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TDA4VM88TGBALFRQ1

Texas Instruments

TDA4VM88TGBALFRQ1 by Texas Instruments

TDA4VM88TGBALFRQ1 by Texas Instruments is a microprocessor with 64-bit architecture, 32-bit external data bus width, and integrated cache. Ideal for automotive applications, it operates b/w -40 to 125°C, features boundary scan capability, and has a max clock frequency of 27 MHz.

Median Price

$128.660

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 212 parts In-Stock

1+ parts

$159.760

100+ parts

$129.420

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-

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212

$159.760

$129.420

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Mouser Electronics

USA . 467 parts In-Stock

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-

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-

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$97.560

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467

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$97.560

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,863 parts In-Stock

1+ parts

$110.836

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2,863

$110.836

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Nova Conductors

Japan . 35 parts In-Stock

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$116.423

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35

$116.423

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Vyrian

USA . 6,533 parts In-Stock

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6,533

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Distributors (Availability)

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AZTECH Wire

Italy . 821 parts In-Stock

1+ parts

$13.907

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-

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821

$13.907

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Corohmni

South Africa . 93 parts In-Stock

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$23.202

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93

$23.202

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Parana Technologies

USA . 248 parts In-Stock

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$52.166

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248

$52.166

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DigiPath Technology Company

USA . 201 parts In-Stock

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$57.441

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201

$57.441

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ChromeModa Solutions

Germany . 4,156 parts In-Stock

1+ parts

$58.613

100+ parts

$48.063

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4,156

$58.613

$48.063

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$58.613

100+ parts

$55.682

1k+ parts

$52.752

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1,668

$58.613

$55.682

$52.752

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Ampacity Inc.

Singapore . 350 parts In-Stock

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$82.930

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350

$82.930

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Semicontronic

India . 64 parts In-Stock

1+ parts

$82.930

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$80.857

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$80.442

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64

$82.930

$80.857

$80.442

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Corphita

USA . 2,459 parts In-Stock

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$105.003

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2,459

$105.003

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Continental Prestige Electronics

USA . 5,909 parts In-Stock

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$116.423

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$114.094

5,909

$116.423

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$114.094

Netroflash

USA . 2,000 parts In-Stock

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$116.423

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2,000

$116.423

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Advanced Electronics

New Zealand . 30 parts In-Stock

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$118.751

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$118.751

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$118.751

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30

$118.751

$118.751

$118.751

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Microchip USA

USA . 2,652 parts In-Stock

1+ parts

$156.720

100+ parts

$152.540

1k+ parts

$150.450

10k+ parts

$148.360

2,652

$156.720

$152.540

$150.450

$148.360

Argo Parts USA

USA . 2,690 parts In-Stock

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2,690

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Lixinc

USA . 1,996 parts In-Stock

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1,996

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Futuretech Components

Singapore . 500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 370 parts In-Stock

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370

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Computer Components Inc. - USA

USA . 250 parts In-Stock

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250

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Overview

Experience unparalleled performance and reliability with the TDA4VM88TGBALFRQ1 microprocessor by Texas Instruments. Crafted with precision and expertise, this cutting-edge device is designed to elevate your automotive applications to new heights. With integrated cache, advanced technology, and a wide range of capabilities, this microprocessor offers exceptional value and benefits to customers seeking top-notch performance and efficiency. Trust in Texas Instruments to deliver quality and innovation every step of the way.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the microprocessor lightweight and durable, ideal for portable and automotive applications.

Integrated Cache: YES

Having integrated cache improves the performance and efficiency of the microprocessor by reducing the time taken to access data, making it suitable for high-demanding computing tasks.

Maximum Supply Voltage: 0.84 V

The low maximum supply voltage of 0.84 V helps in reducing power consumption and heat generation, making the microprocessor energy-efficient and suitable for battery-powered devices.

On Chip Data RAM Width: 8

The wide on-chip data RAM width of 8 enhances the data processing capabilities of the microprocessor, enabling it to handle complex calculations and computations effectively.

No. of Terminals: 827

With a high number of terminals, the microprocessor can facilitate seamless communication with external devices and peripherals, making it versatile and suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures the reliability and stability of the microprocessor even in harsh environmental conditions, making it suitable for automotive and industrial use.

Technology: CMOS

Being based on CMOS technology, the microprocessor offers low power consumption, high speed, and excellent noise immunity, making it an efficient and reliable choice for various electronic devices.

Technical Specifications

Microprocessors TDA4VM88TGBALFRQ1 attributes and parameters. Explore more Microprocessors devices from Texas Instruments

Specs

Address Bus Width:

0

Bit Size:

64

Boundary Scan:

YES

Maximum Clock Frequency:

27 MHz

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B827

JESD-609 Code:

e1

Length:

24 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of External Interrupts:

1

No. of Serial I/Os:

26

No. of Terminals:

827

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA827,29X29,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

9961472

Screening Level:

AEC-Q100

Maximum Seated Height:

2.8 mm

Speed:

2000 rpm

Maximum Supply Voltage:

.84 V

Minimum Supply Voltage:

.76 V

Nominal Supply Voltage:

.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

24 mm

Peripheral IC Type:

Trade Compliance

TDA4VM88TGBALFRQ1 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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