Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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MCIMX6QP6AVT1AB by NXP Semiconductors is a microprocessor with a max supply voltage of 1.5V and operating temperature range of -40 to 125°C. It is commonly used in automotive applications due to its CMOS technology and fine pitch grid array package style.
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Verical
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Avnet
Digiode
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Nova Conductors
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Vyrian
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Cyclops Electronics Ltd
Flip Electronics
Rebound Electronics
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Semicontronic
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Ampacity Inc.
Corphita
$91.773
Corohmni
$137.665
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$138.069
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Microchip USA
$225.750
A-Z Elektronik GmbH
Argo Parts USA
UNI Independent Distributors
Lixinc
Authorized Procurement Solutions
Kepictronics
Futuretech Components
The plastic/epoxy package body material provides durability and protection, making this microprocessor suitable for various applications.
The surface mount capability allows for easy integration of this microprocessor onto circuit boards, simplifying the assembly process.
With a high maximum supply voltage, this microprocessor offers ample power for demanding tasks, enabling efficient performance.
The square package shape makes it convenient to handle and install, ensuring compatibility with standard mounting techniques.
With a large number of terminals available, this microprocessor offers extensive connectivity options, allowing for versatile applications.
The grid array, fine pitch package style ensures precise electrical connections, increasing reliability and signal integrity.
The low minimum supply voltage allows for energy-efficient operation, reducing power consumption and extending battery life.
With a high maximum operating temperature, this microprocessor can withstand demanding environmental conditions, ensuring reliable performance in extreme applications.
The low minimum operating temperature enables this microprocessor to operate reliably even in cold environments, expanding its usability in diverse settings.
The tin silver copper terminal finish offers superior conductivity and corrosion resistance, enhancing the longevity and performance of this microprocessor.
The bottom terminal position facilitates convenient installation on circuit boards, ensuring efficient and space-saving designs.
With a low maximum seated height, this microprocessor allows for compact circuit board designs, enabling more space-efficient electronic devices.
The 21 mm width ensures compatibility with standard packaging and mounting techniques, providing ease of integration into various systems.
The microprocessor's ability to withstand higher reflow temperatures for up to 40 seconds ensures robust soldering during manufacturing, contributing to reliable performance.
The high peak reflow temperature tolerance of 260°C allows for compatible solder reflow processes, enhancing the manufacturing efficiency of this microprocessor.
With a length of 21 mm, this microprocessor is compatible with standard packaging sizes, simplifying the integration process.
Designed for automotive applications, this microprocessor can withstand the challenging temperature ranges and harsh conditions typically encountered in automotive environments.
This microprocessor uses RISC (Reduced Instruction Set Computer) architecture, providing high-performance computing capabilities for various applications.
Built using CMOS (Complementary Metal-Oxide-Semiconductor) technology, this microprocessor offers low power consumption, high speed, and improved noise immunity, making it an efficient choice.
The ball terminal form ensures reliable electrical connections, offering improved electrical performance and facilitating easier integration.
With a terminal pitch of 0.8 mm, this microprocessor allows for fine-pitched connections, making it suitable for compact and high-density circuit board designs.
The moisture sensitivity level of 3 indicates that this microprocessor requires limited exposure to moisture during handling and manufacturing, ensuring its reliability.
Microprocessors MCIMX6QP6AVT1AB attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Maximum Operating Temperature:
Minimum Operating Temperature:
Package Body Material:
Package Code:
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Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Maximum Supply Voltage:
Minimum Supply Voltage:
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Technology:
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Terminal Finish:
Terminal Form:
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Maximum Time At Peak Reflow Temperature (s):
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Peripheral IC Type:
MCIMX6QP6AVT1AB Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A992.C
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
PCN Design/Specification - MCIMX6YYY 08/May/2019 Manual Updates 14/Jul/2019
PCN Assembly/Origin - COO/Label 15-apr-2022
PCN Packaging - All Dev Label Update 15/Dec/2020 Mult Dev Pkg Seal 15/Dec/2020
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
1N4148WS
Promax-johnton
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Motorola
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Qualification: Not Qualified; Minimum Operating Temperature: -55 Cel;
08055C104KAT2A
KYOCERA AVX
08055C104KAT2A by KYOCERA AVX is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125 °C operating range, and ±10% tolerance. Ideal for SMT applications requiring compact size and reliable performance in various electronic circuits.
