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MPC880CZP133

NXP Semiconductors

MPC880CZP133 by NXP Semiconductors

The NXP Semiconductors MPC880CZP133 is a 32-bit microprocessor with integrated cache and low power mode. It operates at a speed of 133 rpm, with a max supply voltage of 1.9 V. Ideal for applications requiring high performance in compact devices.

Median Price

$33.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

MPC880CZP133 by NXP Semiconductors
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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 144 parts In-Stock

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$33.060

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144

$33.060

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Distributors (In-Stock)

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Digiode

USA . 1,409 parts In-Stock

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$30.600

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1,409

$30.600

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$56.841

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50

$56.841

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Vyrian

USA . 3,070 parts In-Stock

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3,070

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Anansix

USA . 1,587 parts In-Stock

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1,587

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Legend Electronics Inc.

USA . 44 parts In-Stock

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44

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ABC Electronics Ltd.

UK . 5 parts In-Stock

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5

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ComSIT Distribution GmbH

Germany . 2 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 764 parts In-Stock

1+ parts

$19.454

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764

$19.454

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Ampacity Inc.

Singapore . 57 parts In-Stock

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$27.680

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57

$27.680

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Corphita

USA . 3,683 parts In-Stock

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$28.989

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3,683

$28.989

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Microchip USA

USA . 111 parts In-Stock

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$50.311

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111

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$55.704

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$53.476

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100

$55.704

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$53.476

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Component Stockers USA

USA . 203 parts In-Stock

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$56.030

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$56.030

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203

$56.030

$56.030

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Continental Prestige Electronics

USA . 2,468 parts In-Stock

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$56.841

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$55.704

2,468

$56.841

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$55.704

Semicontronic

India . 144 parts In-Stock

1+ parts

$60.250

100+ parts

$58.744

1k+ parts

$58.442

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144

$60.250

$58.744

$58.442

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One Stop Electronics

USA . 58 parts In-Stock

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$60.250

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58

$60.250

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Argo Parts USA

USA . 4,276 parts In-Stock

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4,276

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UNI Independent Distributors

Spain . 1,229 parts In-Stock

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Vigor

Singapore . 628 parts In-Stock

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628

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Overview

Experience unparalleled performance and efficiency with the NXP Semiconductors MPC880CZP133 Microprocessor. Known for its superior quality and cutting-edge technology, NXP Semiconductors delivers a product that exceeds expectations. Ideal for a wide range of applications, this microprocessor offers seamless integration, enhanced speed, and low power consumption. Elevate your projects with the MPC880CZP133 and discover the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the microprocessor, making it a reliable choice for long-term use.

Integrated Cache:

YES - The integrated cache enhances processing speed and efficiency, making this microprocessor suitable for demanding applications.

Surface Mount:

YES - The surface mount capability allows for easy installation and space-saving design, making it ideal for compact devices.

Maximum Supply Voltage:

1.9 V - With a high maximum supply voltage, this microprocessor can handle heavy workloads without experiencing voltage fluctuations.

Address Bus Width:

32 - The 32-bit address bus width enables efficient data transfer and access, enhancing overall performance.

Package Shape:

SQUARE - The square package shape ensures a compact and efficient design, making it suitable for devices with limited space.

Bit Size:

32 - The 32-bit architecture allows the microprocessor to process large amounts of data quickly and accurately.

Power Supplies (V):

1.8,3.3 - With multiple power supply options, this microprocessor offers versatility and compatibility with different systems.

No. of Terminals:

357 - The high number of terminals provides ample connectivity options for peripherals, making it a versatile choice for various applications.

Package Style (Meter):

GRID ARRAY - The grid array package style offers secure and reliable connections, ensuring stable performance in demanding environments.

Minimum Supply Voltage:

1.7 V - The low minimum supply voltage ensures energy efficiency and reliable operation even under low power conditions.

Terminal Finish:

TIN LEAD - The tin lead finish enhances solderability and conductivity, making it easier to integrate this microprocessor into circuitry.

Terminal Position:

BOTTOM - The bottom terminal position simplifies installation and maintenance, making it user-friendly for technicians.

Maximum Seated Height:

2.52 mm - The low maximum seated height allows for a slim and compact design, making it suitable for thin devices.

Width:

25 mm - The 25 mm width ensures compatibility with standard mounting configurations, making it easy to integrate into various systems.

Boundary Scan:

YES - The boundary scan feature offers diagnostic capabilities for debugging and testing, ensuring reliable performance in complex systems.

External Data Bus Width:

32 - The 32-bit external data bus width enables fast data transfer rates, enhancing overall system efficiency.

Maximum Time At Peak Reflow Temperature (s):

30 - With a short maximum time at peak reflow temperature, this microprocessor can withstand high temperatures without damage.

Peak Reflow Temperature °C:

245 - The high peak reflow temperature tolerance ensures durability and reliability under extreme heat conditions.

Length:

25 mm - The 25 mm length allows for easy integration into standard-sized devices, making it a versatile choice for a variety of applications.

Peripheral IC Type:

MICROPROCESSOR, RISC - The RISC architecture of this microprocessor offers efficient execution of instructions, improving overall processing speed.

Technology:

CMOS - The CMOS technology used in this microprocessor provides low power consumption and reliable performance, making it an energy-efficient choice.

Terminal Form:

BALL - The ball terminal form simplifies installation and enhances connectivity, ensuring stable operation in various environments.

Nominal Supply Voltage:

1.8 V - With a stable nominal supply voltage, this microprocessor offers consistent performance and reliability in different operating conditions.

Terminal Pitch:

1.27 mm - The 1.27 mm terminal pitch allows for easy connection to circuit boards, ensuring secure and stable integration.

Format:

FIXED POINT - The fixed-point format supports precise calculations and data processing, making it suitable for tasks that require accuracy and consistency.

Moisture Sensitivity Level (MSL):

3 - The MSL 3 rating indicates moderate moisture sensitivity, ensuring reliability in humid or damp environments.

Speed:

133 rpm - With a high speed of 133 rpm, this microprocessor can handle demanding tasks quickly and efficiently, making it suitable for high-performance applications.

Low Power Mode:

YES - The low power mode feature enables energy-saving operation, making this microprocessor a cost-effective and eco-friendly choice.

Technical Specifications

Microprocessors MPC880CZP133 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC880CZP133 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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