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MPC860ENVR66D4

NXP Semiconductors

MPC860ENVR66D4 by NXP Semiconductors

NXP Semiconductors' MPC860ENVR66D4 microprocessor features 32-bit address and external data bus width, with a max clock frequency of 50 MHz. Suitable for low power mode applications, this RISC-based processor operates at 66 rpm speed and integrates cache memory.

Median Price

$96.500

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

MPC860ENVR66D4 by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 44 parts In-Stock

1+ parts

$73.200

100+ parts

-

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44

$73.200

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Verical

USA . 44 parts In-Stock

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$73.200

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44

$73.200

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Chip1Stop

Japan . 44 parts In-Stock

1+ parts

$96.500

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44

$96.500

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Rochester

USA . 455 parts In-Stock

1+ parts

$191.490

100+ parts

$180.000

1k+ parts

$168.510

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455

$191.490

$180.000

$168.510

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DigiKey

USA . 455 parts In-Stock

1+ parts

$239.360

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455

$239.360

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Distributors (In-Stock)

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Nova Conductors

Japan . 95 parts In-Stock

1+ parts

$24.709

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95

$24.709

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Digiode

USA . 4,820 parts In-Stock

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$69.540

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4,820

$69.540

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Anansix

USA . 1,546 parts In-Stock

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1,546

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North Shore Components

USA . 704 parts In-Stock

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704

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Bristol Electronics

USA . 396 parts In-Stock

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396

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DigiKey Marketplace

USA . 220 parts In-Stock

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220

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Vyrian

USA . 206 parts In-Stock

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206

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Sensible Micro Corp

USA . 34 parts In-Stock

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34

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Flip Electronics

USA . 33 parts In-Stock

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33

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Distributors (Availability)

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Ampacity Inc.

Singapore . 13 parts In-Stock

1+ parts

$62.220

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13

$62.220

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Corphita

USA . 1,808 parts In-Stock

1+ parts

$65.880

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1,808

$65.880

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Vigor

Singapore . 443 parts In-Stock

1+ parts

$93.770

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443

$93.770

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Component Stockers USA

USA . 95 parts In-Stock

1+ parts

$113.620

100+ parts

$166.150

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95

$113.620

$166.150

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Continental Prestige Electronics

USA . 237 parts In-Stock

1+ parts

$126.578

100+ parts

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$124.047

237

$126.578

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-

$124.047

Bastille Electronics

Australia . 28 parts In-Stock

1+ parts

$126.600

100+ parts

$120.270

1k+ parts

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10k+ parts

$112.674

28

$126.600

$120.270

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$112.674

Microchip USA

USA . 7,472 parts In-Stock

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7,472

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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UNI Independent Distributors

Spain . 1,941 parts In-Stock

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Argo Parts USA

USA . 1,436 parts In-Stock

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1,436

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Overview

Elevate your electronic devices with the MPC860ENVR66D4 microprocessor by NXP Semiconductors. With a reputation for quality and innovation, NXP Semiconductors delivers cutting-edge technology that exceeds industry standards. This powerful microprocessor is perfect for applications requiring high performance and reliability. Experience seamless operation and enhanced capabilities with the MPC860ENVR66D4, offering customers unmatched value, benefits, and advantages in a compact and efficient package. Elevate your projects to new heights with this top-of-the-line microprocessor.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and reliability for the microprocessor package, ensuring longevity and protection for the internal components.

Integrated Cache: YES

The integrated cache improves the efficiency and performance of the microprocessor by reducing the time it takes to access frequently used data.

Maximum Supply Voltage: 3.465 V

This higher maximum supply voltage allows for flexibility in power input and supports a wider range of applications without risk of damage.

Address Bus Width: 32

With a wider address bus, the microprocessor can handle larger amounts of memory and data, enhancing its processing capabilities.

Package Shape: SQUARE

The square package shape allows for efficient use of space and easy integration into various electronic devices or systems.

Bit Size: 32

A 32-bit architecture enables the microprocessor to process data in larger chunks, improving speed and efficiency of operations.

Power Supplies (V): 3.3

The standard 3.3V power supply ensures compatibility with common voltage standards and makes it easy to integrate the microprocessor into existing systems.

No. of Terminals: 357

The high number of terminals allows for connectivity to a wide range of external components or devices, expanding the functionality of the microprocessor.

Package Style (Meter): GRID ARRAY

The grid array package style offers increased thermal efficiency and better electrical performance, making it suitable for high-performance applications.

Minimum Supply Voltage: 3.135 V

The lower minimum supply voltage helps in reducing power consumption and heat generation, contributing to overall energy efficiency.

Technical Specifications

Microprocessors MPC860ENVR66D4 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

50 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e1

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

66 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

3.465 V

Minimum Supply Voltage:

3.135 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC860ENVR66D4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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