SS14
Frontier Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Repetitive Peak Reverse Voltage: 100 V; Config: SINGLE; No. of Phases: 1; No. of Elements: 1;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BAV99
Comchip Technology
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
American Power Devices
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Nexperia
Yangzhou Yangjie Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau-sunbank Connection Technologies
Souriau-sunbank's M39029/56351 is a CRIMP contact type backshell accessory compliant with MIL-DTL-38999. It features FEMALE gender contacts, compatible with M39029/58363 mating contacts. The insertion and removal tools required are M81969/14-10 and M22520/2-10 respectively, making it ideal for military connector applications.
BAV99-7-F
Diodes Incorporated
Diodes Inc. BAV99-7-F is a series-connected, center tap diode with 2 elements in a small outline package. It has a max reverse recovery time of 0.004 us and can handle up to 0.3A output current. Ideal for rectification applications requiring fast switching and low reverse current requirements.
LL4148GS08
Temic Semiconductors
LL4148GS08 by Temic Semiconductors is a glass diode with a max reverse recovery time of 0.008 us and max forward voltage of 1 V. It is a rectifier diode with a max output current of 0.15 A, ideal for applications requiring fast switching speeds and low power dissipation in electronic circuits.
Formosa Microsemi
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
STM32F401CDY6TR
STMicroelectronics
STM32F401CDY6TR by STMicroelectronics is a 32-bit microcontroller with 393216 ROM words, 50 MHz clock frequency, and 36 I/O lines. It is used in applications requiring high-speed processing, such as industrial automation and consumer electronics.
1N5819HW-7-F
SPC TECHNOLOGY/ MULTICOMP
BSS138
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 240;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
ATSAMA5D44B-CU
Microchip Technology
ATSAMA5D44B-CU by Microchip Technology is a 32-bit microprocessor with 131072 RAM words, 50 MHz clock frequency, and 32 DMA channels. Ideal for industrial applications, it features low power mode, floating point format, and RISC technology for efficient processing.
MCF54453CVR200
NXP Semiconductors
The NXP Semiconductors MCF54453CVR200 microprocessor features a 32-bit address and external data bus width, with integrated cache and low power mode. It operates at a max clock frequency of 66 MHz, suitable for industrial applications requiring high-speed processing in a compact square package.
MPC880CZP66
NXP Semiconductors' MPC880CZP66 is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 66.67 MHz. It features a CMOS technology and low power mode, suitable for applications requiring high-speed processing in compact devices. The package style is grid array with 357 terminals, making it ideal for surface mount assembly processes.
P1010NXE5KHA
P1010NXE5KHA by NXP Semiconductors is a microprocessor with integrated cache and surface mount capability. It has a max supply voltage of 1.05V and an address bus width of 16. This processor is commonly used in industrial applications due to its temperature grade and moisture sensitivity level.
MPC8321EVRAFDCA
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 516; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 0;
MCF5475ZP266
NXP Semiconductors' MCF5475ZP266 microprocessor features 32-bit address and external data bus width, operates at a max clock frequency of 66.66 MHz. Ideal for commercial applications requiring low power mode, this RISC-based processor has integrated cache and supports boundary scan technology.
AM3517AZERC
Texas Instruments
AM3517AZERC by Texas Instruments is a microprocessor with 16-bit address bus, 8-bit on-chip data RAM width, and integrated cache. It operates at a max clock frequency of 26 MHz and has low power mode for energy efficiency. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6S6AVM08AB
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE;
P1010NXE5HHA
The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.
TN80C188XL12
Intel
Intel TN80C188XL12 is a 16-bit microprocessor with 20-bit address bus, operating at max 25 MHz. Suitable for industrial applications, it features low power mode and supports external data bus width of 8 bits. With a package style of chip carrier and quad terminal position, it offers high performance in embedded systems.
SAM9X60D5MT-I/4FB
SAM9X60D5MT-I/4FB by Microchip Technology is a MICROPROCESSOR with 16 DMA channels, 50 MHz clock frequency, and 1.8V supply voltage. Ideal for industrial applications, it features a CMOS technology, 233 terminals in a GRID ARRAY package style, and operates b/w -40 to 85 °C temperatures.
MIMXRT1024DAG5A
NXP's MIMXRT1024DAG5A microprocessor features 32-bit architecture, 262144 RAM words, and a max clock frequency of 24 MHz. Ideal for low power applications with its integrated cache, it offers 3.6V max supply voltage and operates b/w 0-95°C.
FH8065301567313
Intel FH8065301567313 is a 64-bit microprocessor with integrated cache. It has a package shape of rectangular and surface mount capability. This industrial-grade processor operates at temperatures ranging from -40 to 110 °C, making it suitable for various applications.
MIMXRT1052DVJ6B
The NXP Semiconductors MIMXRT1052DVJ6B microprocessor features 32-bit architecture, 24 MHz clock frequency, and 105 mA supply current. Ideal for low power applications, it offers a max operating temperature of 95°C and integrated cache memory. This microprocessor is suitable for various embedded systems requiring high-speed processing in a compact form factor.
