-Stock

1+ parts

$10.490

100+ parts

-

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566

$10.490

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Corphita

USA . 80 parts In-Stock

1+ parts

$12.726

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80

$12.726

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Continental Prestige Electronics

USA . 1,739 parts In-Stock

1+ parts

$13.708

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-

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$13.433

1,739

$13.708

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-

$13.433

Parana Technologies

USA . 1,909 parts In-Stock

1+ parts

$18.263

100+ parts

-

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$18.396

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1,909

$18.263

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$18.396

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DigiPath Technology Company

USA . 274 parts In-Stock

1+ parts

$20.110

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274

$20.110

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ChromeModa Solutions

Germany . 6,513 parts In-Stock

1+ parts

$20.520

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$16.826

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6,513

$20.520

$16.826

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IDEA Electronic Components Group

UK . 15 parts In-Stock

1+ parts

$20.520

100+ parts

$19.494

1k+ parts

$18.468

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15

$20.520

$19.494

$18.468

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Corohmni

South Africa . 190 parts In-Stock

1+ parts

$25.762

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190

$25.762

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Lixinc

USA . 8,965 parts In-Stock

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8,965

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Argo Parts USA

USA . 3,773 parts In-Stock

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3,773

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$13.433

1k+ parts

$13.022

10k+ parts

$12.748

2,000

-

$13.433

$13.022

$12.748

Overview

Elevate your projects with the AM3354BZCZA80 by Texas Instruments, a versatile microprocessor designed to deliver top-notch performance and reliability. With a reputation for excellence, Texas Instruments offers cutting-edge technology that meets the highest industry standards. Whether you're working on industrial automation, embedded systems, or IoT applications, this microprocessor provides the power and efficiency you need to bring your ideas to life. Experience the value and benefits of Texas Instruments with the AM3354BZCZA80, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Integrated Cache: YES

Having integrated cache improves the processing speed and efficiency of the microprocessor.

Maximum Supply Voltage: 1.326 V

The high maximum supply voltage allows for a wide range of applications and flexibility in power management.

On Chip Data RAM Width: 8

A wider on-chip data RAM width enhances data processing capabilities and speed.

Address Bus Width: 28

With a wide address bus width, the microprocessor can handle large amounts of memory efficiently.

Package Shape: SQUARE

The square package shape makes it easy to mount and integrate into various electronic devices.

Bit Size: 32

A 32-bit architecture offers higher performance compared to lower bit sizes.

Power Supplies (V): 0.95/1.1

The multiple power supply options provide flexibility in voltage regulation and energy efficiency.

No. of Terminals: 324

A higher number of terminals allow for more input/output connections and features.

Package Style (Meter): GRID ARRAY, LOW PROFILE, FINE PITCH

The package style with fine pitch and low profile design enhances the overall performance and integration capabilities of the microprocessor.

Minimum Supply Voltage: 1.21 V

The low minimum supply voltage ensures efficient power consumption and reduces the risk of overheating.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature makes the microprocessor suitable for industrial applications where heat dissipation is crucial.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures ensures reliability in harsh environments.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides good conductivity and resistance to corrosion.

Terminal Position: BOTTOM

The bottom terminal position simplifies the mounting and integration process in electronic devices.

Maximum Seated Height: 1.4 mm

The low maximum seated height allows for slim and compact designs of devices using this microprocessor.

RAM Words: 131072

The high number of RAM words ensures efficient data storage and processing capabilities.

Width: 15 mm

The compact width makes the microprocessor suitable for space-constrained applications.

Boundary Scan: YES

Having boundary scan capability allows for easy testing and debugging of the microprocessor.

External Data Bus Width: 16

A wide external data bus width enables faster data transfer between the microprocessor and external components.

Maximum Clock Frequency: 26 MHz

The high maximum clock frequency enables fast processing speed and real-time data handling.

Maximum Time At Peak Reflow Temperature (s): 30

The specified time at peak reflow temperature ensures proper soldering and reliability during manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures the microprocessor can withstand manufacturing processes without damage.

Length: 15 mm

The compact length offers design flexibility and space-saving benefits in electronic devices.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable performance in extreme temperature conditions.

Peripheral IC Type: MICROPROCESSOR, RISC

The microprocessor with RISC architecture offers high performance and efficiency in data processing tasks.

Technology: CMOS

The CMOS technology used in the microprocessor provides low power consumption and high speed performance.

Terminal Form: BALL

The ball terminal form simplifies the mounting process and improves connectivity in electronic devices.

Maximum Supply Current: 400 mA

The moderate maximum supply current ensures efficient power usage and prevents overheating.

Nominal Supply Voltage: 1.26 V

The nominal supply voltage provides stable power delivery to the microprocessor for consistent performance.

No. of DMA Channels: 64

Having 64 DMA channels allows for efficient data transfer and processing in parallel, enhancing system performance.

Terminal Pitch: 0.8 mm

The small terminal pitch enables compact design and high-density PCB layouts with multiple connectivity options.

Format: FIXED POINT

The fixed-point format ensures accurate arithmetic calculations and efficient use of resources in the microprocessor.

Moisture Sensitivity Level (MSL): 3

The MSL level of 3 indicates a moderate level of moisture sensitivity, suitable for most handling and storage conditions.

Speed: 800 rpm

The specified speed rating of 800 rpm indicates efficient processing capabilities and high performance in data handling tasks.

Low Power Mode: YES

The low power mode feature allows the microprocessor to operate with reduced power consumption for energy-efficient applications.

Technical Specifications

Microprocessors AM3354BZCZA80 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

28

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

26 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B324

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

64

No. of Terminals:

324

On Chip Data RAM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA324,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

0.95/1.1

Qualification:

Not Qualified

RAM Words:

131072

Maximum Seated Height:

1.4 mm

Speed:

800 rpm

Sub-Category:

Microprocessors

Maximum Supply Current:

400 mA

Maximum Supply Voltage:

1.326 V

Minimum Supply Voltage:

1.21 V

Nominal Supply Voltage:

1.26 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

AM3354BZCZA80 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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