LS1020AXE7KQB
LS1020AXE7KQB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 133.3 MHz. It features a 16-bit address bus width and external data bus width of 32 bits, suitable for applications requiring low power mode and boundary scan capabilities.
MPC880CVR66
NXP Semiconductors' MPC880CVR66 microprocessor features 32-bit address and external data bus width, with integrated cache and low power mode. Ideal for RISC-based applications, it operates at a speed of 66 rpm with a max supply voltage of 1.9 V. The package style is grid array, making it suitable for various electronic devices requiring high processing power in a compact form factor.
STM32MP135DAE7
STM32MP135DAE7 by STMicroelectronics is a 32-bit microprocessor with 172032 RAM words and 48 MHz max clock frequency. Ideal for low power applications, it features 56 DMA channels and operates b/w -40 to 105 °C.
AM3356BZCZD60
AM3356BZCZD60 by Texas Instruments is a 32-bit microprocessor with 131072 RAM words, 16-bit external data bus width, and 64 DMA channels. Ideal for industrial applications requiring low power mode, it operates at a max clock frequency of 26 MHz and supports boundary scan testing.
MIMXRT1064DVJ6B
NXP Semiconductors' MIMXRT1064DVJ6B microprocessor features 32-bit architecture, 1.3V max supply voltage, and 24MHz clock frequency. Ideal for low power applications, it offers integrated cache, 1048576 RAM words, and 32 DMA channels for efficient data processing in various electronic devices.
SPC5123YVY400B
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 516; Package Code: HBGA; Package Shape: SQUARE;
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MCIMX537CVP8C2
MCIMX537CVP8C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 1.15 V max supply voltage. Ideal for automotive applications due to its RISC technology, floating-point format, and low power mode capabilities.
MCIMX535DVP1C2
MCIMX535DVP1C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words, 27 MHz clock frequency, and 529 terminals. It is ideal for applications requiring high-speed processing and low power consumption, such as embedded systems and IoT devices.
MCIMX537CVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE;
MCIMX537CVV8CR2 by NXP Semiconductors is a 32-bit microprocessor with integrated cache and 16-bit address bus width. Ideal for automotive applications, it operates at speeds up to 27 MHz with low power mode support. The package style is grid array, featuring a max supply voltage of 1.15 V and operating temperature range from -40 to 125 °C.
MCIMX537CVV8C
MCIMX537CVV8C by NXP Semiconductors is a microprocessor with 32-bit architecture, 26-bit address bus width, and integrated cache. Ideal for automotive applications, it features a max clock frequency of 27 MHz and low power mode support. With a package style of grid array and fine pitch, this processor offers compatibility with various bus interfaces like CAN, Ethernet, I2C, SPI, UART, and USB.
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 529; Package Code: FBGA; Package Shape: SQUARE; Package Style (Meter): GRID ARRAY, FINE PITCH;
MCIMX6S7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; JESD-609 Code: e1;
MCIMX6U7CVM08AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 624; Package Code: LFBGA; Package Shape: SQUARE; External Data Bus Width: 32;
MCIMX6S6AVM08AC
MCIMX6S6AVM08AC by NXP Semiconductors is a 64-bit microprocessor with 32-bit external data bus width, operating at a max clock frequency of 24 MHz. Ideal for automotive applications, it features low power mode and integrated cache, making it suitable for high-performance computing in compact spaces.
MCIMX6U5DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; JESD-30 Code: S-PBGA-B2240;
MCIMX6U5EVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Integrated Cache: YES;
MCIMX6L8DVN10AB
MICROPROCESSOR, RISC; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 576; Package Code: TFBGA; Package Shape: SQUARE;
MCIMX6U8DVM10AC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Width: 21 mm;
MCIMX536AVV8CR2
MICROPROCESSOR, RISC; Temperature Grade: AUTOMOTIVE; Terminal Form: BALL; No. of Terminals: 529; Package Code: HBGA; Package Shape: SQUARE;
MCIMX535DVP2C2
MCIMX535DVP2C2 by NXP Semiconductors is a 32-bit microprocessor with 147456 RAM words and 27 MHz clock frequency. It features a CMOS technology, 529 terminals, and operates b/w -20 to 85 °C. Ideal for applications requiring high-speed processing in compact devices.
MCIMX6U5DVM10AB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 2240; Package Code: LFBGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
MCIMX6X1CVK08AB
MICROPROCESSOR, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 400; Package Code: LFBGA; Package Shape: SQUARE;
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